JPS6267830A - Inspection device - Google Patents

Inspection device

Info

Publication number
JPS6267830A
JPS6267830A JP60206500A JP20650085A JPS6267830A JP S6267830 A JPS6267830 A JP S6267830A JP 60206500 A JP60206500 A JP 60206500A JP 20650085 A JP20650085 A JP 20650085A JP S6267830 A JPS6267830 A JP S6267830A
Authority
JP
Japan
Prior art keywords
inspection
inspected
pellet
wire
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60206500A
Other languages
Japanese (ja)
Inventor
Yukiharu Akiyama
雪治 秋山
Isamu Yamazaki
勇 山崎
Kenji Watanabe
健二 渡辺
Shunichi Hino
俊一 日野
Yoshihiko Yamaguchi
嘉彦 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Yonezawa Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Yonezawa Electronics Co Ltd filed Critical Hitachi Ltd
Priority to JP60206500A priority Critical patent/JPS6267830A/en
Publication of JPS6267830A publication Critical patent/JPS6267830A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8593—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape
    • H01L2224/85935—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape by heating means, e.g. reflowing
    • H01L2224/85939—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape by heating means, e.g. reflowing using a laser

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve the productivity of inspecting an element to be inspected by automating the inspection by a method wherein an inspection device is composed of an inspection part for visual inspection of the element to be inspected and a destruction mechanism to destruct the element to be inspected according to the result of inspection at the inspection part. CONSTITUTION:A television camera (inspection part) provided on the rear stage of a wire bonder 4 on a carrier path 3 observes the image of a lead frame 2 wire bonded by a wire bonder 4 in the front stage and the image of a pellet 1 loaded upon the lead frame 2 for inspection. When a pellet the wire-bonded state of which is judged to be unacceptable according to the result of inspection by a controller 8 reaches the point below a laser beam irradiation mechanism 9 (destruction mechanism), the pellet 1 is destructed or a bonding wire is melted down with the specified laser beams 9a radiated from the laser beam irradiation mechanism 9.

Description

【発明の詳細な説明】 ［技術分野］ 本発明は、検査技術、特に、半導体装置の組立において
ワイヤボンディング工程の直後に行われる外観検査に適
用して有効な技術に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an inspection technique, and particularly to a technique that is effective when applied to an appearance inspection performed immediately after a wire bonding process in the assembly of semiconductor devices.

［背景技術］ たとえば、半導体装置の組立におけるワイヤボンディン
グ工程においては、所定の半導体素子が形成されたベレ
ットと該ベレットが搭載されるリードフレームとの間を
導体からなるボンディングワイヤによって電気的に接続
することが行われる。[Background Art] For example, in a wire bonding process in the assembly of semiconductor devices, a pellet on which a predetermined semiconductor element is formed and a lead frame on which the pellet is mounted are electrically connected by a bonding wire made of a conductor. things are done.

この場合、ベレットのポンディングパッドにおけるネイ
ルヘッドの圧着幅の不足や複数のボンディングワイヤ相
互間における短絡、さらにはボンディングワイヤのルー
プ形状の不良など、後に製品不良発生の原因となる種々
の外観不良を検査するためワイヤボンディングされたリ
ードフレームの目視による外観検査を実施することが考
えられる。In this case, there are various appearance defects that can later cause product defects, such as insufficient crimping width of the nail head on the bullet's bonding pad, short circuits between multiple bonding wires, and defective bonding wire loop shapes. It is conceivable to visually inspect the appearance of the wire-bonded lead frame for inspection.

そして、ボンディングワイヤ相互間の短絡などの比較的
軽度の不良の場合には、作業者が修復して再生するとと
もに、たとえばベレットのポンディングパッドにおける
ネイルヘッドの圧着幅の不足など、将来製品の致命的な
欠陥となるおそれのある不良については、作業者がボン
ディングワイヤを強制的に破壊して不良を明確にするな
どの作業が行われるものである。In the case of a relatively minor defect such as a short circuit between bonding wires, the operator can repair and regenerate the defect, while at the same time causing problems such as insufficient crimping width of the nail head on the bonding pad of a pellet, which could lead to problems in the future of the product. For defects that are likely to become permanent defects, an operator must forcibly destroy the bonding wire to clarify the defect.

しかしながら、上記のような目視による検査においては
、検査および不良個所の修復に比較的時間がかかり、さ
らに作業に熟練を要するなど、半導体装置の組立工程に
おける生産性向上の障害となっていることを本発明発明
者は見いだした。However, visual inspection as described above takes a relatively long time to inspect and repair defective parts, and requires skill to perform the work, which is an impediment to improving productivity in the semiconductor device assembly process. The inventor of the present invention has discovered.

なお、半導体装置の組立におけるワイヤボンディングに
ついて説明されている文献としては、株式会社工業調査
会、昭和５６年１１月１０日発行［電子材料Ｊ　１９８
２年別冊Ｐ１６３〜Ｐ１６８がある。A document that explains wire bonding in the assembly of semiconductor devices is Kogyo Kenkyukai Co., Ltd., published November 10, 1982 [Electronic Materials J 198
There are 2nd year special volumes P163-P168.

［発明の目的］ 本発明の目的は、生産性の良好な検査技術を提供するこ
とにある。[Object of the Invention] An object of the present invention is to provide an inspection technique with good productivity.

本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述および添付図面から明らかになるであろう
。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

［発明の概要］ 本願において開示される発明のうち代表的なものの概要
を闇単に説明すれば、つぎの通りである。[Summary of the Invention] A brief summary of typical inventions disclosed in this application is as follows.

すなわち、被検査物の外観を検査する検査部と、該検査
部における前記被検査物の検査結果に基づいて前記被検
査物を破壊する破壊機構とで検査装置を構成することに
より、被検査物の検査が自動的に行われるようにすると
ともに、たとえば、前記被検査物に不良が発見された場
合、該不良の程度にかかわらず不良の被検査物を破壊す
ることによって被検査物における不良の存在を明確化し
、後に被検査物が製品化される際に製品不良が発生され
ることを防止し、被検査物の検査における生産性を向上
させたものである。That is, by configuring an inspection device with an inspection section that inspects the appearance of the object to be inspected, and a destruction mechanism that destroys the object based on the inspection results of the object to be inspected in the inspection section, the inspection device can be inspected. For example, if a defect is found in the object to be inspected, the defect in the object to be inspected is destroyed by destroying the defective object regardless of the degree of the defect. This clarifies the existence of the test object, prevents product defects from occurring when the object to be inspected is later manufactured into a product, and improves productivity in inspecting the object to be inspected.

［実施例１コ 第１図は、本発明の一実施例である検査装置の要部を取
り出して示す説明図である。[Embodiment 1] FIG. 1 is an explanatory diagram showing the main parts of an inspection apparatus which is an embodiment of the present invention.

所定の間隔で複数のベレット１が搭載されたリードフレ
ーム２　（被検査物）は水平に設けられた搬送路３の上
に位置され、図の右方向に逐次移動されるように構成さ
れている。A lead frame 2 (object to be inspected) on which a plurality of pellets 1 are mounted at predetermined intervals is positioned on a horizontally provided conveyance path 3 and is configured to be successively moved to the right in the figure. .

前記搬送路３の上手には、ワイヤボンダ４が設けられ、
たとえばボンディングワイヤ５が挿通されベレット１の
ポンディングパッド（図示せず）とリードフレーム２の
ボンディング部位との間を逐次移動されるように構成さ
れたキャピラリ６などのボンディング工具によって、ベ
レット１とリードフレーム２との間が複数のボンディン
グワイヤ５によって電気的に接続される構造とされてい
る。A wire bonder 4 is provided above the conveyance path 3,
For example, a bonding tool such as a capillary 6, through which a bonding wire 5 is inserted, is configured to be sequentially moved between a bonding pad (not shown) of the pellet 1 and a bonding site of the lead frame 2. The frame 2 is electrically connected to the frame 2 by a plurality of bonding wires 5.

