JPS6259627A - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物

Info

Publication number
JPS6259627A
JPS6259627A JP60198536A JP19853685A JPS6259627A JP S6259627 A JPS6259627 A JP S6259627A JP 60198536 A JP60198536 A JP 60198536A JP 19853685 A JP19853685 A JP 19853685A JP S6259627 A JPS6259627 A JP S6259627A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin
less
ppm
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60198536A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6325013B2 (enrdf_load_stackoverflow
Inventor
Tetsuo Yoshida
哲夫 吉田
Kazutoshi Tomiyoshi
富吉　和俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP60198536A priority Critical patent/JPS6259627A/ja
Publication of JPS6259627A publication Critical patent/JPS6259627A/ja
Publication of JPS6325013B2 publication Critical patent/JPS6325013B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60198536A 1985-09-10 1985-09-10 エポキシ樹脂組成物 Granted JPS6259627A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60198536A JPS6259627A (ja) 1985-09-10 1985-09-10 エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60198536A JPS6259627A (ja) 1985-09-10 1985-09-10 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6259627A true JPS6259627A (ja) 1987-03-16
JPS6325013B2 JPS6325013B2 (enrdf_load_stackoverflow) 1988-05-24

Family

ID=16392782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60198536A Granted JPS6259627A (ja) 1985-09-10 1985-09-10 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6259627A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4110219A1 (de) * 1991-03-28 1992-10-01 Huels Troisdorf Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4110219A1 (de) * 1991-03-28 1992-10-01 Huels Troisdorf Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz

Also Published As

Publication number Publication date
JPS6325013B2 (enrdf_load_stackoverflow) 1988-05-24

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