JPS62128636U - - Google Patents
Info
- Publication number
- JPS62128636U JPS62128636U JP1588686U JP1588686U JPS62128636U JP S62128636 U JPS62128636 U JP S62128636U JP 1588686 U JP1588686 U JP 1588686U JP 1588686 U JP1588686 U JP 1588686U JP S62128636 U JPS62128636 U JP S62128636U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- heat dissipation
- sealed
- molded
- electrode lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1588686U JPS62128636U (sv) | 1986-02-04 | 1986-02-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1588686U JPS62128636U (sv) | 1986-02-04 | 1986-02-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62128636U true JPS62128636U (sv) | 1987-08-14 |
Family
ID=30807232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1588686U Pending JPS62128636U (sv) | 1986-02-04 | 1986-02-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62128636U (sv) |
-
1986
- 1986-02-04 JP JP1588686U patent/JPS62128636U/ja active Pending