JPH03104753U - - Google Patents
Info
- Publication number
- JPH03104753U JPH03104753U JP1433990U JP1433990U JPH03104753U JP H03104753 U JPH03104753 U JP H03104753U JP 1433990 U JP1433990 U JP 1433990U JP 1433990 U JP1433990 U JP 1433990U JP H03104753 U JPH03104753 U JP H03104753U
- Authority
- JP
- Japan
- Prior art keywords
- mounting part
- element mounting
- lead frame
- frame
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1433990U JPH03104753U (sv) | 1990-02-15 | 1990-02-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1433990U JPH03104753U (sv) | 1990-02-15 | 1990-02-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03104753U true JPH03104753U (sv) | 1991-10-30 |
Family
ID=31517710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1433990U Pending JPH03104753U (sv) | 1990-02-15 | 1990-02-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03104753U (sv) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019021684A (ja) * | 2017-07-12 | 2019-02-07 | 株式会社東芝 | 半導体パッケージ |
-
1990
- 1990-02-15 JP JP1433990U patent/JPH03104753U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019021684A (ja) * | 2017-07-12 | 2019-02-07 | 株式会社東芝 | 半導体パッケージ |