JPS62781B2 - - Google Patents

Info

Publication number
JPS62781B2
JPS62781B2 JP56146133A JP14613381A JPS62781B2 JP S62781 B2 JPS62781 B2 JP S62781B2 JP 56146133 A JP56146133 A JP 56146133A JP 14613381 A JP14613381 A JP 14613381A JP S62781 B2 JPS62781 B2 JP S62781B2
Authority
JP
Japan
Prior art keywords
metal
integrated
plate
thermal expansion
composite metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56146133A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5849674A (ja
Inventor
Yasutoshi Kurihara
Yoshihiro Suzuki
Michio Oogami
Komei Yatsuno
Mitsuo Yanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56146133A priority Critical patent/JPS5849674A/ja
Publication of JPS5849674A publication Critical patent/JPS5849674A/ja
Publication of JPS62781B2 publication Critical patent/JPS62781B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56146133A 1981-09-18 1981-09-18 半導体素子搭載用基板の製造法 Granted JPS5849674A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56146133A JPS5849674A (ja) 1981-09-18 1981-09-18 半導体素子搭載用基板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56146133A JPS5849674A (ja) 1981-09-18 1981-09-18 半導体素子搭載用基板の製造法

Publications (2)

Publication Number Publication Date
JPS5849674A JPS5849674A (ja) 1983-03-23
JPS62781B2 true JPS62781B2 (cs) 1987-01-09

Family

ID=15400882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56146133A Granted JPS5849674A (ja) 1981-09-18 1981-09-18 半導体素子搭載用基板の製造法

Country Status (1)

Country Link
JP (1) JPS5849674A (cs)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112489U (ja) * 1984-06-26 1986-01-24 株式会社貝印刃物開発センター 円形刃回転式カツタ−における円形刃の回転抵抗調節構造
JPH0723983B2 (ja) * 1986-10-16 1995-03-15 ソニーマグネスケール株式会社 ホログラム基板を用いた測定方法
JPH0732219B2 (ja) * 1988-05-12 1995-04-10 三菱電機株式会社 半導体装置
JP2016006015A (ja) * 2015-09-28 2016-01-14 日立化成株式会社 はんだ接着体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729850B2 (cs) * 1972-10-13 1982-06-25

Also Published As

Publication number Publication date
JPS5849674A (ja) 1983-03-23

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