JPS6284575A - 光結合素子 - Google Patents

光結合素子

Info

Publication number
JPS6284575A
JPS6284575A JP60225062A JP22506285A JPS6284575A JP S6284575 A JPS6284575 A JP S6284575A JP 60225062 A JP60225062 A JP 60225062A JP 22506285 A JP22506285 A JP 22506285A JP S6284575 A JPS6284575 A JP S6284575A
Authority
JP
Japan
Prior art keywords
lead
light
optical coupling
outside
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60225062A
Other languages
English (en)
Japanese (ja)
Other versions
JPH057873B2 (cs
Inventor
Masanori Fukunaga
福永　匡則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60225062A priority Critical patent/JPS6284575A/ja
Publication of JPS6284575A publication Critical patent/JPS6284575A/ja
Publication of JPH057873B2 publication Critical patent/JPH057873B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
JP60225062A 1985-10-07 1985-10-07 光結合素子 Granted JPS6284575A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60225062A JPS6284575A (ja) 1985-10-07 1985-10-07 光結合素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60225062A JPS6284575A (ja) 1985-10-07 1985-10-07 光結合素子

Publications (2)

Publication Number Publication Date
JPS6284575A true JPS6284575A (ja) 1987-04-18
JPH057873B2 JPH057873B2 (cs) 1993-01-29

Family

ID=16823437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60225062A Granted JPS6284575A (ja) 1985-10-07 1985-10-07 光結合素子

Country Status (1)

Country Link
JP (1) JPS6284575A (cs)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60193346A (ja) * 1984-03-15 1985-10-01 Nec Corp 樹脂封止半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60193346A (ja) * 1984-03-15 1985-10-01 Nec Corp 樹脂封止半導体装置の製造方法

Also Published As

Publication number Publication date
JPH057873B2 (cs) 1993-01-29

Similar Documents

Publication Publication Date Title
JPS61228681A (ja) 光結合半導体装置
KR940007588B1 (ko) 반도체 광전변환장치
JPS6284575A (ja) 光結合素子
JPH0453001Y2 (cs)
JPS63127556A (ja) 半導体装置の製造方法
JPH0651001Y2 (ja) 光結合素子
JPH0243746A (ja) 透明樹脂でモールドした光電変換素子の製造方法
JPH0582059U (ja) 光結合装置
JPH0370913B2 (cs)
JPH03128955U (cs)
JPH0345668U (cs)
JPS62131555A (ja) 半導体集積回路装置
JPH02136343U (cs)
JPH0243774A (ja) 透明樹脂モールドの光電変換素子
JPH0416464Y2 (cs)
JPH0614562B2 (ja) 光結合装置
JPS6343459U (cs)
JPH0349403Y2 (cs)
JPS62204582A (ja) 光結合素子の製造方法
JPH01120342U (cs)
JPH01276759A (ja) イメージセンサ
JPH04132273A (ja) 半導体光結合装置
JPH04245487A (ja) 光信号モジュール
JPH0485753U (cs)
JPH0459964U (cs)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees