SE9003359D0 - Saett och anordning foer framstaellning av kretskort - Google Patents
Saett och anordning foer framstaellning av kretskortInfo
- Publication number
- SE9003359D0 SE9003359D0 SE9003359A SE9003359A SE9003359D0 SE 9003359 D0 SE9003359 D0 SE 9003359D0 SE 9003359 A SE9003359 A SE 9003359A SE 9003359 A SE9003359 A SE 9003359A SE 9003359 D0 SE9003359 D0 SE 9003359D0
- Authority
- SE
- Sweden
- Prior art keywords
- temp
- solder
- heated
- points
- smelt
- Prior art date
Links
- 241001062472 Stokellia anisodon Species 0.000 abstract 4
- 229910000679 solder Inorganic materials 0.000 abstract 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- 230000008018 melting Effects 0.000 abstract 2
- 238000002844 melting Methods 0.000 abstract 2
- 239000007789 gas Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910001092 metal group alloy Inorganic materials 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9003359A SE9003359L (sv) | 1990-10-22 | 1990-10-22 | Saett och anordning foer framstaellning av kretskort |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9003359A SE9003359L (sv) | 1990-10-22 | 1990-10-22 | Saett och anordning foer framstaellning av kretskort |
Publications (2)
Publication Number | Publication Date |
---|---|
SE9003359D0 true SE9003359D0 (sv) | 1990-10-22 |
SE9003359L SE9003359L (sv) | 1992-04-23 |
Family
ID=20380700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9003359A SE9003359L (sv) | 1990-10-22 | 1990-10-22 | Saett och anordning foer framstaellning av kretskort |
Country Status (1)
Country | Link |
---|---|
SE (1) | SE9003359L (sv) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112020006487T5 (de) * | 2020-01-10 | 2022-12-01 | Ghsp, Inc. | Leiterplatte für Statorwicklungen mit integrierten Sicherungsstrukturen |
-
1990
- 1990-10-22 SE SE9003359A patent/SE9003359L/sv not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
SE9003359L (sv) | 1992-04-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE131993T1 (de) | Verfahren und einrichtung zum reflow-löten von elektronik-bauteilen auf eine leiterplatte | |
DE69903045T2 (de) | Eine bewegliche vorrichtung zum selektiven entfernen von brücken und verfahren zum entfernen von brücken gelöteter verbindungen auf gedruckten leiterplatten mittels einer solchen vorrichtung | |
EP0279604A3 (en) | Focused convection reflow soldering method and apparatus | |
GB1102621A (en) | Method and apparatus for fluxing and soldering connections on printed circuit boards | |
ATE270166T1 (de) | Warenträger mit einstellbaren unterstützungselementen und reflow-lötanlage mit derartigem warenträger | |
DK1233841T3 (da) | Fremgangsmåde og indretning til oprettelse af en loddeforbindelse | |
JPS54156173A (en) | Method of and apparatus for soldering component on thick film board | |
MY129904A (en) | Apparatus and method for soldering electronic components to printed circuit boards | |
EP1033197A3 (en) | Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus | |
ES2034086T3 (es) | Horno continuo para soldar componentes electronicos. | |
GB967708A (en) | Removal of unwanted alloy from a manufactured article | |
EP0209650A3 (en) | Method and apparatus for placing and electrically connecting components on a printed circuit board | |
DE58904794D1 (de) | Verfahren zum loeten eines drahtlosen bauelementes sowie leiterplatte mit angeloetetem, drahtlosem bauelement. | |
SE9003359D0 (sv) | Saett och anordning foer framstaellning av kretskort | |
JPS61289697A (ja) | リフロー装置 | |
JP2665926B2 (ja) | プリント基板のリフロー方法 | |
ATE111682T1 (de) | Verfahren und anordnung zum auflöten von oberflächenbefestigbaren bausteinen auf leiterplatten. | |
GB9118757D0 (en) | Direct infra-red rework station | |
JP2527644B2 (ja) | プリント基板の部品取付装置 | |
IES66480B2 (en) | Re-flow soldering apparatus | |
JPH028629Y2 (sv) | ||
JPH05285641A (ja) | 半田リフロー炉 | |
IE80576B1 (en) | Re-flow soldering apparatus | |
JPH04339561A (ja) | 自動はんだ付け装置用プリヒータ | |
JPS52125378A (en) | Temperature measuring method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |
Ref document number: 9003359-8 |