JPS628510B2 - - Google Patents

Info

Publication number
JPS628510B2
JPS628510B2 JP54062069A JP6206979A JPS628510B2 JP S628510 B2 JPS628510 B2 JP S628510B2 JP 54062069 A JP54062069 A JP 54062069A JP 6206979 A JP6206979 A JP 6206979A JP S628510 B2 JPS628510 B2 JP S628510B2
Authority
JP
Japan
Prior art keywords
room
evaporation source
front door
clean room
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54062069A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55154571A (en
Inventor
Sueo Tsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP6206979A priority Critical patent/JPS55154571A/ja
Publication of JPS55154571A publication Critical patent/JPS55154571A/ja
Publication of JPS628510B2 publication Critical patent/JPS628510B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Testing Of Devices, Machine Parts, Or Other Structures Thereof (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP6206979A 1979-05-19 1979-05-19 Vacuum vapor deposition apparatus Granted JPS55154571A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6206979A JPS55154571A (en) 1979-05-19 1979-05-19 Vacuum vapor deposition apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6206979A JPS55154571A (en) 1979-05-19 1979-05-19 Vacuum vapor deposition apparatus

Publications (2)

Publication Number Publication Date
JPS55154571A JPS55154571A (en) 1980-12-02
JPS628510B2 true JPS628510B2 (enrdf_load_stackoverflow) 1987-02-23

Family

ID=13189428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6206979A Granted JPS55154571A (en) 1979-05-19 1979-05-19 Vacuum vapor deposition apparatus

Country Status (1)

Country Link
JP (1) JPS55154571A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01161262U (enrdf_load_stackoverflow) * 1989-03-23 1989-11-09

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421564U (enrdf_load_stackoverflow) * 1977-07-14 1979-02-13

Also Published As

Publication number Publication date
JPS55154571A (en) 1980-12-02

Similar Documents

Publication Publication Date Title
US5145303A (en) Method and apparatus for reducing particulate contamination in processing chambers
TW386243B (en) Processing system and method of controlling gas in processing system
US4895107A (en) Photo chemical reaction apparatus
US11404297B2 (en) Systems, apparatus, and methods for an improved load port
US6071059A (en) Loading and unloading station for semiconductor processing installations
KR100382292B1 (ko) 반도체장치의제조방법및반도체제조장치
JP3191392B2 (ja) クリーンルーム用密閉式コンテナ
JPH04504929A (ja) 基板上の層の蒸着方法及びこのための処理用システム
JP2003007800A (ja) 基板処理装置および半導体装置の製造方法
JPH054666A (ja) 通気孔を設けた半導体ウエーハ用真空カセツト
KR20080047985A (ko) 기판 처리 장치 및 반도체 장치의 제조 방법
JP2014239096A (ja) ロードポートユニット及びｅｆｅｍシステム
JPH07297257A (ja) 処理装置
CN1617297A (zh) 基板处理装置及其控制方法
US20210111050A1 (en) Substrate processing device
JP2009266962A (ja) 基板処理装置および半導体装置の製造方法
JP2005026513A (ja) 処理装置
JP2000150613A (ja) 被処理体の搬送装置
TW202008493A (zh) 基板處理裝置及半導體裝置的製造方法以及記錄媒體
JPS628510B2 (enrdf_load_stackoverflow)
JP3543995B2 (ja) 処理装置
JPH0215632B2 (enrdf_load_stackoverflow)
JP5279576B2 (ja) 基板処理装置
US20170025308A1 (en) Method of cleaning bottom of via hole and method of manufacturing semiconductor device
JP2005347667A (ja) 半導体製造装置