BR8800682A - Aparelho de refluxo de solda e processo para soldar por refluxo de massa componentes eletricos e eletronicos - Google Patents

Aparelho de refluxo de solda e processo para soldar por refluxo de massa componentes eletricos e eletronicos

Info

Publication number
BR8800682A
BR8800682A BR8800682A BR8800682A BR8800682A BR 8800682 A BR8800682 A BR 8800682A BR 8800682 A BR8800682 A BR 8800682A BR 8800682 A BR8800682 A BR 8800682A BR 8800682 A BR8800682 A BR 8800682A
Authority
BR
Brazil
Prior art keywords
reflux
welding
electronic components
appliance
mass
Prior art date
Application number
BR8800682A
Other languages
English (en)
Inventor
Karl E Bahr
Arthur Victor Sedrick Jr
Original Assignee
Hollis Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hollis Automation Inc filed Critical Hollis Automation Inc
Publication of BR8800682A publication Critical patent/BR8800682A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
BR8800682A 1987-02-20 1988-02-19 Aparelho de refluxo de solda e processo para soldar por refluxo de massa componentes eletricos e eletronicos BR8800682A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/017,327 US4771929A (en) 1987-02-20 1987-02-20 Focused convection reflow soldering method and apparatus

Publications (1)

Publication Number Publication Date
BR8800682A true BR8800682A (pt) 1988-10-04

Family

ID=21781972

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8800682A BR8800682A (pt) 1987-02-20 1988-02-19 Aparelho de refluxo de solda e processo para soldar por refluxo de massa componentes eletricos e eletronicos

Country Status (9)

Country Link
US (1) US4771929A (pt)
EP (1) EP0279604B1 (pt)
JP (1) JPS63215371A (pt)
KR (1) KR970004026B1 (pt)
CN (1) CN88100726A (pt)
AT (1) ATE87253T1 (pt)
BR (1) BR8800682A (pt)
DE (1) DE3879529T2 (pt)
IE (1) IE880283L (pt)

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JP2002172459A (ja) * 2000-09-26 2002-06-18 Sony Corp はんだ付け装置
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US6403934B1 (en) * 2001-04-09 2002-06-11 Northrop Grumman Corporation Thermstrate reflow process
US6386422B1 (en) * 2001-05-03 2002-05-14 Asm Assembly Automation Limited Solder reflow oven
US6642485B2 (en) * 2001-12-03 2003-11-04 Visteon Global Technologies, Inc. System and method for mounting electronic components onto flexible substrates
JP3895169B2 (ja) * 2001-12-21 2007-03-22 株式会社日立製作所 鉛フリーはんだを用いたフローはんだ付け装置
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US6979348B2 (en) * 2003-06-04 2005-12-27 Medtronic Vascular, Inc. Reflowed drug-polymer coated stent and method thereof
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DE102006026948B3 (de) * 2006-06-09 2007-12-06 Rewatronik Gmbh Beheizungseinrichtung
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DE102013217952B3 (de) * 2013-09-09 2014-11-06 Ersa Gmbh Vorrichtung zur Zuführung eines Heißgasstroms
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JP6188671B2 (ja) * 2014-12-12 2017-08-30 株式会社Ｓｓテクノ 水蒸気リフロー装置及び水蒸気リフロー方法
KR20170043936A (ko) * 2015-10-14 2017-04-24 현대자동차주식회사 블랭크 가열 장치
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CN106061137A (zh) * 2016-08-16 2016-10-26 成都俱进科技有限公司 Smt贴片打样机
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Also Published As

Publication number Publication date
ATE87253T1 (de) 1993-04-15
EP0279604A2 (en) 1988-08-24
KR970004026B1 (ko) 1997-03-24
DE3879529T2 (de) 1993-08-26
EP0279604B1 (en) 1993-03-24
KR880010645A (ko) 1988-10-10
IE880283L (en) 1988-08-20
US4771929A (en) 1988-09-20
JPS63215371A (ja) 1988-09-07
DE3879529D1 (de) 1993-04-29
CN88100726A (zh) 1988-08-31
EP0279604A3 (en) 1989-08-30

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