JPS6257428B2 - - Google Patents

Info

Publication number
JPS6257428B2
JPS6257428B2 JP56025873A JP2587381A JPS6257428B2 JP S6257428 B2 JPS6257428 B2 JP S6257428B2 JP 56025873 A JP56025873 A JP 56025873A JP 2587381 A JP2587381 A JP 2587381A JP S6257428 B2 JPS6257428 B2 JP S6257428B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
solder
nozzle
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56025873A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57139993A (en
Inventor
Shuichi Murakami
Chuichi Matsuda
Keiji Saeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2587381A priority Critical patent/JPS57139993A/ja
Priority to EP81109568A priority patent/EP0058766B1/en
Priority to DE8181109568T priority patent/DE3171729D1/de
Priority to CA000389728A priority patent/CA1190095A/en
Publication of JPS57139993A publication Critical patent/JPS57139993A/ja
Priority to US06/920,142 priority patent/US4824010A/en
Publication of JPS6257428B2 publication Critical patent/JPS6257428B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
JP2587381A 1980-12-26 1981-02-23 Method and device for soldering printed board Granted JPS57139993A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2587381A JPS57139993A (en) 1981-02-23 1981-02-23 Method and device for soldering printed board
EP81109568A EP0058766B1 (en) 1981-02-23 1981-11-07 Soldering apparatus
DE8181109568T DE3171729D1 (en) 1981-02-23 1981-11-07 Soldering apparatus
CA000389728A CA1190095A (en) 1981-02-23 1981-11-09 Soldering apparatus
US06/920,142 US4824010A (en) 1980-12-26 1986-10-17 Process and apparatus for soldering printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2587381A JPS57139993A (en) 1981-02-23 1981-02-23 Method and device for soldering printed board

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP25408788A Division JPH01132198A (ja) 1988-10-07 1988-10-07 プリント基板の半田付方法

Publications (2)

Publication Number Publication Date
JPS57139993A JPS57139993A (en) 1982-08-30
JPS6257428B2 true JPS6257428B2 (zh) 1987-12-01

Family

ID=12177901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2587381A Granted JPS57139993A (en) 1980-12-26 1981-02-23 Method and device for soldering printed board

Country Status (1)

Country Link
JP (1) JPS57139993A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6271917U (zh) * 1985-10-23 1987-05-08
JPH02101626U (zh) * 1989-01-30 1990-08-13
JP2010267786A (ja) * 2009-05-14 2010-11-25 Denso Corp はんだ付け装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5958566U (ja) * 1982-10-07 1984-04-17 株式会社タムラ製作所 噴流式はんだ付け装置
JPS6415995A (en) * 1987-07-10 1989-01-19 Kenji Kondo Method of soldering printed wiring board
JPH01132198A (ja) * 1988-10-07 1989-05-24 Matsushita Electric Ind Co Ltd プリント基板の半田付方法
CN105057829A (zh) * 2013-08-06 2015-11-18 熊菊莲 一种带有双波峰喷口的波峰焊机

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5035046A (zh) * 1973-08-01 1975-04-03
JPS5051449A (zh) * 1973-09-07 1975-05-08
JPS5612568B2 (zh) * 1978-02-10 1981-03-23
JPS56163073A (en) * 1980-05-19 1981-12-15 Alps Electric Co Ltd Soldering device
JPS5744434A (en) * 1980-08-28 1982-03-12 Nippon Alum Mfg Co Ltd:The Aging apparatus of piece coated with sealing agent
JPS57115970A (en) * 1981-01-06 1982-07-19 Matsushita Electric Ind Co Ltd Soldering method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612568U (zh) * 1979-07-05 1981-02-03

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5035046A (zh) * 1973-08-01 1975-04-03
JPS5051449A (zh) * 1973-09-07 1975-05-08
JPS5612568B2 (zh) * 1978-02-10 1981-03-23
JPS56163073A (en) * 1980-05-19 1981-12-15 Alps Electric Co Ltd Soldering device
JPS5744434A (en) * 1980-08-28 1982-03-12 Nippon Alum Mfg Co Ltd:The Aging apparatus of piece coated with sealing agent
JPS57115970A (en) * 1981-01-06 1982-07-19 Matsushita Electric Ind Co Ltd Soldering method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6271917U (zh) * 1985-10-23 1987-05-08
JPH02101626U (zh) * 1989-01-30 1990-08-13
JP2010267786A (ja) * 2009-05-14 2010-11-25 Denso Corp はんだ付け装置

Also Published As

Publication number Publication date
JPS57139993A (en) 1982-08-30

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