JPS6255302B2 - - Google Patents

Info

Publication number
JPS6255302B2
JPS6255302B2 JP56174302A JP17430281A JPS6255302B2 JP S6255302 B2 JPS6255302 B2 JP S6255302B2 JP 56174302 A JP56174302 A JP 56174302A JP 17430281 A JP17430281 A JP 17430281A JP S6255302 B2 JPS6255302 B2 JP S6255302B2
Authority
JP
Japan
Prior art keywords
lead
insulating substrate
lead frame
manufacturing
dip type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56174302A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5874061A (ja
Inventor
Shigeru Kubota
Shoichi Ogura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56174302A priority Critical patent/JPS5874061A/ja
Publication of JPS5874061A publication Critical patent/JPS5874061A/ja
Publication of JPS6255302B2 publication Critical patent/JPS6255302B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP56174302A 1981-10-29 1981-10-29 Ｄｉｐ型ケ−スの製造方法 Granted JPS5874061A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56174302A JPS5874061A (ja) 1981-10-29 1981-10-29 Ｄｉｐ型ケ−スの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56174302A JPS5874061A (ja) 1981-10-29 1981-10-29 Ｄｉｐ型ケ−スの製造方法

Publications (2)

Publication Number Publication Date
JPS5874061A JPS5874061A (ja) 1983-05-04
JPS6255302B2 true JPS6255302B2 (enExample) 1987-11-19

Family

ID=15976282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56174302A Granted JPS5874061A (ja) 1981-10-29 1981-10-29 Ｄｉｐ型ケ−スの製造方法

Country Status (1)

Country Link
JP (1) JPS5874061A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0622266B2 (ja) * 1986-09-17 1994-03-23 三菱電機株式会社 半導体装置及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5230352B2 (enExample) * 1974-02-08 1977-08-08
JPS5159269A (en) * 1974-11-20 1976-05-24 Nippon Electric Co Handotaisochino seizohoho
JPS5386575A (en) * 1977-01-10 1978-07-31 Mitsubishi Electric Corp Production of semiconductor device
JPS6024581B2 (ja) * 1977-01-21 1985-06-13 株式会社日立製作所 リ−ド線の気密封止方法

Also Published As

Publication number Publication date
JPS5874061A (ja) 1983-05-04

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