JPH07239550A - Continuous sticking method, production of substrate for producing printed circuit board stuck with photosensitive film and device used therein - Google Patents
Continuous sticking method, production of substrate for producing printed circuit board stuck with photosensitive film and device used thereinInfo
- Publication number
- JPH07239550A JPH07239550A JP6028669A JP2866994A JPH07239550A JP H07239550 A JPH07239550 A JP H07239550A JP 6028669 A JP6028669 A JP 6028669A JP 2866994 A JP2866994 A JP 2866994A JP H07239550 A JPH07239550 A JP H07239550A
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive film
- substrate
- producing
- printed wiring
- photosensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、連続貼り合わせ方法、
感光性フィルムの貼り合わされた印刷配線板製造用基板
の製造法及びその装置に関する。BACKGROUND OF THE INVENTION The present invention relates to a continuous bonding method,
The present invention relates to a method for manufacturing a substrate for manufacturing a printed wiring board having a photosensitive film laminated thereon and an apparatus for the same.
【０００２】[0002]
【従来の技術】従来、精密加工業界、例えば印刷配線板
の製造等において、めっき或いはエッチングのためのレ
ジスト形成に感光性フィルムを用いることが知られてい
る。この感光性フィルムは通常、可とう性支持体、感光
性組成物層、必要に応じて用いられる保護フィルムから
成っており、保護フィルムを剥がしながら、可とう性支
持体と一緒に感光性樹脂層を印刷配線板製造用基板に加
熱加圧ロールを用いて貼り合わせ、その後可とう性支持
体上にネガマスクを置き、露光し、ついで可とう性支持
体をはがして、現像し、レジスト像を形成するものであ
る。近年、印刷配線板の配線の高密度化、高精度化に伴
いスルーホールの異形穴化およびスルーホールランドの
狭小化、また印刷配線板の低価格化に伴い感光性フィル
ムの薄膜化が進行していることより感光性フィルムのテ
ント信頼性を向上させ印刷配線板の製造歩留りを向上し
ようとする試みがなされている。2. Description of the Related Art Conventionally, it has been known to use a photosensitive film for forming a resist for plating or etching in the precision processing industry, for example, in the production of printed wiring boards. This photosensitive film usually comprises a flexible support, a photosensitive composition layer and a protective film which is optionally used. While the protective film is peeled off, a photosensitive resin layer is formed together with the flexible support. Is bonded to a printed wiring board manufacturing substrate by using a heating and pressing roll, and then a negative mask is placed on the flexible support, exposed, and then the flexible support is peeled off and developed to form a resist image. To do. In recent years, as the density of wiring on printed wiring boards has increased and the accuracy has increased, through holes have irregular holes and through hole lands have become narrower, and as the cost of printed wiring boards has decreased, the photosensitive film has become thinner. Therefore, attempts have been made to improve the tent reliability of the photosensitive film and the manufacturing yield of the printed wiring board.
【０００３】可とう性支持体及び感光性樹脂層を有する
感光性フィルムを、印刷配線板製造用基板に貼り合わせ
る装置としては、特公昭５３−３１６７０号公報、特開
昭５７−２１８９０号公報、特開昭５７−２１８９１号
公報に記載される貼り合わせ装置があるが、いずれの貼
り合わせ装置も、加熱加圧ロールがゴムライニングさ
れ、表面が変形可能となり感光性フィルムを印刷配線板
製造用基板に貼り合わせた場合、スルーホールコーナー
部の感光性樹脂膜厚が薄くなりテント信頼性が低下する
という欠点がある。As a device for laminating a photosensitive film having a flexible support and a photosensitive resin layer on a substrate for producing a printed wiring board, Japanese Patent Publication No. 53-31670 and Japanese Patent Publication No. 57-21890. There is a laminating device described in JP-A-57-21891, but in any laminating device, the heating and pressing roll is rubber-lined so that the surface is deformable and the photosensitive film is used as a substrate for producing a printed wiring board. When it is attached to, the photosensitive resin film thickness at the through-hole corner portion becomes thin and the tent reliability deteriorates.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、前記した従
来の技術の問題点を解消し、感光性フィルムのテント信
頼性を向上することができる連続貼り合わせ方法、感光
性フィルムの貼り合わされた印刷配線板製造用基板の製
造法及びその装置を提供するものである。DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned problems of the prior art and improves the tent reliability of a photosensitive film by a continuous bonding method and a photosensitive film bonded together. A method of manufacturing a substrate for manufacturing a printed wiring board and an apparatus therefor are provided.
