ES2034086T3 - Horno continuo para soldar componentes electronicos. - Google Patents

Horno continuo para soldar componentes electronicos.

Info

Publication number
ES2034086T3
ES2034086T3 ES198888115396T ES88115396T ES2034086T3 ES 2034086 T3 ES2034086 T3 ES 2034086T3 ES 198888115396 T ES198888115396 T ES 198888115396T ES 88115396 T ES88115396 T ES 88115396T ES 2034086 T3 ES2034086 T3 ES 2034086T3
Authority
ES
Spain
Prior art keywords
zone
soldering
electronic components
conveyor belt
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198888115396T
Other languages
English (en)
Inventor
Norbert Mittelstadt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heraeus Quarzglas GmbH and Co KG
Original Assignee
Heraeus Quarzglas GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Quarzglas GmbH and Co KG filed Critical Heraeus Quarzglas GmbH and Co KG
Application granted granted Critical
Publication of ES2034086T3 publication Critical patent/ES2034086T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of infrared [IR]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Tunnel Furnaces (AREA)

Abstract

SE CONOCEN HORNOS CONTINUOS PARA SOLDADURA DE PIEZAS DE CONSTRUCCION ELECTRONICAS EN PLACAS CONDUCTORAS CON UNA BANDA TRANSPORTADORA, QUE MUESTRA UN ELEMENTO DE APOYO PARA LAS PLACAS CONDUCTORAS, CON LO QUE A LO LARGO DE LA BANDA TRANSPORTADORA EN LA PARTE SUPERIOR Y/O INFERIOR DE LA SUPERFICIE DE MARCHA DE LA BANDA DE RADIACION DE INFRARROJOS ESTAN COLOCADOS CON DISTANCIA, QUE AL MENOS COLOCAN UNA ZONA DE CALENTAMIENTO Y, EN DIRECCION DE LA MARCHA DE LA BANDA, DETRAS DE ESTA ZONA, UNA ZONA DE SOLDADURA. PARA FORMAR UN HORNO CONTINUO DE ESTA CLASE, DE MODO QUE LA TEMPERATURA ENTRE GRANDES Y PEQUEÑAS PIEZAS DE CONSTRUCCION A SOLDAR EN UNA PLACA CONDUCTORA, EN LA ZONA DE LA ZONA DE SOLDADURA FRENTE A LOS HORNOS ACTUALES SE APROXIMA, SE COLOCA ENTRE LA ZONA DE CALENTAMIENTO Y LA ZONA DE SOLDADURA UNA ZONA DE ENFRIAMIENTO EN LA QUE SE PRODUCE UN ENFRIAMIENTO OBLIGADO, QUE MEDIANTE UN SOPLADOR POR UNAS TOBERAS COLOCADAS EN LA ZONA DE ENFRIAMIENTO CIRCULA PERPENDICULARMENTE A LA ZONA DE LA BANDA TRANSPORTADORA.
ES198888115396T 1987-11-07 1988-09-20 Horno continuo para soldar componentes electronicos. Expired - Lifetime ES2034086T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3738136A DE3738136C1 (de) 1987-11-07 1987-11-07 Durchlaufofen zum Anloeten von elektronischen Bauteilen

Publications (1)

Publication Number Publication Date
ES2034086T3 true ES2034086T3 (es) 1993-04-01

Family

ID=6340188

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198888115396T Expired - Lifetime ES2034086T3 (es) 1987-11-07 1988-09-20 Horno continuo para soldar componentes electronicos.

Country Status (6)

Country Link
US (1) US4915624A (es)
EP (1) EP0315762B1 (es)
JP (1) JPH01138059A (es)
AT (1) ATE78739T1 (es)
DE (2) DE3738136C1 (es)
ES (1) ES2034086T3 (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3808073C2 (de) * 1988-03-11 1994-01-13 Lothar Himmelreich Infrarot-Lötofen zum Aufschmelzlöten von elektronischen Bauelementen auf Leiterplatten
DE3841447C1 (es) * 1988-12-09 1990-08-02 Heraeus Quarzschmelze Gmbh, 6450 Hanau, De
JPH0377772A (ja) * 1989-08-18 1991-04-03 Aiwa Co Ltd 赤外線加熱式リフローハンダ付け方法および赤外線加熱式リフローハンダ付け装置
DE4016366C2 (de) * 1990-05-21 1994-04-28 Siemens Nixdorf Inf Syst Verfahren und Einrichtung zum Reflow-Löten von Elektronik-Bauteilen auf eine Leiterplatte
DE4126597A1 (de) * 1991-08-10 1993-02-11 Heraeus Quarzglas Verfahren und vorrichtung zur waermebehandlung von werkstuecken mit elektrischen und elektronischen bauteilen
DE4302976A1 (de) * 1992-07-22 1994-01-27 Bosch Gmbh Robert Vorrichtung und Verfahren zum Auflöten von Bauelementen auf Platinen
US5868564A (en) * 1992-07-28 1999-02-09 International Business Machines Corporation Sequential step belt furnace with individual concentric heating elements
BE1007867A3 (nl) * 1993-12-10 1995-11-07 Koninkl Philips Electronics Nv Werkwijze voor het verwarmen van een strookvormige drager in een oven en inrichting voor het bevestigen van tenminste een component op een strookvormige drager.
US5421723A (en) * 1994-03-25 1995-06-06 International Business Machines Corporation Sequential step belt furnace with individual concentric cooling elements
DE29617213U1 (de) * 1996-10-02 1997-01-09 SMT Maschinengesellschaft mbH, 97877 Wertheim Reflowlötanlage
US6039236A (en) * 1997-06-11 2000-03-21 Soltec B.V. Reflow soldering apparatus with improved cooling
US6768083B2 (en) * 2002-09-19 2004-07-27 Speedline Technologies, Inc. Reflow soldering apparatus and method for selective infrared heating
US8728831B2 (en) * 2010-12-30 2014-05-20 Stmicroelectronics Pte. Ltd. Reconstituted wafer warpage adjustment
DE102011009693A1 (de) * 2011-01-28 2012-08-02 Centrotherm Thermal Solutions Gmbh & Co. Kg Kühlmodul und Vorrichtung zum thermischen Behandeln von Substraten
DE102011056444C5 (de) * 2011-12-14 2015-10-15 Voestalpine Metal Forming Gmbh Verfahren und Vorrichtung zum partiellen Härten von Blechbauteilen
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
CN118951217B (zh) * 2024-08-13 2025-02-14 无锡固翌智能科技有限公司 半导体器件真空焊接自动化设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2254769C3 (de) * 1972-11-09 1985-06-05 Vereinigte Aluminium-Werke AG, 1000 Berlin und 5300 Bonn Durchlaufofen zum flußmittellosen Löten von Aluminiumwerkstoffen unter Schutzgas
FR2405448B1 (fr) * 1977-10-07 1985-06-28 Welko Ind Spa Installation pour le controle de la conduite des fours a rouleaux pour la cuisson de matieres ceramiques ou similaires
JPS5897480A (ja) * 1981-12-07 1983-06-09 Matsushita Electric Ind Co Ltd パイプ材のろう付け方法
FR2536160A1 (fr) * 1982-11-17 1984-05-18 Piezo Ceram Electronique Four continu de brasure de composants electroniques
US4565917B1 (en) * 1984-01-18 1999-06-08 Vitronics Corp Multi-zone thermal process system utilizing nonfocused infared panel emitters
JPS6127485A (ja) * 1984-07-17 1986-02-06 中外炉工業株式会社 連続式雰囲気熱処理炉
JPH0828569B2 (ja) * 1985-06-18 1996-03-21 松下電器産業株式会社 リフロー装置
IT1205512B (it) * 1986-12-30 1989-03-23 Mauro Poppi Forno per la cottura di materiali ceramici quali piastrelle e simili

Also Published As

Publication number Publication date
EP0315762A3 (en) 1990-01-03
US4915624A (en) 1990-04-10
DE3873266D1 (de) 1992-09-03
DE3738136C1 (de) 1989-01-26
JPH0555226B2 (es) 1993-08-16
ATE78739T1 (de) 1992-08-15
EP0315762A2 (de) 1989-05-17
JPH01138059A (ja) 1989-05-30
EP0315762B1 (de) 1992-07-29

Similar Documents

Publication Publication Date Title
ES2034086T3 (es) Horno continuo para soldar componentes electronicos.
KR850700120A (ko) 비집속 적외선 패널 방출기를 사용하는 다구역 열처리 시스템
EP0237151B1 (en) Infrared process and apparatus for infrared soldering components on circuit boards
US4771929A (en) Focused convection reflow soldering method and apparatus
ATE131993T1 (de) Verfahren und einrichtung zum reflow-löten von elektronik-bauteilen auf eine leiterplatte
ATE24607T1 (de) Durchlaufofen zum hartloeten von elektronischen bauteilen.
SE8704303D0 (sv) Kylkropp for ett elektriskt kretskort
DE3361684D1 (en) Soldering apparatus exhaust system
MY129904A (en) Apparatus and method for soldering electronic components to printed circuit boards
JPH024781Y2 (es)
DE3571216D1 (en) Soldering machine
US3465415A (en) Methods of eliminating icicle-like formations on wave soldered connections on circuit substrates
ATE485706T1 (de) Verfahren zum löten von smd-bauteilen auf einer leiterplatte und reflow-lötofen dazu
ATE167978T1 (de) Gurtband zum bereitstellen von lotdepots zum auflöten von bauelementen auf eine leiterplatte
JPH0347340Y2 (es)
JPS6428111A (en) Chain belt for transport
SE9003359D0 (sv) Saett och anordning foer framstaellning av kretskort
JPH04339561A (ja) 自動はんだ付け装置用プリヒータ
SU1745450A1 (ru) Па льник дл сборки печатного узла
Krauss Technological Parameters of an SMD-Reflow Soldering Oven Controlled by Microcomputer
JPS63296295A (ja) チップ部品の接着剤固定用熱硬化炉
CN108495483A (zh) 滑轨托承式pcb板再流焊炉辅助传送系统
EP0513366A4 (en) Device for soldering
JPS5996796A (ja) 炉
JPS6417439A (en) Device for removing test board