JPS6270564A - 金型における表面処理 - Google Patents
金型における表面処理Info
- Publication number
- JPS6270564A JPS6270564A JP21075785A JP21075785A JPS6270564A JP S6270564 A JPS6270564 A JP S6270564A JP 21075785 A JP21075785 A JP 21075785A JP 21075785 A JP21075785 A JP 21075785A JP S6270564 A JPS6270564 A JP S6270564A
- Authority
- JP
- Japan
- Prior art keywords
- metallic mold
- surface treatment
- carrying
- chemical plating
- high hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1813—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by radiant energy
- C23C18/1817—Heat
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Chemically Coating (AREA)
- Physical Vapour Deposition (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
【発明の詳細な説明】
産業上の利用分野
金属のプレス及び樹脂成形等
従来の技術
例 金型に直接又は熱処理後イオンブレーティングによ
りT i N又はSiCなどの硬度の高い被膜を付ける
。同様にCVD(Chemical Vapor
D−epos i t)により同様の被膜を得ることを
特徴とする。
りT i N又はSiCなどの硬度の高い被膜を付ける
。同様にCVD(Chemical Vapor
D−epos i t)により同様の被膜を得ることを
特徴とする。
金型に化学ニッケルめっきによりニッ
ケル′M膜を得る。化学ニッケルめっきの浴組成:硫酸
ニッケル 20g/i’次亜リン酸ナトリュウム 25
q/J!乳酸 25g/Itプロリ
オン酸 3g/9鉛
少量 温度 90℃ pH4,0〜5.0
ニッケル 20g/i’次亜リン酸ナトリュウム 25
q/J!乳酸 25g/Itプロリ
オン酸 3g/9鉛
少量 温度 90℃ pH4,0〜5.0
Claims (1)
- 【特許請求の範囲】 金属のプレス加工及び樹脂成形等におけ る金型の表面に化学めっき及び真空技術 をもちい表面を加工する。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21075785A JPS6270564A (ja) | 1985-09-24 | 1985-09-24 | 金型における表面処理 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21075785A JPS6270564A (ja) | 1985-09-24 | 1985-09-24 | 金型における表面処理 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6270564A true JPS6270564A (ja) | 1987-04-01 |
Family
ID=16594624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21075785A Pending JPS6270564A (ja) | 1985-09-24 | 1985-09-24 | 金型における表面処理 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6270564A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02294484A (ja) * | 1989-05-10 | 1990-12-05 | Dai Ichi High Frequency Co Ltd | 有機材料の金属被覆方法 |
JPH03104874A (ja) * | 1989-09-14 | 1991-05-01 | Toowa Kk | 金型面に無電解ニッケルメッキ層を構成する方法及び電子部品の樹脂封止成形用金型 |
CN112706004A (zh) * | 2020-12-22 | 2021-04-27 | 浙江金固股份有限公司 | 模具的加工方法 |
-
1985
- 1985-09-24 JP JP21075785A patent/JPS6270564A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02294484A (ja) * | 1989-05-10 | 1990-12-05 | Dai Ichi High Frequency Co Ltd | 有機材料の金属被覆方法 |
JPH03104874A (ja) * | 1989-09-14 | 1991-05-01 | Toowa Kk | 金型面に無電解ニッケルメッキ層を構成する方法及び電子部品の樹脂封止成形用金型 |
CN112706004A (zh) * | 2020-12-22 | 2021-04-27 | 浙江金固股份有限公司 | 模具的加工方法 |
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