【０００５】[0005]
【課題を解決するための手段】本発明は、可とう性支持
体及び感光性樹脂層を有する感光性フィルムを、表面が
変形不能な加熱加圧ロールにより印刷配線板製造用基板
に加熱加圧積層することを特徴とする連続貼り合わせ方
法に関する。According to the present invention, a photosensitive film having a flexible support and a photosensitive resin layer is heated and pressed onto a printed wiring board manufacturing substrate by a heating and pressing roll whose surface cannot be deformed. The present invention relates to a continuous bonding method characterized by laminating.
【０００６】また、本発明は、前記連続貼り合わせ方法
により感光性フィルムを貼り合わせることを特徴とする
感光性フィルムの貼り合わされた印刷配線板製造用基板
の製造法に関する。The present invention also relates to a method for producing a substrate for producing a printed wiring board having a photosensitive film laminated thereon, characterized in that a photosensitive film is laminated by the continuous laminating method.
【０００７】また、本発明は、可とう性支持体及び感光
性樹脂層を有する感光性フィルムの供給機構、印刷配線
板製造用基板を搬送、進行させる送り機構、並びに前記
感光性フィルムを印刷配線板製造用基板に加熱加圧積層
する少なくとも上下１組の表面が変形不能な加熱加圧ロ
ールを備えてなる連続貼り合わせ装置に関する。The present invention also provides a photosensitive film supply mechanism having a flexible support and a photosensitive resin layer, a feeding mechanism for conveying and advancing a substrate for producing a printed wiring board, and a printed wiring for the photosensitive film. The present invention relates to a continuous laminating apparatus including at least one set of upper and lower surfaces, which are laminated under heat and pressure on a plate-making substrate, and whose surfaces cannot be deformed.
【０００８】本発明における感光性フィルムは、可とう
性支持体及び感光性樹脂層を有するものであれば特に制
限はなく、公知のものを用いることができる。通常、感
光性フィルムは、ロール状の巻物の形とされ、巻き出し
ながら使用される。感光性フィルムは、一時的に感光性
樹脂層を保護するために、感光性樹脂層上に保護フィル
ムを有していてもよく、また、感光性樹脂層以外の中間
層を有していてもよい。感光性フィルムにおける感光性
樹脂層の厚さは、解像度等の点から、１０〜１００μｍ
であることが好ましく、１３〜８０μｍであることがよ
り好ましい。The photosensitive film in the present invention is not particularly limited as long as it has a flexible support and a photosensitive resin layer, and known ones can be used. Usually, the photosensitive film is in the form of a roll and is used while unrolling. The photosensitive film may have a protective film on the photosensitive resin layer in order to temporarily protect the photosensitive resin layer, or may have an intermediate layer other than the photosensitive resin layer. Good. The thickness of the photosensitive resin layer in the photosensitive film is 10 to 100 μm from the viewpoint of resolution and the like.
Is preferable, and 13-80 μm is more preferable.
【０００９】本発明における印刷配線板製造用基板とし
ては、特に制限はなく、公知のものを用いることができ
る。印刷配線板製造用基板としては、例えば、銅張積層
板等があげられる。The substrate for producing a printed wiring board in the present invention is not particularly limited, and a known substrate can be used. Examples of the printed wiring board manufacturing substrate include a copper clad laminate.
【００１０】本発明における表面が変形不能な加熱加圧
ロールは、その表面硬度が８０〜１０００ブリネル（Br
inell）であることが好ましく、１００〜８００ブリネ
ル（Brinell）であることがより好ましい。加熱加圧ロ
ールの表面硬度が８０より小さい場合ロールに傷がつき
易く、また１０００より大きい場合加工しづらいおそれ
がある。表面が変形不能な加熱加圧ロールとしては、例
えば、硬度３００ブリネル（Brinell）のステンレス鋼
製の加熱加圧ロールが挙げられる。The heating and pressing roll whose surface is not deformable in the present invention has a surface hardness of 80 to 1000 Brinell (Br
inell) is preferable, and 100-800 Brinell is more preferable. If the surface hardness of the heating / pressurizing roll is less than 80, the roll may be easily scratched, and if it is more than 1000, it may be difficult to process. Examples of the heating and pressing roll whose surface cannot be deformed include a heating and pressing roll made of stainless steel having a hardness of 300 Brinell.
