JPS6450442U - - Google Patents
Info
- Publication number
- JPS6450442U JPS6450442U JP14687287U JP14687287U JPS6450442U JP S6450442 U JPS6450442 U JP S6450442U JP 14687287 U JP14687287 U JP 14687287U JP 14687287 U JP14687287 U JP 14687287U JP S6450442 U JPS6450442 U JP S6450442U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- heat dissipation
- utility
- plate shape
- disposed inside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000008188 pellet Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14687287U JPS6450442U (sv) | 1987-09-25 | 1987-09-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14687287U JPS6450442U (sv) | 1987-09-25 | 1987-09-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6450442U true JPS6450442U (sv) | 1989-03-29 |
Family
ID=31416759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14687287U Pending JPS6450442U (sv) | 1987-09-25 | 1987-09-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6450442U (sv) |
-
1987
- 1987-09-25 JP JP14687287U patent/JPS6450442U/ja active Pending