JPS56129759U - - Google Patents
Info
- Publication number
- JPS56129759U JPS56129759U JP2615980U JP2615980U JPS56129759U JP S56129759 U JPS56129759 U JP S56129759U JP 2615980 U JP2615980 U JP 2615980U JP 2615980 U JP2615980 U JP 2615980U JP S56129759 U JPS56129759 U JP S56129759U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980026159U JPS6234456Y2 (en) | 1980-03-03 | 1980-03-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980026159U JPS6234456Y2 (en) | 1980-03-03 | 1980-03-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56129759U true JPS56129759U (en) | 1981-10-02 |
| JPS6234456Y2 JPS6234456Y2 (en) | 1987-09-02 |
Family
ID=29622165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980026159U Expired JPS6234456Y2 (en) | 1980-03-03 | 1980-03-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6234456Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014196263A1 (en) * | 2013-06-07 | 2014-12-11 | 株式会社村田製作所 | Optical component, optical plug, optical connector, and optical-component production method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5394193A (en) * | 1977-01-27 | 1978-08-17 | Electric Power Res Inst | Optical electronic semiconductor unit |
| JPS5621465U (en) * | 1979-07-25 | 1981-02-25 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5621465B2 (en) * | 1972-03-07 | 1981-05-19 |
-
1980
- 1980-03-03 JP JP1980026159U patent/JPS6234456Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5394193A (en) * | 1977-01-27 | 1978-08-17 | Electric Power Res Inst | Optical electronic semiconductor unit |
| JPS5621465U (en) * | 1979-07-25 | 1981-02-25 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014196263A1 (en) * | 2013-06-07 | 2014-12-11 | 株式会社村田製作所 | Optical component, optical plug, optical connector, and optical-component production method |
| JP5892292B2 (en) * | 2013-06-07 | 2016-03-23 | 株式会社村田製作所 | Optical plug and optical connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6234456Y2 (en) | 1987-09-02 |