JPS6254834B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a powder bonding method using a powder adhesive.

[Background technology]

In the manufacture of panels such as floor panels, powder adhesives (such as epoxy adhesives) are used to bond boards such as plywood together.

As shown in FIG. 3, the bonding method using such a powder adhesive involves first preheating the surface 1a of the plate material 1 to be bonded with a heater 2, and then applying a powder adhesive 3 on the surface to be bonded.
Spread. At this time, the powder adhesive 3
is melted by preheating the surface to be adhered, and the powders are fused together to form one adhesive layer 7 on the surface to be adhered. After that, another bonding member 5 is superimposed on the surface to be bonded via this adhesive layer 7 and heated.
The adhesive layer 7 is cured to complete the bonding.

However, conventional powder bonding methods have the following drawbacks.

(1) If the surface to be bonded 1a is preheated extremely, the temperature will rise too much and the adhesive 3 will harden beyond the melting stage. Adhesive 3 could not be spread and melted.

(2) The preheating temperature of the surface 1a to be bonded caused an upward air current, and the powder adhesive 3 was blown up during spraying, resulting in uneven spraying.

[Purpose of the invention]

An object of the present invention is to provide a powder adhesive method that can spray a large amount of powder adhesive, prevent acceleration of hardening during melting, and prevent the powder adhesive from scattering due to rising air currents. It is.

[Disclosure of the invention]

The powder bonding method of the present invention includes a step of preheating a surface to be bonded, a step of scattering a powder adhesive on the preheated surface to be bonded, and a step of preheating the powder adhesive and dispersing the powder on at least the upper and lower surfaces. The method includes a step of forming an adhesive layer in which a body adhesive is melted, and a step of superimposing a joining member on a surface to be bonded via the adhesive layer and curing the adhesive layer by heating.

An embodiment of the present invention will be described based on FIG. Figure 1 shows board material 1 such as plywood in panel manufacturing.
The bonding method is shown in which the plate material 1 is first attached to the heater 2.
The surface to be adhered 1a is heated to a predetermined temperature. In this case, the temperature is the powder adhesive 3 to be sprayed in the next process.
The temperature is such that it does not harden when melted, and for epoxy adhesives it is usually around 180°C.

After preheating, a large amount of powder adhesive 3 is applied on the surface 1a to be adhered.
Then, the sprayed adhesive 3 is again preheated by the heater 2'. The purpose of preheating in this case is to melt at least the surface of the sprayed adhesive 3 and fuse the powder on the surface. Preheating temperature is 200℃
That's about it. In this way, an adhesive layer 4 in which the powders are fused together is formed on the plate material 1. This adhesive layer 4
Since the preheating temperature twice does not reach curing, it is in an uncured state that is not completely cured. In this state, another plate material 5 is placed on top of the plate material 1, and the adhesive layer 4 is heated and cured to bond both the plate materials 1 and 5 together.

In this case, the adhesive layer 4 does not need to be completely melted to the inside, and as shown in FIG. 6 may be present. In particular, when a large amount of adhesive 3 is sprayed, the adhesive layer 4 is formed as shown in FIG. In this case, the unmelted portion 6 is likely to be present. Even with such an adhesive layer 4, the unmelted portion 6 is melted and hardened by heating during bonding, so the adhesive properties are unlikely to be affected, and there is no wastage of heat used due to excessive preheating. There is an advantage.

〔Effect of the invention〕

According to this invention, it is possible to preheat at an appropriate temperature, and it is also possible to form a molten adhesive layer by dispersing a large amount of powder adhesive onto the surface to be bonded without excessive preheating. It has the advantage of suppressing the curing reaction during melting and preventing the adhesive from scattering due to rising air currents.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of an embodiment of the present invention, FIG. 2 is an enlarged sectional view of an adhesive layer, and FIG. 3 is an explanatory diagram of a conventional powder bonding method. 1... Board material, 1a... Surface to be adhered, 2, 2'...
Heater, 3...Powder adhesive, 4...Adhesive layer, 5
...Plate material (joining member), 6...Unfused part.

Claims (1)

[Claims] 1 A step of preheating the surface to be bonded, a step of spraying powder adhesive on the preheated surface to be bonded, and a step of preheating the sprayed powder adhesive to create an adhesive in which at least the powder adhesive on the upper and lower surfaces is melted. a step of forming a layer;
A powder adhesion method comprising the steps of: stacking a bonding member on a surface to be bonded via the adhesive layer and curing the adhesive layer by heating.