【００１１】本発明における表面が変形不能な加熱加圧
ロールは、その表面温度が５０〜２００℃であることが
好ましく、８０〜１５０℃であることがより好ましい。
加熱加圧ロールの表面温度が５０℃より低い場合、感光
性フィルムと印刷配線板製造用基板との密着性が低下す
るおそれすがあり、また、２００℃より高い場合、感光
性樹脂層が熱硬化し現像にて光硬化されなかった部分の
感光性樹脂層の現像が不十分となるおそれがある。The surface pressure of the heating and pressing roll whose surface cannot be deformed in the present invention is preferably 50 to 200 ° C., more preferably 80 to 150 ° C.
If the surface temperature of the heating / pressurizing roll is lower than 50 ° C., the adhesion between the photosensitive film and the printed wiring board manufacturing substrate may be reduced, and if the surface temperature is higher than 200 ° C., the photosensitive resin layer may become hot. There is a possibility that the development of the photosensitive resin layer in the portion which is cured and not photocured by the development is insufficient.
【００１２】本発明における感光性フィルムの供給機構
は、特に制限はなく、公知のものを用いることができ
る。例えば、感光性フィルムがロール状の巻物である場
合は、そのロールを回転させながら感光性フィルムを巻
き出せる機構があげられる。The supply mechanism of the photosensitive film in the present invention is not particularly limited, and a known one can be used. For example, in the case where the photosensitive film is a roll-shaped roll, there is a mechanism that allows the photosensitive film to be unwound while rotating the roll.
【００１３】本発明における送り機構は、特に制限はな
く、公知のものを用いることができ、例えば、一対のロ
ールを印刷配線板製造用基板進行方向に沿って一定間隔
で１組以上ならべたものをあげることができる。The feeding mechanism in the present invention is not particularly limited, and known ones can be used. For example, one pair or more of rolls are arranged at regular intervals along the substrate traveling direction for printed wiring board production. Can be raised.
【００１４】本発明において感光性フィルムを印刷配線
板製造用基板に加熱加圧積層する少なくとも上下１組の
表面が変形不能な加熱加圧ロールは、その表面硬度が８
０〜１０００ブリネル（Brinell）であり、またその表
面温度が５０〜２００℃に加熱できる機能を備えている
ことが好ましい。表面が変形不能な加熱加圧ロールは、
ベルト、チェーン、ギア、クランク等を介してトルクモ
ーターから力が与えられ、円周速度は通常印刷配線板製
造用基板の進行速度（送り速度）が０．２〜６．０ｍ／
分となるように設定される。また少なくとも上下１組の
表面が変形不能な加熱加圧ロールの一者を上下動可能と
する圧力付与装置を備えていることが好ましい。In the present invention, at least one set of upper and lower surfaces for heating and pressurizing the photosensitive film on the substrate for producing a printed wiring board, the surface of which is not deformable, has a surface hardness of 8
It is preferably 0 to 1000 Brinell and has a function capable of heating the surface temperature thereof to 50 to 200 ° C. The heating and pressing roll whose surface cannot be deformed
A torque motor applies a force through a belt, a chain, a gear, a crank, etc., and a circumferential speed is normally a traveling speed (feed speed) of a printed wiring board manufacturing substrate of 0.2 to 6.0 m /
Set to be minutes. Further, it is preferable that at least a pair of upper and lower surfaces is provided with a pressure applying device that can vertically move one of the heating and pressing rolls whose surface cannot be deformed.
