JPS6280339U - - Google Patents
Info
- Publication number
- JPS6280339U JPS6280339U JP1985171772U JP17177285U JPS6280339U JP S6280339 U JPS6280339 U JP S6280339U JP 1985171772 U JP1985171772 U JP 1985171772U JP 17177285 U JP17177285 U JP 17177285U JP S6280339 U JPS6280339 U JP S6280339U
- Authority
- JP
- Japan
- Prior art keywords
- cooling body
- semiconductor device
- resin layer
- resin
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 3
- 238000000465 moulding Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は本考案の別の実施例を示す断面図、第３図は
従来の絶縁型樹脂封止半導体装置の断面図である
。 １：半導体チツプ、２：金属支持体、３：モー
ルド樹脂、９：ポリイミド樹脂層。
図は本考案の別の実施例を示す断面図、第３図は
従来の絶縁型樹脂封止半導体装置の断面図である
。 １：半導体チツプ、２：金属支持体、３：モー
ルド樹脂、９：ポリイミド樹脂層。
Claims (1)
- 冷却体上に固定する際の冷却体との接触面が絶
縁性モールド樹脂により被覆されるものにおいて
、半導体チツプ支持体の少なくとも冷却体との接
触面側表面に薄いポリイミド樹脂層を備え、その
上にモールド樹脂層が被覆されたことを特徴とす
る絶縁型樹脂封止半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985171772U JPS6280339U (ja) | 1985-11-08 | 1985-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985171772U JPS6280339U (ja) | 1985-11-08 | 1985-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6280339U true JPS6280339U (ja) | 1987-05-22 |
Family
ID=31107707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985171772U Pending JPS6280339U (ja) | 1985-11-08 | 1985-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6280339U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5131175A (en) * | 1974-09-11 | 1976-03-17 | Hitachi Ltd | Handotaisochi oyobi sonoseizohoho |
-
1985
- 1985-11-08 JP JP1985171772U patent/JPS6280339U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5131175A (en) * | 1974-09-11 | 1976-03-17 | Hitachi Ltd | Handotaisochi oyobi sonoseizohoho |