JPS6255348U - - Google Patents

Info

Publication number
JPS6255348U
JPS6255348U JP1985147747U JP14774785U JPS6255348U JP S6255348 U JPS6255348 U JP S6255348U JP 1985147747 U JP1985147747 U JP 1985147747U JP 14774785 U JP14774785 U JP 14774785U JP S6255348 U JPS6255348 U JP S6255348U
Authority
JP
Japan
Prior art keywords
electro
optical device
lsi chip
substrate
metal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985147747U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0445244Y2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985147747U priority Critical patent/JPH0445244Y2/ja
Publication of JPS6255348U publication Critical patent/JPS6255348U/ja
Application granted granted Critical
Publication of JPH0445244Y2 publication Critical patent/JPH0445244Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1985147747U 1985-09-27 1985-09-27 Expired JPH0445244Y2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985147747U JPH0445244Y2 (cg-RX-API-DMAC7.html) 1985-09-27 1985-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985147747U JPH0445244Y2 (cg-RX-API-DMAC7.html) 1985-09-27 1985-09-27

Publications (2)

Publication Number Publication Date
JPS6255348U true JPS6255348U (cg-RX-API-DMAC7.html) 1987-04-06
JPH0445244Y2 JPH0445244Y2 (cg-RX-API-DMAC7.html) 1992-10-23

Family

ID=31061393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985147747U Expired JPH0445244Y2 (cg-RX-API-DMAC7.html) 1985-09-27 1985-09-27

Country Status (1)

Country Link
JP (1) JPH0445244Y2 (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08153751A (ja) * 1994-08-31 1996-06-11 Nec Corp 電子デバイス組立体およびその製造方法
WO1998046811A1 (fr) * 1997-04-17 1998-10-22 Sekisui Chemical Co., Ltd. Particules conductrices, procede et dispositif de fabrication, structure anisotrope a adhesif et raccordement conducteur, composants de circuit electronique et leur procede de fabrication

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120941A (ja) * 1974-08-14 1976-02-19 Seikosha Kk Dodenseisetsuchakuzai
JPS5431566A (en) * 1977-08-12 1979-03-08 Nippon Kokuen Kogyo Kk Way of connecting large scale integrated circuit to current carrying circuit portions on insulated substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120941A (ja) * 1974-08-14 1976-02-19 Seikosha Kk Dodenseisetsuchakuzai
JPS5431566A (en) * 1977-08-12 1979-03-08 Nippon Kokuen Kogyo Kk Way of connecting large scale integrated circuit to current carrying circuit portions on insulated substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08153751A (ja) * 1994-08-31 1996-06-11 Nec Corp 電子デバイス組立体およびその製造方法
WO1998046811A1 (fr) * 1997-04-17 1998-10-22 Sekisui Chemical Co., Ltd. Particules conductrices, procede et dispositif de fabrication, structure anisotrope a adhesif et raccordement conducteur, composants de circuit electronique et leur procede de fabrication
KR100574215B1 (ko) * 1997-04-17 2006-04-27 세키스이가가쿠 고교가부시키가이샤 도전성 미립자

Also Published As

Publication number Publication date
JPH0445244Y2 (cg-RX-API-DMAC7.html) 1992-10-23

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