JPS626705Y2 - - Google Patents
Info
- Publication number
- JPS626705Y2 JPS626705Y2 JP1979102900U JP10290079U JPS626705Y2 JP S626705 Y2 JPS626705 Y2 JP S626705Y2 JP 1979102900 U JP1979102900 U JP 1979102900U JP 10290079 U JP10290079 U JP 10290079U JP S626705 Y2 JPS626705 Y2 JP S626705Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin
- receiving element
- recess
- light receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 239000013307 optical fiber Substances 0.000 description 8
- 238000000465 moulding Methods 0.000 description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
【考案の詳細な説明】
本考案は光通信もしくは光表示のために使用す
る受光装置における受光素子とオプテイカルフア
イバー等の光導伝部材とを効果的に連設させた受
光装置における光導伝部材の取付構造に関するも
のである。[Detailed description of the invention] The present invention is a light-receiving device used for optical communication or optical display, in which a light-receiving element and a light-conducting member such as an optical fiber are effectively connected. This relates to the mounting structure.
この種の光導伝部材が連設された受光装置とし
ては、台座とケースとを用いたものが知られてい
る。この公知の構造は、台座に一対のフレームを
取付け、該フレームの先端を上方に突出させると
共に、その先端に受光素子をボンデイングして取
付け、ケースにはオプテイカルフアイバーの端部
を貫通状態に連結させ、該オプテイカルフアイバ
ーの端部が受光素子に対面するように台座に対し
て被着固定したものであつて、フレームもしくは
台座に対してハンドリングにより受光素子のチツ
プをボンデイングするので、チツプとオプテイカ
ルフアイバーの軸合せが不正確になるばかりでな
く、調整しながらの組立てに時間がかかりコスト
高になる。又、チツプとオプテイカルフアイバー
との間隙が空間としてそのまま残つており、光が
拡散し受光効率が悪く、これを樹脂で埋める場合
に、距離合せ等の作業もあつて、ワイヤーオープ
ンになる等の事故が起り易いと云う種々の欠点を
有する。 As a light-receiving device in which a light-conducting member of this type is connected, one that uses a base and a case is known. In this known structure, a pair of frames are attached to a pedestal, the tips of the frames are made to protrude upward, and a light receiving element is bonded and attached to the tips of the frames, and the end of an optical fiber is connected to the case in a penetrating state. The end of the optical fiber is attached and fixed to the pedestal so that it faces the light receiving element, and since the chip of the light receiving element is bonded to the frame or the pedestal by handling, the chip and the optical fiber are bonded to the frame or the pedestal by handling. Not only does the alignment of the fiber fibers become inaccurate, but it also takes time to assemble while making adjustments, which increases costs. In addition, the gap between the chip and the optical fiber remains as a space, which causes light to diffuse, resulting in poor light reception efficiency.When filling this gap with resin, it is necessary to adjust the distance, resulting in problems such as wires becoming open. It has various disadvantages such as being prone to accidents.
本考案はこのような欠点を除去するためになさ
れたものであつて、その目的は組立て時の調整が
不要であると共に受光効率が高い受光装置におけ
る光導伝部材の取付構造を提供しようとするもの
である。 The present invention has been made to eliminate these drawbacks, and its purpose is to provide a mounting structure for a photoconductive member in a light receiving device that does not require adjustment during assembly and has high light receiving efficiency. It is.
この目的を達成するためになされた本考案は、
一対のフレームの端部に受光素子とワイヤーとを
ボンデイングし、これらを樹脂にてモールドした
受光装置において、受光素子が位置する直上の部
分のモールド樹脂に凹部を形成し、該凹部にコー
ド状の光導伝部材の端部を挿着し、透明な樹脂に
て固定したことを特徴とする受光装置における光
導伝部材の取付構造であつて、予めフレームに対
して受光素子及びワイヤーをボンデイングしたも
のをモールドするのであるが、このモールドに際
して光導伝部材を挿着するための凹部を形成し、
この凹部と受光素子との位置関係を設定すれば、
受光素子と光導伝部材との位置合せが設計の段階
で機械的に行われているため、組立てが簡単で作
業性が良く、しかも樹脂によつて接合しているた
め受光効率が高くなるのである。 The present invention was developed to achieve this purpose.
