SE9003359D0 - SET AND DEVICE FOR PREPARING CIRCUITS - Google Patents
SET AND DEVICE FOR PREPARING CIRCUITSInfo
- Publication number
- SE9003359D0 SE9003359D0 SE9003359A SE9003359A SE9003359D0 SE 9003359 D0 SE9003359 D0 SE 9003359D0 SE 9003359 A SE9003359 A SE 9003359A SE 9003359 A SE9003359 A SE 9003359A SE 9003359 D0 SE9003359 D0 SE 9003359D0
- Authority
- SE
- Sweden
- Prior art keywords
- temp
- solder
- heated
- points
- smelt
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Pre-tinned locations are provided on the printed circuit using meltable solder, and the circuit points are heated with the respective electronic components placed in position. Heating is by means of a smelt bath, the temp. of which is not below that of the melting point of the solder. - The smelt bath uses the same metal or metal alloy as in the solder points, or a temp. stable salt which is heated to a temp. which at least slightly exceeds the melting temp. of the solder at the component points. The circuit board is pre-heated by infrared radiation before being placed above the smelt bath, and the completed circuit board is rapidly cooled after being removed from the smelt bath. Soldering takes place in a protective gas atmosphere, e.g. nitrogen.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9003359A SE9003359L (en) | 1990-10-22 | 1990-10-22 | Equipment for producing circuit board - solders electronic components by melting process at pre-tinned points on printed circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9003359A SE9003359L (en) | 1990-10-22 | 1990-10-22 | Equipment for producing circuit board - solders electronic components by melting process at pre-tinned points on printed circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
SE9003359D0 true SE9003359D0 (en) | 1990-10-22 |
SE9003359L SE9003359L (en) | 1992-04-23 |
Family
ID=20380700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9003359A SE9003359L (en) | 1990-10-22 | 1990-10-22 | Equipment for producing circuit board - solders electronic components by melting process at pre-tinned points on printed circuit |
Country Status (1)
Country | Link |
---|---|
SE (1) | SE9003359L (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023509617A (en) * | 2020-01-10 | 2023-03-09 | ジーエイチエスピー・インコーポレイテッド | Circuit board for stator windings with integral fixing structure |
-
1990
- 1990-10-22 SE SE9003359A patent/SE9003359L/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
SE9003359L (en) | 1992-04-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |
Ref document number: 9003359-8 |