JPS6262441U - - Google Patents

Info

Publication number
JPS6262441U
JPS6262441U JP1985154035U JP15403585U JPS6262441U JP S6262441 U JPS6262441 U JP S6262441U JP 1985154035 U JP1985154035 U JP 1985154035U JP 15403585 U JP15403585 U JP 15403585U JP S6262441 U JPS6262441 U JP S6262441U
Authority
JP
Japan
Prior art keywords
arm
bonding
swinging
bonding arm
moving coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985154035U
Other languages
English (en)
Other versions
JPH0238449Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985154035U priority Critical patent/JPH0238449Y2/ja
Publication of JPS6262441U publication Critical patent/JPS6262441U/ja
Application granted granted Critical
Publication of JPH0238449Y2 publication Critical patent/JPH0238449Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す正面図、第２
図は第１図装置の第１のムービングコイル装置の
動作部を示す正面図、第３図は第２図の側面図、
第４図は第１図のＡ―Ａ断面図、第５図はボンデ
イングの作用説明図であり、そのうち同図ａはボ
ンデイングツールが金ボールを介してＩＣペレツ
トに当接した状態を示す説明図、同図ｂはＩＣペ
レツトのボンデイングが完了した状態を示す説明
図、第６図は従来の装置を示す正面図である。 １……ボンデイングアーム、２……フレーム、
２ａ……支持板、３……ピン、４……ボンデイン
グツール、５……ボンデイングワイヤ、６……カ
ム、７……従動ローラ、８……ロツド、９……バ
ネ、１０……中心、１１……ＩＣペレツト、１２
……ＸＹテーブル、１３……揺動アーム、１４…
…第２のコイル、１５……第２のマグネツト、１
６……第２のアーム、１７……第２のムービング
コイル装置、１８……クランプ、１９……軸、２
０……ロール、２１……調整ねじ、２２……位置
変位センサ、２３……対向片、２４……第１のア
ーム、２５……第１のマグネツト、２６……ガイ
ド板、２７……往復フレーム、２８……第１のコ
イル、２９……係合バー、３０……リニアエンコ
ーダ、３１……当接板、３２……スケール検出部
、３３……リニアスケール、３４……取付アーム
、３５……第１のムービングコイル装置、３６…
…金ボール。

Claims (1)

    【実用新案登録請求の範囲】
  1. 先端部にボンデイングツールを備え揺動自在に
    軸支されたボンデイングアームを揺動駆動するボ
    ンデイングアームの揺動装置において、移動位置
    および移動速度が制御可能な第１のムービングコ
    イル装置によつて往復駆動される往復フレームと
    、往復フレームの往復動にガタ付きなく係合従動
    して揺動する揺動アームと、ボンデイングアーム
    を揺動アームの揺動に付勢追従させる第２のムー
    ビングコイル装置とを有することを特徴とするボ
    ンデイングアームの揺動装置。
JP1985154035U 1985-10-08 1985-10-08 Expired JPH0238449Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985154035U JPH0238449Y2 (ja) 1985-10-08 1985-10-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985154035U JPH0238449Y2 (ja) 1985-10-08 1985-10-08

Publications (2)

Publication Number Publication Date
JPS6262441U true JPS6262441U (ja) 1987-04-17
JPH0238449Y2 JPH0238449Y2 (ja) 1990-10-17

Family

ID=31073464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985154035U Expired JPH0238449Y2 (ja) 1985-10-08 1985-10-08

Country Status (1)

Country Link
JP (1) JPH0238449Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03268437A (ja) * 1990-03-19 1991-11-29 Kaijo Corp ワイヤボンディング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03268437A (ja) * 1990-03-19 1991-11-29 Kaijo Corp ワイヤボンディング装置

Also Published As

Publication number Publication date
JPH0238449Y2 (ja) 1990-10-17

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