In a light-receiving device in which a light-receiving element and a wire are bonded to the ends of a pair of frames and these are molded with resin, a recess is formed in the molded resin directly above where the light-receiving element is located, and a cord-shaped wire is inserted into the recess. A mounting structure for a light conducting member in a light receiving device, characterized in that the end of the light conducting member is inserted and fixed with a transparent resin, and the light receiving element and wire are bonded to the frame in advance. During this molding, a recessed portion for inserting the photoconductive member is formed,
By setting the positional relationship between this recess and the light receiving element,
Because the alignment of the light-receiving element and the light-conducting member is done mechanically at the design stage, assembly is simple and workable, and since they are bonded using resin, light-receiving efficiency is high. .
次に本考案を図示の実施例により更に詳しく説
明すると、１は受光装置全体を示すものであり、
該受光装置は、二本のフレーム２，３を平行に位
置させ、該フレームの先端に受光素子チツプ４及
びワイヤー５をボンデイングして短絡させ、エポ
キシ樹脂等のモールド樹脂６により適宜の形状に
モールドして形成する。このモールドに際し、受
光素子チツプ４が受光を効果的に行える位置、即
ち受光素子チツプの直上に位置する部分に凹部７
を予め形成しておき、この凹部７にオプテイカル
フアイバー等からなる光導伝部材８の端部を挿着
し、この挿着端部と凹部との間はモールド材及び
オプテイカルフアイバーと屈折率の近い接合用の
エポキシ樹脂９により接合させて一体化を図つて
いるのである。更にモールド樹脂に対し外部から
の迷光が問題になるようであれば、外周面を遮光
したオプテイカルフアイバーを使用したり、或は
モールド樹脂の外周面を遮光するように遮光性の
樹脂や塗料を塗布すれば良い。 Next, the present invention will be explained in more detail with reference to illustrated embodiments. 1 shows the entire light receiving device;
The light receiving device is constructed by arranging two frames 2 and 3 in parallel, bonding a light receiving element chip 4 and a wire 5 to the tips of the frames to short-circuit them, and molding them into an appropriate shape with a molding resin 6 such as epoxy resin. and form it. At the time of this molding, a recess 7 is formed in a position where the light receiving element chip 4 can effectively receive light, that is, a portion located directly above the light receiving element chip.
is formed in advance, and the end of a photoconductive member 8 made of an optical fiber or the like is inserted into this recess 7, and between the inserted end and the recess there is a gap between the molding material and the optical fiber, and the refractive index. They are joined together using epoxy resin 9 for close joining to achieve integration. Furthermore, if stray light from the outside to the mold resin becomes a problem, use optical fiber that blocks light on the outer circumferential surface, or apply light-blocking resin or paint to block light on the outer circumferential surface of the mold resin. Just apply it.
この受光装置の製造に当つては、第３図に示し
たように、予めメス型１１に受光装置を形成する
所定形状の複数個の穴１２を設けておき、この穴
内には底部から突出した凹部７の形成用突部が設
けられている。そしてこの穴に対応して嵌り込む
ようにフレーム２，３が対をなし基部で接合して
複数個設けられており、これを支持蓋１３に支持
させると共に、フレーム２，３には前記したよう
に夫々受光素子チツプ４とワイヤー５とをボンデ
イングしておき、メス型の各穴１２内にエポキシ
樹脂等のモールド樹脂６を注入し、受光素子とワ
イヤーとがボンデイングされたフレームの先端を
穴内に差込み埋設状態にしてモールド硬化させ
る。この場合設計の段階でフレームの長さ、穴の
深さ及びメス型１１と支持蓋１３との係合位置合
せ等を設定さえすれば機械的に位置合せができる
ことになる。尚図中符号１４はガイド突起、１５
はガイド溝である。 In manufacturing this light-receiving device, as shown in FIG. A protrusion for forming the recess 7 is provided. A plurality of frames 2 and 3 are provided in pairs and joined at the base so as to fit into these holes, and these are supported by the support lid 13, and the frames 2 and 3 are fitted as described above. A photodetector chip 4 and a wire 5 are bonded to each other, a molding resin 6 such as epoxy resin is injected into each hole 12 of the female mold, and the tip of the frame to which the photodetector and wire are bonded is inserted into the hole. Insert and embed the mold to harden. In this case, mechanical alignment can be achieved by setting the length of the frame, the depth of the hole, the engagement position between the female die 11 and the support lid 13, etc. at the design stage. In addition, the reference numeral 14 in the figure is a guide protrusion, and 15
is the guide groove.
