JPS6260645A - Laminator - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to photosensitive dry film resist (hereinafter referred to as DFR).
The present invention relates to a device for laminating a conductive metal laminated board (hereinafter referred to as a substrate) to a conductive metal laminated board (hereinafter referred to as a substrate).

More specifically, the present invention relates to a device that prevents air from being trapped between the DFR and the substrate when the DFR is laminated onto the substrate.

[Conventional technology]

In the conventional DFR laminator, as shown in the third factor, the cover film is removed by peeling rollers 21, 21 from a roller 20, 20 around which a DFR consisting of a three-layer structure of a cover film, a carrier film, and a photosensitive layer is wound. Peel off,
The peeled off cover film is wound up by peeling film take-up rollers 22, 22, and the DFR from which the cover film has been peeled off is guided to a pair of laminating rollers 23, 23, and the above-mentioned laminate O=U2 is applied to the conveyed substrate 24.
A laminating apparatus is used that presses DFR 3 onto a substrate while applying pressure with an air cylinder 25 or the like.

However, the above-mentioned conventional apparatus has the disadvantage that the photosensitive composition does not penetrate into the irregularities of the substrate caused by surface polishing of the substrate and the texture of the glass cloth, resulting in air pockets 9, resulting in poor adhesion.

[Problem that the invention seeks to solve]

In recent years, electronic industrial technology has made rapid progress, and various printed wiring boards are being manufactured. This printed wiring board is manufactured using a three-layer structure that is solid at room temperature and is flexible, represented by product names such as DuPont's "Riston" ■ and Fuikasei's "Sunfort" ■. After thermo-compression-bonding a photosensitive resin composition with a roller, actinic rays are irradiated through a negative or positive film on which a wiring pattern is drawn on the photosensitive composition, and the photosensitivity of the area irradiated with actinic rays is determined. The composition is photopolymerized or photodegraded, and if the photosensitive resin composition is photopolymerizable, the photopolymerized portion is removed, and if it is photodegradable, the photodegradable portion is removed with a solvent to make the substrate conductive. After exposing the conductive metal and removing the exposed conductive metal by etching with a conductive metal etchant, remove the photosensitive composition that served as a resist material from the solution remaining on the substrate with a stripping solution. This is done by removing it.

When manufacturing printed wiring boards as described above, the most important point that determines the quality of the manufactured printed wiring board is that when bonding the DFR to the board by thermocompression, there is no glass cloth between the film and the board. The problem is that air is trapped due to irregularities on the substrate surface due to texture, etc., resulting in poor adhesion.

When air is trapped between the substrate and the DFR as described above, the active light rays emitted from the light irradiation lamp are scattered or converged. As a result, the portion of the DFR that should be photopolymerized or photodegraded may not undergo sufficient photopolymerization or photodegradation, or may not be photopolymerized or photodegraded at all.
Furthermore, photopolymerization and photodegradation occur even in areas that should not be photopolymerized or photodegraded. Even if photopolymerization and photodegradation are sufficient, the DFR will lift up from the board and the reliability of images in subsequent processes such as etching and plating will be lost, resulting in printed wiring that relies on extremely high precision. It no longer meets the requirements for a substrate.

As mentioned above, the air entrapment between the substrate and the DFR caused by unevenness of the substrate along the texture of the glass cloth of the substrate and polishing scratches caused in the polishing process of the substrate is a problem that cannot be solved by the conventional laminator described above. Ah, the present invention aims to solve the above problems.

[Means for solving problems]

In order to achieve the above object, the present invention includes an oscillator that vibrates the laminating roller in an apparatus for laminating a photosensitive dry film resist on a conductive metal laminated board using a laminating roller whose surface is rubber-lined. The present invention is characterized in that the laminating roller is provided with a means for pressurizing the laminating roller.

[Effect]

The present invention operates an oscillator to vibrate the laminating roller up and down at high speed while holding the laminating roller whose surface is rubber-lined in a pressurized state by a pressurizing means. The elastic recovery energy and vibration energy themselves fill the photosensitive resin composition into the uneven portions of the substrate, thereby eliminating air entrapment between the substrate and the DFR.

〔Example〕

The present invention will be explained based on embodiments shown in the drawings.

Reference numeral 1.1' denotes a pair of DFRs having a three-layer structure wound around a roller and supported by a machine frame (not shown in XO) above and below the substrate conveyance path. The cover film of the DFR of the three-layer structure is peeled off by peeling rolls 2, 2', and the peeled cover film is wound up by winding rollers 3, 3'. The DFR from which the cover film has been removed is a pair of laminates whose surfaces are rubber-lined (4a, 5a).
, 5. On the other hand, conveyor rollers 6,6. ··song·
The seven substrates being conveyed are fed between the laminating rollers 4.5, and the DFR guided to the laminating rollers 4 and 5 is laminated onto the substrate 7. 8 is an air cylinder that pressurizes the laminating roller 4 during the lamination described above.