この場合、搬送路３において前記ワイヤボンダ４の後段
には、テレビカメラ７　（検査部）が設けられており、
前段のワイヤボンダ４においてワイヤボンディングされ
たリードフレーム２および該リードフレーム２に搭載さ
れたベレット１の像が観察され検査されるように構成さ
れている。In this case, a television camera 7 (inspection section) is provided downstream of the wire bonder 4 in the conveyance path 3.
The image of the lead frame 2 wire-bonded by the wire bonder 4 in the previous stage and the pellet 1 mounted on the lead frame 2 is observed and inspected.

そして、前記テレビカメラ７において得られたリードフ
レーム２および該リードフレーム２に搭載されたベレッ
ト１、さらにはベレット１とリードフレーム２との間を
電気的に接続する複数のボンディングワイヤ５などの画
像は制御部８に伝達される構造とされている。Images of the lead frame 2, the pellet 1 mounted on the lead frame 2, and a plurality of bonding wires 5 electrically connecting the pellet 1 and the lead frame 2 obtained by the television camera 7 are then taken. is configured to be transmitted to the control section 8.

さらに、制御部８においては、前記テレビカメラ７にお
いて得られた画像に基づいて、たとえばペレッ）１にお
けるボンディングワイヤ５の圧着部分、すなわちネイル
ヘッド（図示せず）のポンディングパッドに対する圧着
幅やベレット１とリードフレーム２とを電気的に接続す
る複数のボンディングワイヤ５相互間の短絡の有無、さ
らにはボンディングワイヤ５のループ形状などのワイヤ
ボンディング状態の可否が判定され、この制御部８にお
ける判定結果に基づいて、前記テレビカメラ７の後段に
設けられたレーザ光線照射機構９　（破壊機構）の直下
にワイヤボンディング状態が不可と判定されたベレット
１が到達された時、レーザ光線照射機構９から照射され
る所定のレーザ光線９ａによってベレット１が破壊され
たリボンディングワイヤ５が溶断されるように構成され
ている。Further, the control unit 8 determines, based on the image obtained by the television camera 7, the crimping portion of the bonding wire 5 on the pellet 1, that is, the crimping width with respect to the bonding pad of the nail head (not shown), the pellet It is determined whether there is a short circuit between the plurality of bonding wires 5 electrically connecting the bonding wires 1 and the lead frame 2, and whether or not the wire bonding state such as the loop shape of the bonding wires 5 is possible is determined. Based on this, when the pellet 1, which has been determined to be in a wire bonding state, reaches directly below the laser beam irradiation mechanism 9 (destruction mechanism) provided at the rear of the television camera 7, the laser beam irradiation mechanism 9 irradiates it. The rebonding wire 5 whose pellet 1 has been destroyed is fused and cut by a predetermined laser beam 9a.

以下、本実施例の作用について説明する。The operation of this embodiment will be explained below.

始めに、所定の間隔でベレット１が搭載されたリードフ
レーム２が搬送路３の上を図の左側から右方向に順次移
動され、ワイヤポンダ４においてベレット１と該ベレッ
ト１が搭載されるリードフレーム２との間が複数のボン
ディングワイヤ５によって電気的に接続される。First, the lead frame 2 on which the pellets 1 are mounted at predetermined intervals is sequentially moved on the conveyance path 3 from the left side of the figure to the right direction, and the wire ponder 4 moves the lead frame 2 on which the pellets 1 and the pellets 1 are mounted. are electrically connected by a plurality of bonding wires 5.

そして、ワイヤボンディングされたベレット１はリード
フレーム２とともに後段のテレビカメラ７の直下の位置
に移動され、テレビカメラ７によって得られた画像に基
づいてワイヤボンディング状態の可否が判別され、ワイ
ヤボンディング状態が不可と判定されたベレット１がリ
ードフレーム２の移動によってレーザ光線照射機構９の
直下の位置に到達された時、レーザ光線照射機構９から
放射されるレーザ光線９によるベレット１の破壊やボン
ディングワイヤ５の溶断が行われ、後の出荷前製品検査
などにおける電気的に検査において不良が明確に判定さ
れる状態とされる。The wire-bonded pellet 1 is then moved together with the lead frame 2 to a position immediately below the TV camera 7 at the rear stage, and based on the image obtained by the TV camera 7, it is determined whether the wire bonding state is possible or not. When the lead frame 2 moves and the pellet 1 determined to be unsuitable reaches the position directly below the laser beam irradiation mechanism 9, the bullet 1 is destroyed by the laser beam 9 emitted from the laser beam irradiation mechanism 9 and the bonding wire 5 is damaged. The fuse is cut out, and the product is in a state where it can be clearly determined that the product is defective in electrical inspections such as pre-shipment product inspections.

このように、リードフレーム２に搭載されたベレット１
と該リードフレーム２とのワイヤボンディング状態が、
自動的に検査されるため、たとえば目視などによる検査
に比較して単位時間内に検査されるリードフレーム２の
数量が増大されボンディング状態の検査における生産性
が向上されるとともに、さらに、ワイヤボンディング状
態が不良なベレット１においては、ベレット１やボンデ
。In this way, the pellet 1 mounted on the lead frame 2
The wire bonding state between the lead frame 2 and the lead frame 2 is as follows.
Since the inspection is performed automatically, the number of lead frames 2 inspected per unit time is increased compared to, for example, visual inspection, which improves the productivity in inspecting the bonding state. In case of bad Beret 1, Beret 1 or Bonde.

イングワイヤ５が確実に破壊されることによって不良の
存在が明確化され、後の出荷前製品検査工程などにおけ
る電気的な検査において不良品が明確に判定され、潜在
的な製品不良の発生が防止される。By reliably destroying the Ingwire 5, the existence of a defect is clarified, and a defective product is clearly determined in the subsequent electrical inspection during the pre-shipment product inspection process, thereby preventing the occurrence of potential product defects. be done.

［実施例２］ 第２図は、本発明の他の実施例である検査装置の要部を
取り出して示す説明図である。[Embodiment 2] FIG. 2 is an explanatory diagram showing the main parts of an inspection apparatus according to another embodiment of the present invention.

本実施例２においては、前記実施例１におけるレーザ光
線照射機構９の代わりにボンディングワイヤ切断機構９
ｂ（破壊機構）が設けられているところが前記実施例１
と異なり、他は同様である。In the second embodiment, a bonding wire cutting mechanism 9 is used instead of the laser beam irradiation mechanism 9 in the first embodiment.
b (destruction mechanism) is provided in Example 1 above.
, but the rest are the same.

すなわち、本実施例２においては、前段のテレビカメラ
７および制御部８においてボンディング状態が不良と判
定されたベレット１と該ベレット１が搭載されたリード
フレーム２との間を電気的に接続するボンディングワイ
ヤ５をボンディングワイヤ切断機構９ｂによって確実に
切断し、後の出荷前製品検査工程などにおける電気的な
検査において不良が明確に判定されるようにしたもので
ある。That is, in the second embodiment, bonding is performed to electrically connect the pellet 1 whose bonding state has been determined to be poor by the television camera 7 and the control unit 8 in the preceding stage and the lead frame 2 on which the pellet 1 is mounted. The wire 5 is reliably cut by the bonding wire cutting mechanism 9b, so that defects can be clearly determined in the subsequent electrical inspection in the pre-shipment product inspection process.

［実施例３］ 第３図は、本発明のさらに他の実施例である検査装置の
要部を取り出して示す説明図である。[Embodiment 3] FIG. 3 is an explanatory diagram showing the main parts of an inspection apparatus which is still another embodiment of the present invention.

本実施例３においては、前記実施例１におけるレーザ光
線照射機構９に代えて打撃機構９Ｃが設けられていると
ころが前記実施例１の場合と異なる。The third embodiment differs from the first embodiment in that a striking mechanism 9C is provided in place of the laser beam irradiation mechanism 9 in the first embodiment.

すなわち、本実施例３においては、前段のテレビカメラ
７および制御部８においてボンディング状態が不良と判
定されたベレット１を打１［ｆｆ１９Ｃによって確実に
破壊し、後の出荷前製品検査工程などにおける電気的な
検査において不良が明確に判定されるようにしたもので
ある。In other words, in the third embodiment, the bullet 1 whose bonding condition is determined to be defective by the television camera 7 and the control unit 8 in the previous stage is reliably destroyed by the blow 1 This ensures that defects can be clearly determined during regular inspections.

［効果］ （１）、被検査物の外観を検査する検査部と、該検査部
における前記被検査物の検査結果に基づいて前記被検査
物を破壊する破壊機構とで検査装置が構成されているた
め、被検査物の検査が自動的に行われ、目視などによる
検査に比較して単位時間内に検査される被検査物の数量
を増加させることができるとともに、たとえば前記被検
査物に不良が発見された場合、該不良の程度にかかわら
ず不良な被検査物を確実に破壊することによって被検査
物における不良の存在が明確化され、後の工程において
被検査物が製品化される際に製品不良が発生されること
が防止でき、被検査物の検査における生産性を向上させ
ることができる。[Effects] (1) An inspection device is configured with an inspection section that inspects the appearance of the object to be inspected, and a destruction mechanism that destroys the object to be inspected based on the inspection result of the object to be inspected in the inspection section. Therefore, the inspection of the inspected object is automatically performed, and the number of inspected objects inspected within a unit time can be increased compared to visual inspection. If a defect is discovered, the existence of the defect in the inspected object is clarified by surely destroying the defective inspected object regardless of the degree of the defect, and when the inspected object is turned into a product in a later process. Therefore, it is possible to prevent product defects from occurring, and it is possible to improve productivity in inspecting objects to be inspected.

（２）、前記（１１の結果、半導体装置の製造における
生産性が向上される。(2) As a result of (11) above, productivity in manufacturing semiconductor devices is improved.

以上本発明者によってなされた発明を実施例に基づき具
体的に説明したが、本発明は前記実施例に限定されるも
のではなく、その要旨を逸脱しない範囲で種々変更可能
であることはいうまでもない。Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

たとえば、検査部と破壊機構を同一部位に設けることも
可能である。For example, it is also possible to provide the inspection section and the destruction mechanism at the same location.

［利用分野］ 以上の説明では主として本発明者によってなされた発明
をその背景となった利用分野である半導体装置の組立に
おける検査技術に適用した場合について説明したが、そ
れに限定されるものではなく、効率良く外観検査を行う
ことが必要とされる技術に広（適用できる。[Field of Application] In the above explanation, the invention made by the present inventor was mainly applied to the inspection technology in the assembly of semiconductor devices, which is the background field of application, but the present invention is not limited to this. Can be widely applied to technologies that require efficient visual inspection.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本発明の一実施例である検査装置の要部を取
り出して示す説明図、 第２図は、本発明の他の実施例である検査装置の要部を
取り出して示す説明図、 第３図は、本発明のさらに他の実施例である検査装置の
要部を取り出して示す説明図である。 １・・・ベレット、２・・・リードフレーム（被検査物
）、３・・・搬送路、４・・・ワイヤボンダ、５・・・
ボンディングワイヤ、６・・・キャピラリ、７・・・テ
レビカメラ（検査部）、８・・・制御部、９・・・レー
ザ光線照射機構（破壊機構）、９ａ・・・レーザ光線、
９ｂ・・・ボンディングワイヤ切断機構（破壊機構）、
９Ｃ・・・打撃機構（破壊機構）。 第　　１　　図FIG. 1 is an explanatory diagram showing the main parts of an inspection device that is an embodiment of the present invention. FIG. 2 is an explanatory diagram that shows the main parts of an inspection device that is another embodiment of the invention. , FIG. 3 is an explanatory diagram showing the main parts of an inspection apparatus which is still another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Bellet, 2...Lead frame (tested object), 3...Transport path, 4...Wire bonder, 5...
Bonding wire, 6... Capillary, 7... Television camera (inspection section), 8... Control section, 9... Laser beam irradiation mechanism (destruction mechanism), 9a... Laser beam,
9b... bonding wire cutting mechanism (destruction mechanism),
9C: Impact mechanism (destruction mechanism). Figure 1