以上説明したように本考案に係る光導伝部材の
取付構造は、モールド樹脂の形成時、即ちモール
ド時にモールド樹脂自体に凹部を形成しておき、
この凹部にモールド樹脂と屈折率が近い樹脂で光
導伝部材を接合させるだけであるため、位置合せ
等の面倒な作業が全く不要となり、組立ての作業
性が極めて大となり量産性に富み安価になるばか
りでなく、調整作業が全く省けるためにワイヤー
オープン事故が解消し、信頼性に富むと共に受光
素子チツプと光導伝部材との軸が一致し、光の損
失が少なく受光効率の高い受光装置が得られると
云う優れた効果を奏するのである。 As explained above, in the mounting structure of the photoconductive member according to the present invention, a recess is formed in the mold resin itself at the time of forming the mold resin, that is, at the time of molding.
Since the photoconductive member is simply bonded to this recess using a resin whose refractive index is close to that of the mold resin, troublesome work such as positioning is completely unnecessary, and the workability of assembly is extremely high, making mass production easier and cheaper. Not only that, the wire open accident is eliminated because adjustment work is completely omitted, and the light receiving device is highly reliable, and the axes of the light receiving element chip and the photoconducting member are aligned, resulting in a light receiving device with low light loss and high light receiving efficiency. It has an excellent effect.
第１図は本考案に係る発光ダイオードと光導伝
部材とを分離して示した斜視図、第２図は完成状
態における発光ダイオードの断面図、第３図は同
発光ダイオードを製造するための装置の略図的斜
視図である。
１……受光装置、２，３……フレーム、４……
受光素子チツプ、５……ワイヤー、６……モール
ド樹脂、７……凹部、８……光導伝部材、９……
接合用樹脂、１１……メス型、１２……穴、１３
……支持蓋。
Fig. 1 is a perspective view showing a light emitting diode and a photoconductive member separated according to the present invention, Fig. 2 is a sectional view of the light emitting diode in a completed state, and Fig. 3 is an apparatus for manufacturing the light emitting diode. FIG. 1... Light receiving device, 2, 3... Frame, 4...
Light receiving element chip, 5... wire, 6... mold resin, 7... recess, 8... photoconductive member, 9...
Bonding resin, 11... Female type, 12... Hole, 13
...Support lid.
Claims (1)
をボンデイングし、これらを樹脂にてモールドし
た受光装置において、受光素子が位置する直上の
部分のモールド樹脂に凹部を形成し、該凹部にコ
ード状の光導伝部材の端部を挿着し、透明な樹脂
にて固定したことを特徴とする受光装置における
光導伝部材の取付構造。 In a light-receiving device in which a light-receiving element and a wire are bonded to the ends of a pair of frames and these are molded with resin, a recess is formed in the molded resin directly above where the light-receiving element is located, and a cord-shaped wire is inserted into the recess. A mounting structure for a photoconductive member in a light receiving device, characterized in that an end portion of the photoconductive member is inserted and fixed with a transparent resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979102900U JPS626705Y2 (en) | 1979-07-25 | 1979-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979102900U JPS626705Y2 (en) | 1979-07-25 | 1979-07-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5621465U JPS5621465U (en) | 1981-02-25 |
| JPS626705Y2 true JPS626705Y2 (en) | 1987-02-16 |
Family
ID=29335612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979102900U Expired JPS626705Y2 (en) | 1979-07-25 | 1979-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS626705Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234456Y2 (en) * | 1980-03-03 | 1987-09-02 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5333436A (en) * | 1976-09-09 | 1978-03-29 | Toshiba Corp | Alloy for high frequency induction heating vessel |
| JPS5337585U (en) * | 1976-09-06 | 1978-04-01 | ||
| JPS5487079A (en) * | 1977-12-05 | 1979-07-11 | Western Electric Co | Photovoltaic luminous element |
-
1979
- 1979-07-25 JP JP1979102900U patent/JPS626705Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5337585U (en) * | 1976-09-06 | 1978-04-01 | ||
| JPS5333436A (en) * | 1976-09-09 | 1978-03-29 | Toshiba Corp | Alloy for high frequency induction heating vessel |
| JPS5487079A (en) * | 1977-12-05 | 1979-07-11 | Western Electric Co | Photovoltaic luminous element |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5621465U (en) | 1981-02-25 |
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