In this example, an air cylinder is shown as the pressurizing means, but
It is also possible to use other means, such as a spring device, as the pressurizing means.

Further, the present invention provides the laminating roller 4 during lamination.
, 5 is vibrated, and the vibration means will be explained based on the embodiment shown in FIG. 2. It is attached to the frame 10 by bearings 9, 9'. 11 is the lower laminated B Laonia 5 mentioned above? It is a sprocket that rotates.

12 is a bar for fixing the air cylinder 8 installed between the frames 10 and 10, and the air cylinder 8 is attached to the bar.
is vertically fixed so that the upper laminating roller 4 can be pressurized. 13 is a horizontal member 1 parallel to the longitudinal direction of the upper laminate
3a and hanging members 13b and 13 whose both ends are bent downward.
b, and vertical members 13b and 13 of i'fJ.
The shaft 4b'6 of the upper laminating roller 4 is held at b through the bearing, and the horizontal member 13 of the laminating holder 13 is
An oscillator 14 is fixedly mounted on the upper surface of the air cylinder a, and the upper surface of the oscillator 14 is arranged so as to be in contact with the tip of the air cylinder 8. As the oscillating body of the oscillator 14, an electromagnetic vibrator, a vibration motor, an eccentric ring, etc. can be used.

Therefore, the vibration of the oscillator 14 may be directly transmitted through the 5-laminate roller holder 13.

Since the embodiment of the present invention is constructed as described above, the DFR from which the cover film has been peeled off is guided to a pair of laminating rollers 4.5 and conveyed by a conveyor roller 56°6, . . . The substrate 7 is mounted on the laminating rollers 4 and 5.
The laminate holder 13 which holds the upper laminating roller 4 is supplied by the oscillator 14 to laminate the DFRi substrate 7 from above and below.
When the roller is vibrated, this vibration immediately causes the upper laminating roller 4 to move up and down. The vibration by the oscillator 14 can be performed constantly or only when the substrate 7 is supplied between the laminate rollers 4 and 5. In this case, a substrate detection sensor (not shown) may be provided. It is possible by

When laminating with the pair of laminating rollers 4 and 5 described above, the laminating roller 4 is pressurized with the necessary pressure by the air cylinder 8, so the laminating roller vibrates up and down, thereby polishing the substrate 7. The rubber lining portion 4a of the laminating rollers 4, 5,
The photosensitive resin composition penetrates into the microscopic irregularities on the surface of the substrate 70 (marked with @) due to the elastic recovery energy generated in 5a and minute vertical vibrations, resulting in a laminate free of air pockets.

〔Effect of the invention〕

The laminate valve according to the present invention vibrates the laminate roller as described above and uses the elastic recovery energy of the rubber lining the narrow side of the laminate roll and the motion of the laminate roller itself to vibrate the substrate. The photosensitive resin composition penetrates into the fine irregularities on the surface, making it possible to create a laminate without air entrapment.

In the manufacture of printed circuit boards, where precision and high reliability are essential, the present invention can greatly reduce defects such as poor adhesion between the board and DFR, disconnections, chips, and short pinholes caused by air entrapment. effective.

By the way, according to statistics from the printed circuit board industry in 1981, the proportion of wire breaks, chips, and short pinholes caused by poor adhesion of the upper laminate and air entrapment accounted for 80% of all defects.
．． However, the laminate Mai≠≠* mother device of the present invention has the effect of significantly improving the yield of printed circuit boards by eliminating air entrapment between the substrate and the DFR.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention, and FIG. 1 is a side view of a lamination roll, and FIG. 2 is an explanatory view of a laminating roll vibrating device.
FIG. 3 is an explanatory diagram of a conventional laminator. 1.1': DFR of three-layer structure 2,2': Peeling roller 4.5; Laminating rollers 4a, 5a; Rubber lining part 7; Substrate 8; Air silicate/tar 13; Laminating roller holder 14; Oscillator patent application Person: Asahi Kasei Corporation Representative Person: Kenji Iwaki: 1, ;1,
・7.・・Nihe 2 Michi Oshima layer 1;゛・−
5' Figure 1

Claims (1)

[Claims] A device for laminating a photosensitive dry film resist on a conductive metal laminated board using a laminating roller with a rubber lining on the surface, including an oscillator for vibrating the laminating roller, and a means for pressurizing the laminating roller. A laminating device characterized by: