JPS6278179A - Electroless plating process for ceramic circuit substrate - Google Patents
Electroless plating process for ceramic circuit substrateInfo
- Publication number
- JPS6278179A JPS6278179A JP21744685A JP21744685A JPS6278179A JP S6278179 A JPS6278179 A JP S6278179A JP 21744685 A JP21744685 A JP 21744685A JP 21744685 A JP21744685 A JP 21744685A JP S6278179 A JPS6278179 A JP S6278179A
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- ceramic
- reaction catalyst
- catalyst metal
- ceramic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Landscapes
- Chemically Coating (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
セラミック回路基板の無電解メッキ法。 ・ｌ・
・′４
３、発明の詳細な説明 ′
１′（産業上の利用分野）
本発明は、半導体素子・９ツケージンダ用のセラミック
回路基板に導体回路を形成する際の無電解 ″メツ中
法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Electroless plating method for ceramic circuit boards.・l・
・'4 3. Detailed description of the invention'
1' (Industrial Application Field) The present invention relates to an electroless "metal filling method" for forming conductive circuits on ceramic circuit boards for semiconductor devices and conductors.
（従来の技術）
一般に、セラミック回路基板に用いられるＭｏ、
’Ｗ等の高融点金属は、半導体素子接続用の半田あ
′□るいはワイヤポンディング用のＡｕ 線、 ＡＩ！
線との 。(Prior art) Generally, Mo used for ceramic circuit boards,
' High melting point metals such as W are used as solder joints for connecting semiconductor elements.
'□ Rui is Au wire for wire bonding, AI!
With lines.
接合性に劣るため、該高融点金属表面には通常Ｎｉ −
Ａｕメッキを施す必要がある。Since the bondability is poor, Ni − is usually added to the surface of the high melting point metal.
It is necessary to perform Au plating.
このＮｉ −Ａｕメッキ方法としては電気メツキ法と無
電解メッキ法があるが、近年においては回路が複雑微細
化したため、電気メツキ用電極の接続が困難となシ、無
電解メッキ法が主に用いられている。This Ni-Au plating method includes electroplating and electroless plating, but in recent years, as circuits have become more complex and finer, it has become difficult to connect electroplating electrodes, so electroless plating is mainly used. It is being
第３図は通常行われている無電解Ｎｉメッキの工程を示
し次ものである。即ち、ＭｏあるいはＷを用いた回路形
成工程及び焼結工程を経たセラミック回路基板をアルコ
ールで脱脂して、酸・アルカリで洗浄後、無電解メッキ
の反応触媒金属イオンを含有する溶液中に浸漬（活性化
処理）し、前記Ｍ。FIG. 3 shows a commonly used electroless Ni plating process. That is, a ceramic circuit board that has undergone a circuit formation process using Mo or W and a sintering process is degreased with alcohol, washed with acid or alkali, and then immersed in a solution containing reaction catalyst metal ions for electroless plating ( activation treatment) and the above M.
あるいはＷの回路表面に例えばＰｄを吸着させ、その後
無電解Ｎｉメッキ溶液に浸し触媒反応によってＮｉメッ
キ膜を形成していた。Alternatively, for example, Pd was adsorbed onto the W circuit surface, and then immersed in an electroless Ni plating solution to form a Ni plating film through a catalytic reaction.
また、本発明と同様な効果をねらったものとして、例え
ば特開昭５９−１１２６８６号公報においては、無電解
メッキの反応触媒金属を０．０１〜１％混入混練し次タ
ングステンペーストで回路を形成し、還元雰囲気中で焼
結後、活性化処理なしに無電解メッキを施す方法が提案
されている。In addition, aiming at the same effect as the present invention, for example, in JP-A-59-112686, 0.01 to 1% of a reaction catalyst metal for electroless plating is mixed and then a circuit is formed with tungsten paste. However, a method has been proposed in which electroless plating is performed without activation treatment after sintering in a reducing atmosphere.
さらに、特公昭４６−１７０５１号公報においては、２
〜５ＸのＰｄ粉末を含有するＭｏ系（例えばＭｏ＋Ｍｎ
）ペーストを用いて基板上に導体回路を形成し、その後
活性化処理なしに無電解メッキを施す方法も示されてい
る。Furthermore, in Japanese Patent Publication No. 46-17051, 2
~5X Pd powder containing Mo system (e.g. Mo+Mn
) A method is also shown in which a conductor circuit is formed on a substrate using a paste and then electroless plating is performed without activation treatment.
（発明が解決しようとする問題点）
第３図に示した従来方法の工程図は、主要な工程のみを
記したもので、実際の作業では流水あるいは超音波によ
る洗浄を必要とし、槽の数も多くなシ、ラインス（−ス
においても処理時間においても改善すべき余地が残され
ていた。さらに、活性化処理条件によシメッ午状態か変
化すること、あるいは活性化処理後の洗浄方法によって
は、セラミック上に不必要なメッキが析出し、絶縁不良
や外観不良を生じることも問題点として指摘されている
。(Problems to be solved by the invention) The process diagram of the conventional method shown in Figure 3 shows only the main steps, and in actual work, cleaning with running water or ultrasonic waves is required, and the number of tanks is However, there is still room for improvement in terms of processing time and processing time.Furthermore, there is a possibility that the state of the water may change depending on the activation processing conditions, or that the cleaning method after the activation processing may It has also been pointed out that unnecessary plating is deposited on the ceramic, resulting in poor insulation and poor appearance.
また、ｏ、ｏｔ −ｔ％の反応触媒金属をタングステン
ペースト中に混入する方法では、微量の前記反応触媒金
属粉末を混入混練してペースト中に均一分散させること
が極めて難しく、そして、２〜５％の反応触媒金属（Ｐ
ｄ ）を導体ペースト中に含有させる方法では、セラミ
ックとの同時焼結を行うと、焼結温度の低いＰｄが多量
に含まれているため導体ペーストの焼結が促進され、導
体の剥離あるいは断線が生じ、信頼性のある回路ノ９タ
ーンを得ることは困難であった。In addition, in the method of mixing o, ot -t% of the reaction catalyst metal into the tungsten paste, it is extremely difficult to mix and knead a small amount of the reaction catalyst metal powder and uniformly disperse it in the paste. % reaction catalyst metal (P
In the method of including d) in the conductor paste, if simultaneous sintering with the ceramic is performed, the sintering of the conductor paste will be accelerated because it contains a large amount of Pd, which has a low sintering temperature, and the conductor may peel or break. Therefore, it was difficult to obtain a reliable circuit with nine turns.
本発明は上述の問題点を解決するためになされたもので
、均一で安定なメツ中秋態が得られると共に工程の簡略
化を可能とするセラミック回路基板の無電解メッキ法を
提供するものである。The present invention has been made in order to solve the above-mentioned problems, and provides an electroless plating method for ceramic circuit boards that enables uniform and stable plating conditions and simplification of the process. .
（問題点を解決するための手段）
本発明はセラミック回路基板の無電解メッキ法において
、従来方法にみられるようなペースト調整時に反応触媒
金属粉末を混入混練する方法ではなく、予めＷあるいは
Ｍｏ等の高融点金属粉末を、無電解メッキの反応触媒金
属イオンを含む溶液中に浸漬させ、前記金属粉末表面に
Ｉ Ｘ １Ｏ−４〜ｌＸｌ０−１重量％の前記反応触媒
金属を吸着させ、その後バインダーと混練することによ
って得た導体ペーストを用いることを特徴とするもので
ある。(Means for Solving the Problems) The present invention uses a method of electroless plating for ceramic circuit boards, in which a reaction catalyst metal powder is mixed and kneaded at the time of paste preparation as seen in the conventional method, but W or Mo, etc. A high melting point metal powder is immersed in a solution containing reaction catalyst metal ions for electroless plating, and IX1O-4 to lXl0-1% by weight of the reaction catalyst metal is adsorbed onto the surface of the metal powder, and then a binder is applied. It is characterized by using a conductive paste obtained by kneading with.
（作用）
本発明では反応触媒金属を高融点金属粉末表面に吸着さ
せることによυ、極微量の反応触媒金属を導体ペースト
中に均一に分散させることが可能となり、また活性化処
理を行わずに無電解メッキを施すことから、活性化処理
及び処理後の洗浄に起因する不良発生を防止することが
できる。(Function) In the present invention, by adsorbing the reaction catalyst metal onto the surface of the high melting point metal powder, it is possible to uniformly disperse a very small amount of the reaction catalyst metal into the conductor paste, and without performing any activation treatment. Since electroless plating is applied to the substrate, defects caused by activation treatment and post-treatment cleaning can be prevented.
