JPS5621465U - - Google Patents
Info
- Publication number
- JPS5621465U JPS5621465U JP10290079U JP10290079U JPS5621465U JP S5621465 U JPS5621465 U JP S5621465U JP 10290079 U JP10290079 U JP 10290079U JP 10290079 U JP10290079 U JP 10290079U JP S5621465 U JPS5621465 U JP S5621465U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1979102900U JPS626705Y2 (en) | 1979-07-25 | 1979-07-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1979102900U JPS626705Y2 (en) | 1979-07-25 | 1979-07-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5621465U true JPS5621465U (en) | 1981-02-25 |
JPS626705Y2 JPS626705Y2 (en) | 1987-02-16 |
Family
ID=29335612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1979102900U Expired JPS626705Y2 (en) | 1979-07-25 | 1979-07-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS626705Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56129759U (en) * | 1980-03-03 | 1981-10-02 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5333436A (en) * | 1976-09-09 | 1978-03-29 | Toshiba Corp | Alloy for high frequency induction heating vessel |
JPS5337585U (en) * | 1976-09-06 | 1978-04-01 | ||
JPS5487079A (en) * | 1977-12-05 | 1979-07-11 | Western Electric Co | Photovoltaic luminous element |
-
1979
- 1979-07-25 JP JP1979102900U patent/JPS626705Y2/ja not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5337585U (en) * | 1976-09-06 | 1978-04-01 | ||
JPS5333436A (en) * | 1976-09-09 | 1978-03-29 | Toshiba Corp | Alloy for high frequency induction heating vessel |
JPS5487079A (en) * | 1977-12-05 | 1979-07-11 | Western Electric Co | Photovoltaic luminous element |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56129759U (en) * | 1980-03-03 | 1981-10-02 |
Also Published As
Publication number | Publication date |
---|---|
JPS626705Y2 (en) | 1987-02-16 |