【００１５】[0015]
【実施例】本発明を実施例によって説明する。 実施例１ 日立高温ラミネーター ＨＬＭ−３０００（日立化成工
業（株）製）の加熱加圧ロールを、硬度３００ブリネル
（Brinell）のステンレス鋼製の表面が変形不能な加熱
加圧ロールに変更し、図１に示すように、感光性フィル
ムの供給機構にセットされた感光性フィルム３（日立化
成工業（株）製フォテック Ｈ−Ｓ９３０（感光性樹脂
層の厚さは３０μｍ））を保護フィルム８を巻き取りな
がら巻き出して印刷配線板製造用基板７に表面が変形不
能な加熱加圧ロールを介して基材進行方向の力を作用さ
せて貼り合わせた。この際の基板進行速度（ラミネート
速度）は２．５ｍ／分、加熱加圧ロールの表面温度は１
００℃及び加熱加圧ロールのエアシリンダー圧力は４．
０kgf/cm2とした。次に、スルーホールランド幅１００
μｍのネガティブ像を形成するネガマスクを介し、高圧
水銀灯でストーファー２１段ステップタブレットにて８
段の硬化段数となる露光光量で露光した。なお、図１に
おいて、２は送りロール、４は保護フィルム巻き取りロ
ール、５はガイドロール及び６は保護フィルム除去後の
感光製フィルムを示す。EXAMPLES The present invention will be described with reference to examples. Example 1 The heating and pressing roll of Hitachi High-Temperature Laminator HLM-3000 (manufactured by Hitachi Chemical Co., Ltd.) was changed to a heating and pressing roll made of stainless steel having a hardness of 300 Brinell and having a non-deformable surface. As shown in 1, the protective film 8 is wrapped with the photosensitive film 3 (Photec H-S930 manufactured by Hitachi Chemical Co., Ltd. (thickness of the photosensitive resin layer is 30 μm)) set in the photosensitive film supply mechanism. The printed wiring board manufacturing substrate 7 was unwound and taken out, and was bonded by applying a force in the substrate advancing direction through a heating and pressing roll whose surface is not deformable. At this time, the substrate advancing speed (laminating speed) is 2.5 m / min, and the surface temperature of the heating and pressing roll is 1
Air cylinder pressure of 00 ° C and heating / pressurizing roll is 4.
It was set to 0 kgf / cm 2 . Next, through hole land width 100
Through a negative mask that forms a negative image of μm, a high-pressure mercury lamp is used to perform 8 steps on a stoker 21-step step tablet.
The exposure was performed with an exposure light amount that was the number of curing stages. In FIG. 1, 2 is a feed roll, 4 is a protective film winding roll, 5 is a guide roll, and 6 is a photosensitive film after removal of the protective film.
【００１６】次いで可とう性支持体を除去し１重量％炭
酸ナトリウム水溶液で４０秒間スプレー現像し、スルー
ホール部にテント膜を形成させた。さらに、塩化第２銅
エッチング液（２mol/l−ＣｕＣｌ2、２Ｎ−ＨＣｌ水溶
液、５０℃、スプレー圧力：２kgf/cm2）を１００秒間
スプレーし、レジストで保護されていない部分の銅を溶
解し、次いではくり液（３％ＮａＯＨ水溶液、５０℃、
５０秒、浸漬）にてレジストを除去した。スルーホール
部のテント膜が破れた場合、エッチング液は、スルーホ
ール内部へ浸入し銅が溶解され、欠陥となる。Next, the flexible support was removed, and spray development was carried out for 40 seconds with a 1% by weight sodium carbonate aqueous solution to form a tent film in the through holes. Further, a cupric chloride etching solution (2 mol / l-CuCl 2 , 2N-HCl aqueous solution, 50 ° C., spraying pressure: 2 kgf / cm 2 ) is sprayed for 100 seconds to dissolve the copper in the portion not protected by the resist. , Then stripping solution (3% NaOH aqueous solution, 50 ° C.,
The resist was removed by immersion for 50 seconds). When the tent film in the through hole portion is broken, the etching solution penetrates into the through hole to dissolve copper, resulting in a defect.
【００１７】比較例１ 加熱加圧ロール表面をゴムライニング（ゴム硬度＝ショ
ア硬度６０）した表面が変形不能な加熱加圧ロールに変
更し、実施例１同様の方法で、テント膜の信頼性につい
て検討した結果を表１に示す。Comparative Example 1 The reliability of the tent film was changed in the same manner as in Example 1 except that the surface of the heating / pressurizing roll was rubber-lined (rubber hardness = Shore hardness 60) and the surface was not deformable. The examined results are shown in Table 1.
【００１８】[0018]
【表１】 [Table 1]
【００１９】[0019]
【発明の効果】本発明により印刷配線板製造時、印刷配
線板製造用基板に感光性フィルムを貼り合わせる際に、
スルホール部のテント膜信頼性を大幅に向上させること
が出来る。EFFECTS OF THE INVENTION According to the present invention, when a photosensitive film is attached to a printed wiring board manufacturing substrate at the time of manufacturing a printed wiring board,
The reliability of the tent film in the through hole can be greatly improved.
【図１】本発明の連続貼り合せ方法に用いられる装置の
一例を示す模式図。FIG. 1 is a schematic view showing an example of an apparatus used in the continuous bonding method of the present invention.
【符号の説明】 １ 表面が変形不能な加熱加圧ロール ２ 送りロール ３ 感光性フィルム ４ 保護フィルム巻き取りロール ５ ガイドロール ６ 保護フィルム除去後の感光性フィルム ７ 印刷配線板製造用基板 ８ 保護フィルム[Explanation of Codes] 1 Heat-pressurizing roll whose surface cannot be deformed 2 Feed roll 3 Photosensitive film 4 Protective film winding roll 5 Guide roll 6 Photosensitive film after protective film is removed 7 Printed wiring board manufacturing substrate 8 Protective film
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｂ２９Ｌ 9:00 31:34 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 6 Identification code Office reference number FI technical display location // B29L 9:00 31:34
Claims (6)
る感光性フィルムを、表面が変形不能な加熱加圧ロール
により印刷配線板製造用基板に加熱加圧積層することを
特徴とする連続貼り合わせ方法。1. A continuous process characterized in that a photosensitive film having a flexible support and a photosensitive resin layer is heat-pressed and laminated on a substrate for producing a printed wiring board by a heat-pressing roll whose surface cannot be deformed. Laminating method.
ｍである請求項１記載の連続貼り合わせ方法。2. The thickness of the photosensitive resin layer is 10 to 100 μm.
The continuous bonding method according to claim 1, wherein m is m.
硬度が、硬度８０〜１０００ブリネル（Brinell）であ
る請求項１又は２記載の連続貼り合わせ方法。3. The continuous laminating method according to claim 1, wherein a surface of the heating and pressing roll whose surface cannot be deformed has a surface hardness of 80 to 1000 Brinell.
温度が、５０〜２００℃である請求項１、２又は３記載
の連続貼り合わせ方法。4. The continuous laminating method according to claim 1, 2 or 3, wherein the surface temperature of the heating and pressing roll whose surface cannot be deformed is 50 to 200 ° C.
合わせ方法により感光性フィルムを貼り合わせることを
特徴とする感光性フィルムの貼り合わされた印刷配線板
製造用基板の製造法。5. A method for producing a substrate for producing a printed wiring board having a photosensitive film laminated thereon, comprising laminating a photosensitive film by the continuous laminating method according to claim 1, 2, 3 or 4.
る感光性フィルムの供給機構、印刷配線板製造用基板を
搬送、進行させる送り機構、並びに前記感光性フィルム
を印刷配線板製造用基板に加熱加圧積層する少なくとも
上下１組の表面が変形不能な加熱加圧ロールを備えてな
る連続貼り合わせ装置。6. A mechanism for supplying a photosensitive film having a flexible support and a photosensitive resin layer, a feeding mechanism for conveying and advancing a substrate for producing a printed wiring board, and a substrate for producing a printed wiring board using the photosensitive film. A continuous laminating apparatus comprising at least a pair of upper and lower surfaces to be heat-pressed and laminated so that the surfaces cannot be deformed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6028669A JPH07239550A (en) | 1994-02-28 | 1994-02-28 | Continuous sticking method, production of substrate for producing printed circuit board stuck with photosensitive film and device used therein |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6028669A JPH07239550A (en) | 1994-02-28 | 1994-02-28 | Continuous sticking method, production of substrate for producing printed circuit board stuck with photosensitive film and device used therein |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07239550A true JPH07239550A (en) | 1995-09-12 |
Family
ID=12254926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6028669A Pending JPH07239550A (en) | 1994-02-28 | 1994-02-28 | Continuous sticking method, production of substrate for producing printed circuit board stuck with photosensitive film and device used therein |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07239550A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101702270B1 (en) * | 2016-09-06 | 2017-02-02 | 주식회사 미조산업 | Manufacture apparatus of subsidiary materials for nail filing kit |
-
1994
- 1994-02-28 JP JP6028669A patent/JPH07239550A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101702270B1 (en) * | 2016-09-06 | 2017-02-02 | 주식회사 미조산업 | Manufacture apparatus of subsidiary materials for nail filing kit |
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