Claims (1)

【特許請求の範囲】 １、被検査物の外観を検査する検査部と、該検査部にお
ける前記被検査物の検査結果に基づいて前記被検査物を
破壊する破壊機構とからなることを特徴とする検査装置
。 ２、前記検査部において前記被検査物の不良が検知され
る時、該不良の程度にかかわらず、前記破壊機構による
前記被検査物の破壊が行われることを特徴とする特許請
求の範囲第１項記載の検査装置。 ３、前記被検査物が、所定の半導体素子が形成されたペ
レットが搭載され該ペレットとの間がボンディングワイ
ヤによって電気的に接続されたリードフレームであり、
前記破壊機構が、レーザ光線を照射することによって前
記ペレットおよび前記ボンディングワイヤの少なくとも
一方を破壊するレーザ光線照射機構であることを特徴と
する特許請求の範囲第１項記載の検査装置。 ４、前記被検査物が、所定の半導体素子が形成されたペ
レットが搭載され該ペレットとの間がボンディングワイ
ヤによって電気的に接続されたリードフレームであり、
前記破壊機構が前記ボンディングワイヤを切断するボン
ディングワイヤ切断機構であることを特徴とする特許請
求の範囲第１項記載の検査装置。 ５、前記被検査物が、所定の半導体素子が形成されたペ
レットが搭載され該ペレットとの間がボンディングワイ
ヤによって電気的に接続されたリードフレームであり、
前記破壊機構が打撃力を作用させることによって前記ペ
レットおよび前記ボンディングワイヤの少なくとも一方
を破壊する打撃機構であることを特徴とする特許請求の
範囲第１項記載の検査装置。[Scope of Claims] 1. It is characterized by comprising an inspection section that inspects the appearance of the object to be inspected, and a destruction mechanism that destroys the object to be inspected based on the inspection result of the object to be inspected in the inspection section. Inspection equipment. 2. When a defect in the object to be inspected is detected in the inspection section, the object to be inspected is destroyed by the destruction mechanism regardless of the degree of the defect. Inspection equipment described in section. 3. The object to be inspected is a lead frame on which a pellet on which a predetermined semiconductor element is formed is mounted and electrically connected to the pellet by a bonding wire,
2. The inspection apparatus according to claim 1, wherein the destruction mechanism is a laser beam irradiation mechanism that destroys at least one of the pellet and the bonding wire by irradiating it with a laser beam. 4. The object to be inspected is a lead frame on which a pellet on which a predetermined semiconductor element is formed is mounted and electrically connected to the pellet by a bonding wire,
2. The inspection device according to claim 1, wherein the breaking mechanism is a bonding wire cutting mechanism that cuts the bonding wire. 5. The object to be inspected is a lead frame on which a pellet on which a predetermined semiconductor element is formed is mounted and electrically connected to the pellet by a bonding wire,
2. The inspection device according to claim 1, wherein the destruction mechanism is a striking mechanism that destroys at least one of the pellet and the bonding wire by applying a striking force.
JP60206500A 1985-09-20 1985-09-20 Inspection device Pending JPS6267830A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60206500A JPS6267830A (en) 1985-09-20 1985-09-20 Inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60206500A JPS6267830A (en) 1985-09-20 1985-09-20 Inspection device

Publications (1)

Publication Number Publication Date
JPS6267830A true JPS6267830A (en) 1987-03-27

Family

ID=16524396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60206500A Pending JPS6267830A (en) 1985-09-20 1985-09-20 Inspection device

Country Status (1)

Country Link
JP (1) JPS6267830A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02105550A (en) * 1988-10-14 1990-04-18 Nec Corp Manufacturing device of semiconductor device
KR100390728B1 (en) * 2001-06-05 2003-07-12 성우전자 주식회사 Rework Method For The Lead Frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02105550A (en) * 1988-10-14 1990-04-18 Nec Corp Manufacturing device of semiconductor device
KR100390728B1 (en) * 2001-06-05 2003-07-12 성우전자 주식회사 Rework Method For The Lead Frame

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