JPS6268243U - - Google Patents
Info
- Publication number
- JPS6268243U JPS6268243U JP15934385U JP15934385U JPS6268243U JP S6268243 U JPS6268243 U JP S6268243U JP 15934385 U JP15934385 U JP 15934385U JP 15934385 U JP15934385 U JP 15934385U JP S6268243 U JPS6268243 U JP S6268243U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- lead
- die part
- die
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例を示し、バリ抜き
工程後の半導体装置を示す側面図、第２図ないし
第４図は従来の半導体装置用リードフレームを示
し、第２図は一部平面図、第３図は樹脂モールド
後の一部平面図、第４図は第３図のＡ―Ａ断面図
、第５図はバリ抜き工程後の第３図のＡ―Ａ断面
図である。
図において３はダイ部、４は支持部、５，６は
リード部、４ａ，５ａ，６ａは抜き勾配である。
なお、各図中同一符号は同一又は相当部分を示す
。
Fig. 1 shows an embodiment of this invention, a side view showing a semiconductor device after the deburring process, Figs. 2 to 4 show conventional lead frames for semiconductor devices, and Fig. 2 is a partially planar view. 3 is a partial plan view after resin molding, FIG. 4 is a sectional view taken along line AA in FIG. 3, and FIG. 5 is a sectional view taken along line AA in FIG. 3 after the deburring process. In the figure, 3 is a die part, 4 is a support part, 5 and 6 are lead parts, and 4a, 5a, and 6a are draft angles.
Note that the same reference numerals in each figure indicate the same or equivalent parts.
Claims (1)
ら延在する支持部、半導体素子の電極にワイヤー
にて接続されるリード部を有したものにおいて、
上記支持部及びリード部の側面に抜き勾配を持た
せたことを特徴とする半導体装置用フレーム。 A die part on which a semiconductor element is placed, a support part extending from the die part, and a lead part connected to an electrode of the semiconductor element by a wire,
A frame for a semiconductor device, characterized in that the supporting portion and the lead portion have a draft angle on their side surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15934385U JPS6268243U (en) | 1985-10-17 | 1985-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15934385U JPS6268243U (en) | 1985-10-17 | 1985-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6268243U true JPS6268243U (en) | 1987-04-28 |
Family
ID=31083684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15934385U Pending JPS6268243U (en) | 1985-10-17 | 1985-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6268243U (en) |
-
1985
- 1985-10-17 JP JP15934385U patent/JPS6268243U/ja active Pending