（実施例）
以下、本発明の一実施例を図に基づいて説明する。第１
図（ａ）において、ｌは９２％アルミナセラミックのグ
リーンシート（未焼納品）であシ、２はグリーンシート
１上に印刷された導体ペーストである。該導体ペースト
２は平均粒径１，９μｍのタングステン粉末を市販のノ
やラジウム活性化液（レッドシューフ９日本カニゼン社
製）に浸漬し、Ｐｄをタングステン粉末の表面に吸着さ
せ、その後バインダーと共に混練しペーストとしたもの
である。(Example) Hereinafter, an example of the present invention will be described based on the drawings. 1st
In Figure (a), 1 is a 92% alumina ceramic green sheet (unfired product), and 2 is a conductive paste printed on the green sheet 1. The conductor paste 2 is made by immersing tungsten powder with an average particle size of 1.9 μm in a commercially available Noya radium activation solution (Red Shufu 9 manufactured by Nippon Kanizen Co., Ltd.) to adsorb Pd on the surface of the tungsten powder, and then immersing it together with a binder. It is kneaded into a paste.
次に、上記の未焼納品を湿潤還元雰囲気中（Ｎ。Next, the above-mentioned unfired delivery is placed in a humid reducing atmosphere (N.
・・・５０Ｘ、 Ｈ，・・・５０％） 、 １５５０℃
の温度で焼結し、通常のアルコール脱脂、酸・アルカリ
洗浄の後、市販の無電解ニッケルメッキ液（ＢＥＬ８０
１゜上材工業社製）にてメッキを施したところ、第１図
（ｂ）のごとく密着力が良好で膜厚の均一な無電解ニッ
ケル膜５が得られた。なお、３は焼結後のアルミナセラ
ミック、４はタングステン導体である。...50X, H, ...50%), 1550℃
After normal alcohol degreasing and acid/alkali cleaning, commercial electroless nickel plating solution (BEL80
When plating was performed using a nickel film (manufactured by Uezai Kogyo Co., Ltd.), an electroless nickel film 5 with good adhesion and uniform thickness was obtained as shown in FIG. 1(b). Note that 3 is an alumina ceramic after sintering, and 4 is a tungsten conductor.
また、第２図は本発明を適用し次無電解メッキの工程図
である。Further, FIG. 2 is a process diagram of electroless plating to which the present invention is applied.
（発明の効果）
以上のように本発明によれば、セラミック回路基板の導
体ペースト中に、セラミックと導体ペーストの同時焼結
において有害とならない程度の微量の反応触媒金属を均
一に分散混入することができ、無電解メッキ工程におい
ては活性化処理を省略することができる。これによシ活
性化処理及び処理後の洗浄に起因する不良発生を防止す
ることができ、さらに工程の簡略化によシラインスペー
スの縮少、処理時間の短縮が可能となつ九。(Effects of the Invention) As described above, according to the present invention, it is possible to uniformly disperse and mix into the conductor paste of a ceramic circuit board a small amount of reaction catalyst metal that is not harmful in simultaneous sintering of the ceramic and the conductor paste. Therefore, activation treatment can be omitted in the electroless plating process. This makes it possible to prevent the occurrence of defects due to the activation process and cleaning after the process, and furthermore, by simplifying the process, it becomes possible to reduce the cylinder space and processing time.9.
第１図（ａ）はセラミックグリーンシートの断面図、第
１図（ｂ）は焼結後のセラミックシートの断面図、第２
図は本発明の無電解メッキの工程図、第３図は従来の無
電解メッキの工程図である。
■・・・アルミナセラミックグリーンシート、２・・・
導体ペースト、３・・・焼結後のセラミック、４・・・
導体回路、５・・・ニッケルメッキ膜。Figure 1 (a) is a cross-sectional view of the ceramic green sheet, Figure 1 (b) is a cross-sectional view of the ceramic sheet after sintering, and Figure 1 (b) is a cross-sectional view of the ceramic green sheet after sintering.
The figure is a process diagram of electroless plating according to the present invention, and FIG. 3 is a process diagram of conventional electroless plating. ■・・・Alumina ceramic green sheet, 2...
Conductor paste, 3... Ceramic after sintering, 4...
Conductor circuit, 5...nickel plating film.
Claims (3)
無電解メッキの反応触媒金属を表面吸着した高融点金属
粉末を導体材料とするペー ストを用い、吹き付け法あるいは印刷法に より、未焼結セラミックシート上に回路を 形成する工程と、 ｂ）前記回路形成後のセラミックシートを還元雰囲気中
で焼結する工程と、 ｃ）前記焼結後のセラミック回路基板に無電解メッキを
施す工程とを、 順次行うことを特徴とするセラミック回路基板の無電解
メッキ法。(1) In forming a circuit on a ceramic substrate, a)
a step of forming a circuit on an unsintered ceramic sheet by a spraying method or a printing method using a paste whose conductive material is a high-melting point metal powder on which a reaction catalyst metal for electroless plating is adsorbed; b) forming the circuit; An electroless plating method for a ceramic circuit board, characterized in that a step of sintering the subsequent ceramic sheet in a reducing atmosphere; and c) a step of applying electroless plating to the sintered ceramic circuit board are performed in sequence. .
溶液中において、反応触媒金属を表面吸着したことを特
徴とする特許請求の範囲第（１）項記載のセラミック回
路基板の無電解メッキ法。(2) The electroless plating method for a ceramic circuit board according to claim (1), wherein the high melting point metal powder adsorbs a reaction catalyst metal on its surface in a solution containing reaction catalyst metal ions. .
て１×１０＾−＾４〜１×１０＾−＾１重量％としたこ
とを特徴とする特許請求の範囲第（１）項記載のセラミ
ック回路基板の無電解メッキ法。(3) Claim (1) characterized in that the amount of the reaction catalyst metal is 1 x 10^-^4 to 1 x 10^-^1% by weight based on the high melting point metal powder. Electroless plating method for ceramic circuit boards as described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21744685A JPS6278179A (en) | 1985-09-30 | 1985-09-30 | Electroless plating process for ceramic circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21744685A JPS6278179A (en) | 1985-09-30 | 1985-09-30 | Electroless plating process for ceramic circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6278179A true JPS6278179A (en) | 1987-04-10 |
Family
ID=16704363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21744685A Pending JPS6278179A (en) | 1985-09-30 | 1985-09-30 | Electroless plating process for ceramic circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6278179A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6415377A (en) * | 1987-07-07 | 1989-01-19 | Adachi Shin Sangyo Kk | Method for forming patterned plating on base material |
| JPH01224288A (en) * | 1988-03-03 | 1989-09-07 | Toshiba Corp | Plated ceramic part |
| US5227223A (en) * | 1989-12-21 | 1993-07-13 | Monsanto Company | Fabricating metal articles from printed images |
-
1985
- 1985-09-30 JP JP21744685A patent/JPS6278179A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6415377A (en) * | 1987-07-07 | 1989-01-19 | Adachi Shin Sangyo Kk | Method for forming patterned plating on base material |
| JPH01224288A (en) * | 1988-03-03 | 1989-09-07 | Toshiba Corp | Plated ceramic part |
| US5227223A (en) * | 1989-12-21 | 1993-07-13 | Monsanto Company | Fabricating metal articles from printed images |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3561240B2 (en) | Manufacturing method of wiring board | |
| JPS6278179A (en) | Electroless plating process for ceramic circuit substrate | |
| JP4154520B2 (en) | Wiring board manufacturing method | |
| JP2761262B2 (en) | Method of manufacturing thick film printed circuit board | |
| JPH0266101A (en) | Electric conductive particles and manufacture thereof | |
| JP2000285733A (en) | Manufacture of conductive powder and conductive paste and electronic component using them | |
| JP3265968B2 (en) | Electrode of glass ceramic substrate and method for forming the same | |
| JP2002084051A (en) | Metallized copper composition, low-temperature sintered ceramic wiring board, and method of manufacturing the same | |
| JPH0693307A (en) | Thick-film copper conductor paste composition capable of being plated | |
| JPS62136501A (en) | Metallized powder for ceramics and metallized paste for ceramics using said powder | |
| JPS58130590A (en) | Ceramic circuit board and thick film hybrid ic using same board | |
| JPS59112686A (en) | Ceramic circuit board | |
| JP2003105549A (en) | Circuit wiring board and method of manufacturing the same | |
| JP3771854B2 (en) | Wiring board | |
| JPH05330958A (en) | Glass composition for forming metallizing primer layer | |
| JPS60149670A (en) | Electrically conductive paste | |
| JPH07226111A (en) | Thick-film conductive paste composition capable of being plated | |
| JP3335751B2 (en) | Metallizing method for alumina substrate | |
| JPH0221669B2 (en) | ||
| JPS61271895A (en) | Making of ceramic wiring substrate | |
| JPS6396274A (en) | Selectively electroless plating method | |
| JPS6165493A (en) | Method of producing nonoxide ceramic circuit board | |
| JPH11103169A (en) | Glass ceramic wiring board | |
| JPH09293953A (en) | Method of manufacturing metallized substrate | |
| JPH02106808A (en) | Conductive paste, electronic circuit parts using same and manufacture thereof |