JPS61207036U - - Google Patents
Info
- Publication number
- JPS61207036U JPS61207036U JP9324985U JP9324985U JPS61207036U JP S61207036 U JPS61207036 U JP S61207036U JP 9324985 U JP9324985 U JP 9324985U JP 9324985 U JP9324985 U JP 9324985U JP S61207036 U JPS61207036 U JP S61207036U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation fin
- bonded
- heat
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000001721 transfer moulding Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9324985U JPS61207036U (sv) | 1985-06-18 | 1985-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9324985U JPS61207036U (sv) | 1985-06-18 | 1985-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61207036U true JPS61207036U (sv) | 1986-12-27 |
Family
ID=30650758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9324985U Pending JPS61207036U (sv) | 1985-06-18 | 1985-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61207036U (sv) |
-
1985
- 1985-06-18 JP JP9324985U patent/JPS61207036U/ja active Pending