JPS6263944U - - Google Patents
Info
- Publication number
- JPS6263944U JPS6263944U JP1985155853U JP15585385U JPS6263944U JP S6263944 U JPS6263944 U JP S6263944U JP 1985155853 U JP1985155853 U JP 1985155853U JP 15585385 U JP15585385 U JP 15585385U JP S6263944 U JPS6263944 U JP S6263944U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation fin
- semiconductor device
- resin
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985155853U JPS6263944U (sv) | 1985-10-11 | 1985-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985155853U JPS6263944U (sv) | 1985-10-11 | 1985-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6263944U true JPS6263944U (sv) | 1987-04-21 |
Family
ID=31076926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985155853U Pending JPS6263944U (sv) | 1985-10-11 | 1985-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6263944U (sv) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6415958A (en) * | 1987-07-10 | 1989-01-19 | Hitachi Ltd | Resin-encapsulated semiconductor device |
| JPH04162550A (ja) * | 1990-10-26 | 1992-06-08 | Nec Corp | 樹脂封止型半導体装置およびその製造方法 |
-
1985
- 1985-10-11 JP JP1985155853U patent/JPS6263944U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6415958A (en) * | 1987-07-10 | 1989-01-19 | Hitachi Ltd | Resin-encapsulated semiconductor device |
| JPH04162550A (ja) * | 1990-10-26 | 1992-06-08 | Nec Corp | 樹脂封止型半導体装置およびその製造方法 |