ATE87253T1 - Verfahren und vorrichtung zum aufschmelzloeten mittels fokussierter konvektion. - Google Patents

Verfahren und vorrichtung zum aufschmelzloeten mittels fokussierter konvektion.

Info

Publication number
ATE87253T1
ATE87253T1 AT88301182T AT88301182T ATE87253T1 AT E87253 T1 ATE87253 T1 AT E87253T1 AT 88301182 T AT88301182 T AT 88301182T AT 88301182 T AT88301182 T AT 88301182T AT E87253 T1 ATE87253 T1 AT E87253T1
Authority
AT
Austria
Prior art keywords
focused
soldering
convection
hot air
air heating
Prior art date
Application number
AT88301182T
Other languages
English (en)
Inventor
Karl E Bahr
Arthur Victor Sedrick Jr
Original Assignee
Hollis Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hollis Automation Inc filed Critical Hollis Automation Inc
Application granted granted Critical
Publication of ATE87253T1 publication Critical patent/ATE87253T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
AT88301182T 1987-02-20 1988-02-12 Verfahren und vorrichtung zum aufschmelzloeten mittels fokussierter konvektion. ATE87253T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/017,327 US4771929A (en) 1987-02-20 1987-02-20 Focused convection reflow soldering method and apparatus
EP88301182A EP0279604B1 (de) 1987-02-20 1988-02-12 Verfahren und Vorrichtung zum Aufschmelzlöten mittels fokussierter Konvektion

Publications (1)

Publication Number Publication Date
ATE87253T1 true ATE87253T1 (de) 1993-04-15

Family

ID=21781972

Family Applications (1)

Application Number Title Priority Date Filing Date
AT88301182T ATE87253T1 (de) 1987-02-20 1988-02-12 Verfahren und vorrichtung zum aufschmelzloeten mittels fokussierter konvektion.

Country Status (9)

Country Link
US (1) US4771929A (de)
EP (1) EP0279604B1 (de)
JP (1) JPS63215371A (de)
KR (1) KR970004026B1 (de)
CN (1) CN88100726A (de)
AT (1) ATE87253T1 (de)
BR (1) BR8800682A (de)
DE (1) DE3879529T2 (de)
IE (1) IE880283L (de)

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JP3441067B2 (ja) * 2000-08-03 2003-08-25 株式会社大進工業研究所 ろう付装置
JP2002172459A (ja) * 2000-09-26 2002-06-18 Sony Corp はんだ付け装置
JP2002185122A (ja) * 2000-12-12 2002-06-28 Sharp Corp リフロー装置
US6403934B1 (en) * 2001-04-09 2002-06-11 Northrop Grumman Corporation Thermstrate reflow process
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JP3895169B2 (ja) * 2001-12-21 2007-03-22 株式会社日立製作所 鉛フリーはんだを用いたフローはんだ付け装置
US6720195B2 (en) * 2002-05-15 2004-04-13 Micron Technology, Inc. Methods employing elevated temperatures to enhance quality control in microelectronic component manufacture
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US7084353B1 (en) 2002-12-11 2006-08-01 Emc Corporation Techniques for mounting a circuit board component to a circuit board
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US6919224B2 (en) * 2003-09-30 2005-07-19 Intel Corporation Modified chip attach process and apparatus
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US7681776B2 (en) * 2006-08-01 2010-03-23 Raytheon Company Methods and apparatus for efficiently generating profiles for circuit board work/rework
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DE102008033225B3 (de) * 2008-07-15 2009-12-17 Ersa Gmbh Vorrichtung zur thermischen Behandlung von Werkstücken
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CN103286408B (zh) * 2012-02-24 2017-03-01 联想企业解决方案（新加坡）私人有限公司 一种热源系统
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JP6188671B2 (ja) * 2014-12-12 2017-08-30 株式会社Ｓｓテクノ 水蒸気リフロー装置及び水蒸気リフロー方法
KR20170043936A (ko) * 2015-10-14 2017-04-24 현대자동차주식회사 블랭크 가열 장치
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Also Published As

Publication number Publication date
BR8800682A (pt) 1988-10-04
CN88100726A (zh) 1988-08-31
EP0279604A3 (en) 1989-08-30
US4771929A (en) 1988-09-20
KR970004026B1 (ko) 1997-03-24
DE3879529T2 (de) 1993-08-26
JPS63215371A (ja) 1988-09-07
DE3879529D1 (de) 1993-04-29
EP0279604B1 (de) 1993-03-24
KR880010645A (ko) 1988-10-10
EP0279604A2 (de) 1988-08-24
IE880283L (en) 1988-08-20

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties