JPS6273800A - 多層セラミツク配線基板 - Google Patents
多層セラミツク配線基板Info
- Publication number
- JPS6273800A JPS6273800A JP21535285A JP21535285A JPS6273800A JP S6273800 A JPS6273800 A JP S6273800A JP 21535285 A JP21535285 A JP 21535285A JP 21535285 A JP21535285 A JP 21535285A JP S6273800 A JPS6273800 A JP S6273800A
- Authority
- JP
- Japan
- Prior art keywords
- carbide
- multilayer ceramic
- substrate
- ceramic
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 28
- 239000000758 substrate Substances 0.000 title description 25
- 239000004020 conductor Substances 0.000 claims description 12
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 3
- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical compound C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 claims 1
- 229910052770 Uranium Inorganic materials 0.000 claims 1
- 229910026551 ZrC Inorganic materials 0.000 claims 1
- OTCHGXYCWNXDOA-UHFFFAOYSA-N [C].[Zr] Chemical group [C].[Zr] OTCHGXYCWNXDOA-UHFFFAOYSA-N 0.000 claims 1
- WHJFNYXPKGDKBB-UHFFFAOYSA-N hafnium;methane Chemical compound C.[Hf] WHJFNYXPKGDKBB-UHFFFAOYSA-N 0.000 claims 1
- UNASZPQZIFZUSI-UHFFFAOYSA-N methylidyneniobium Chemical compound [Nb]#C UNASZPQZIFZUSI-UHFFFAOYSA-N 0.000 claims 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 229910003468 tantalcarbide Inorganic materials 0.000 claims 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000000654 additive Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21535285A JPS6273800A (ja) | 1985-09-27 | 1985-09-27 | 多層セラミツク配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21535285A JPS6273800A (ja) | 1985-09-27 | 1985-09-27 | 多層セラミツク配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6273800A true JPS6273800A (ja) | 1987-04-04 |
| JPH0415638B2 JPH0415638B2 (enrdf_load_stackoverflow) | 1992-03-18 |
Family
ID=16670874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21535285A Granted JPS6273800A (ja) | 1985-09-27 | 1985-09-27 | 多層セラミツク配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6273800A (enrdf_load_stackoverflow) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57180006A (en) * | 1981-04-30 | 1982-11-05 | Hitachi Ltd | High thermally conductive electric insulator |
| JPS6077186A (ja) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | 金属化表面を有するセラミツクス焼結体 |
| JPS6077177A (ja) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | セラミツクス接合体 |
| JPS60173900A (ja) * | 1984-02-20 | 1985-09-07 | 株式会社東芝 | セラミツクス回路基板 |
-
1985
- 1985-09-27 JP JP21535285A patent/JPS6273800A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57180006A (en) * | 1981-04-30 | 1982-11-05 | Hitachi Ltd | High thermally conductive electric insulator |
| JPS6077186A (ja) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | 金属化表面を有するセラミツクス焼結体 |
| JPS6077177A (ja) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | セラミツクス接合体 |
| JPS60173900A (ja) * | 1984-02-20 | 1985-09-07 | 株式会社東芝 | セラミツクス回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0415638B2 (enrdf_load_stackoverflow) | 1992-03-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |