JPS6284186U - - Google Patents
Info
- Publication number
- JPS6284186U JPS6284186U JP17633385U JP17633385U JPS6284186U JP S6284186 U JPS6284186 U JP S6284186U JP 17633385 U JP17633385 U JP 17633385U JP 17633385 U JP17633385 U JP 17633385U JP S6284186 U JPS6284186 U JP S6284186U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- contact
- connector
- insertion hole
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 239000004831 Hot glue Substances 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Connecting Device With Holders (AREA)
Description
第1図のaは、この考案にかかるIC接続器の
1実施例の平面図、同図のbは同実施例の正面図
、同図のcは同実施例の側面図、第2図は2層構
造のテープの構造説明図、第3図は1層構造のテ
ープの構造説明図、第4図はフレームの端縁にお
ける熱圧着の説明図、第5図はこの考案にかかる
IC接続器の別の実施例の側面図である。
1…フレーム、2…コンタクト、2a…挿通孔
、3…テープ。
1a in FIG. 1 is a plan view of an embodiment of the IC connector according to this invention, b in the same figure is a front view of the embodiment, c is a side view of the embodiment, and FIG. Fig. 3 is an explanatory diagram of the structure of a tape with a two-layer structure, Fig. 4 is an explanatory diagram of the thermocompression bonding at the edge of the frame, and Fig. 5 is an IC connector according to this invention. FIG. 3 is a side view of another embodiment of the invention. 1... Frame, 2... Contact, 2a... Insertion hole, 3... Tape.
Claims (1)
片面より突出させるとともに基部端に反対面より
露出させるようにしてフレームに設けられている
IC接続器であつて、ホツトメルト型接着テープ
が前記フレームの反対面に接着されて、前記コン
タクトの挿通孔が閉じられているとともに、フレ
ームの端縁において接着テープに対し熱圧着がな
されていることを特徴とするIC接続器。 An IC connector in which a contact having an insertion hole on the base side is provided on a frame so that the tip protrudes from one side and is exposed at the base end from the opposite side, and a hot melt adhesive tape is attached to the frame. An IC connector, characterized in that the contact is adhered to the opposite side to close the insertion hole of the contact, and is thermocompression bonded to an adhesive tape at the edge of the frame.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17633385U JPS6284186U (en) | 1985-11-15 | 1985-11-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17633385U JPS6284186U (en) | 1985-11-15 | 1985-11-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6284186U true JPS6284186U (en) | 1987-05-29 |
Family
ID=31116477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17633385U Pending JPS6284186U (en) | 1985-11-15 | 1985-11-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6284186U (en) |
-
1985
- 1985-11-15 JP JP17633385U patent/JPS6284186U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6284186U (en) | ||
JPS6284185U (en) | ||
JPS5917399U (en) | Aerosol can with an opening tab | |
JPS63187329U (en) | ||
JPS6245876U (en) | ||
JPS6440176U (en) | ||
JPS5853146U (en) | integrated circuit device | |
JPS58114178U (en) | chius spout | |
JPS617546U (en) | adhesive tape | |
JPS60123775U (en) | magnetic head assembly | |
JPH0474431U (en) | ||
JPS6129217U (en) | Planar heating device | |
JPS60147647U (en) | Adhesive tape that is easy to peel off | |
JPS58144774U (en) | Bonding structure of printed circuit board | |
JPS6037612U (en) | nail | |
JPS5852699U (en) | Substrate for magnetic bubble memory module | |
JPS6067318U (en) | Removable pocket | |
JPS61194502U (en) | ||
JPS59104618U (en) | Stem for surface acoustic wave devices | |
JPS5925107U (en) | Laminated tape connection | |
JPS5892318U (en) | Apron that doubles as a napkin | |
JPS63132433U (en) | ||
JPS59135601U (en) | Slider device | |
JPS60153543U (en) | Lead frame for semiconductor devices | |
JPS60177158U (en) | Seal for fixing lower opening thread |