JPS6258618B2 - - Google Patents

Info

Publication number

JPS6258618B2

JPS6258618B2 JP20489483A JP20489483A JPS6258618B2 JP S6258618 B2 JPS6258618 B2 JP S6258618B2 JP 20489483 A JP20489483 A JP 20489483A JP 20489483 A JP20489483 A JP 20489483A JP S6258618 B2 JPS6258618 B2 JP S6258618B2

Authority

JP

Japan

Prior art keywords

epoxy resin

phenol

parts

novolak type

type epoxy

Prior art date

1983-11-02

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000003822 epoxy resin Substances 0.000 claims description 30
• 229920000647 polyepoxide Polymers 0.000 claims description 30
• 229920003986 novolac Polymers 0.000 claims description 19
• ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 18
• HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 claims description 8
• HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 claims description 6
• ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 claims description 6
• 239000000203 mixture Substances 0.000 claims description 6
• QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 claims description 4
• 150000001299 aldehydes Chemical class 0.000 claims description 3
• HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 claims description 3
• GVNVAWHJIKLAGL-UHFFFAOYSA-N 2-(cyclohexen-1-yl)cyclohexan-1-one Chemical compound O=C1CCCCC1C1=CCCCC1 GVNVAWHJIKLAGL-UHFFFAOYSA-N 0.000 claims description 2
• 101150065749 Churc1 gene Proteins 0.000 claims description 2
• 102100038239 Protein Churchill Human genes 0.000 claims description 2
• LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
• QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 5
• 239000004593 Epoxy Substances 0.000 description 5
• 229930003836 cresol Natural products 0.000 description 5
• 239000012778 molding material Substances 0.000 description 5
• OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
• 229910052799 carbon Inorganic materials 0.000 description 4
• 150000002989 phenols Chemical class 0.000 description 4
• 239000004033 plastic Substances 0.000 description 4
• 229920003023 plastic Polymers 0.000 description 4
• 239000003795 chemical substances by application Substances 0.000 description 3
• 239000000945 filler Substances 0.000 description 3
• 230000002209 hydrophobic effect Effects 0.000 description 3
• 239000006082 mold release agent Substances 0.000 description 3
• -1 that is Chemical class 0.000 description 3
• RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
• 239000004215 Carbon black (E152) Substances 0.000 description 2
• ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
• 239000007822 coupling agent Substances 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 238000005538 encapsulation Methods 0.000 description 2
• 239000003063 flame retardant Substances 0.000 description 2
• 229930195733 hydrocarbon Natural products 0.000 description 2
• 239000002184 metal Substances 0.000 description 2
• 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
• 239000000049 pigment Substances 0.000 description 2
• 239000004065 semiconductor Substances 0.000 description 2
• 229920001342 Bakelite® Polymers 0.000 description 1
• 229930185605 Bisphenol Natural products 0.000 description 1
• VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
• 238000010521 absorption reaction Methods 0.000 description 1
• 239000000654 additive Substances 0.000 description 1
• IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 150000001875 compounds Chemical class 0.000 description 1
• 238000009833 condensation Methods 0.000 description 1
• 238000004132 cross linking Methods 0.000 description 1
• 230000007613 environmental effect Effects 0.000 description 1
• 239000005350 fused silica glass Substances 0.000 description 1
• 150000002430 hydrocarbons Chemical class 0.000 description 1
• 125000001183 hydrocarbyl group Chemical group 0.000 description 1
• 125000001165 hydrophobic group Chemical group 0.000 description 1
• 238000009413 insulation Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 239000005011 phenolic resin Substances 0.000 description 1
• 239000004645 polyester resin Substances 0.000 description 1
• 229920001225 polyester resin Polymers 0.000 description 1
• 239000002994 raw material Substances 0.000 description 1
• 230000009257 reactivity Effects 0.000 description 1
• 239000005871 repellent Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1