JPS6258820B2 - - Google Patents

Info

Publication number
JPS6258820B2
JPS6258820B2 JP21463184A JP21463184A JPS6258820B2 JP S6258820 B2 JPS6258820 B2 JP S6258820B2 JP 21463184 A JP21463184 A JP 21463184A JP 21463184 A JP21463184 A JP 21463184A JP S6258820 B2 JPS6258820 B2 JP S6258820B2
Authority
JP
Japan
Prior art keywords
solder
diaphragm
soldering
board
molten solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP21463184A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6192774A (ja
Inventor
Takashi Tsunoda
Koichi Hiraiwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OOSAKA ASAHI KAGAKU KK
Original Assignee
OOSAKA ASAHI KAGAKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OOSAKA ASAHI KAGAKU KK filed Critical OOSAKA ASAHI KAGAKU KK
Priority to JP21463184A priority Critical patent/JPS6192774A/ja
Publication of JPS6192774A publication Critical patent/JPS6192774A/ja
Publication of JPS6258820B2 publication Critical patent/JPS6258820B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/06Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
JP21463184A 1984-10-12 1984-10-12 半田付装置における振動板 Granted JPS6192774A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21463184A JPS6192774A (ja) 1984-10-12 1984-10-12 半田付装置における振動板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21463184A JPS6192774A (ja) 1984-10-12 1984-10-12 半田付装置における振動板

Publications (2)

Publication Number Publication Date
JPS6192774A JPS6192774A (ja) 1986-05-10
JPS6258820B2 true JPS6258820B2 (cg-RX-API-DMAC7.html) 1987-12-08

Family

ID=16658935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21463184A Granted JPS6192774A (ja) 1984-10-12 1984-10-12 半田付装置における振動板

Country Status (1)

Country Link
JP (1) JPS6192774A (cg-RX-API-DMAC7.html)

Also Published As

Publication number Publication date
JPS6192774A (ja) 1986-05-10

Similar Documents

Publication Publication Date Title
EP0201158B1 (en) Vibratory wave soldering
US5669970A (en) Stencil apparatus for applying solder paste
JP2000040872A (ja) プリント基板のはんだ付け方法および噴流はんだ槽
JPH08507254A (ja) ガスナイフジェットを備えるはんだノズル
JPS6258820B2 (cg-RX-API-DMAC7.html)
JPS6258819B2 (cg-RX-API-DMAC7.html)
US3993236A (en) Methods and apparatus for soldering
EP0413689B1 (en) Wavesoldering device
DE2346993C2 (de) Lotbad zum fluBmittelfreien Verzinnen mittels Ultraschall
JP4605222B2 (ja) 噴流はんだ槽
EP0256948A1 (en) Fountain-type soldering apparatus
CN206925060U (zh) 一种pcb清洗装置
CA1230426A (en) Vibratory wave soldering of printed wiring boards
JP3956250B2 (ja) 噴流はんだ槽
CN1126629C (zh) 喷流焊接槽
CN100477886C (zh) 印刷基板的焊接方法和射流焊料槽
JP2938328B2 (ja) はんだ付け方法およびその装置
JPH0134712B2 (cg-RX-API-DMAC7.html)
CN212552164U (zh) 一种波峰焊锡槽喷口结构及焊锡槽
JPH02187261A (ja) 半田槽
JP4487603B2 (ja) 連続溶融金属メッキ方法及び装置
JPH028601Y2 (cg-RX-API-DMAC7.html)
CN210030858U (zh) 一种浸镀装置
JPH0783174B2 (ja) プリント基板のはんだ付け方法およびその装置
CA1096510A (en) Apparatus and method for manufacturing a printed circuit board