JPS6272765U - - Google Patents
Info
- Publication number
- JPS6272765U JPS6272765U JP16168485U JP16168485U JPS6272765U JP S6272765 U JPS6272765 U JP S6272765U JP 16168485 U JP16168485 U JP 16168485U JP 16168485 U JP16168485 U JP 16168485U JP S6272765 U JPS6272765 U JP S6272765U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- laser
- presser
- laser focusing
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000013307 optical fiber Substances 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16168485U JPS6272765U (enrdf_load_stackoverflow) | 1985-10-22 | 1985-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16168485U JPS6272765U (enrdf_load_stackoverflow) | 1985-10-22 | 1985-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6272765U true JPS6272765U (enrdf_load_stackoverflow) | 1987-05-09 |
Family
ID=31088226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16168485U Pending JPS6272765U (enrdf_load_stackoverflow) | 1985-10-22 | 1985-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6272765U (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008152735A1 (ja) * | 2007-06-15 | 2008-12-18 | Fujitsu Limited | 表面実装部品の圧接治具及び回路基板の製造方法 |
-
1985
- 1985-10-22 JP JP16168485U patent/JPS6272765U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008152735A1 (ja) * | 2007-06-15 | 2008-12-18 | Fujitsu Limited | 表面実装部品の圧接治具及び回路基板の製造方法 |
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