JP2001168505A - Method of mounting work provided with bump - Google Patents
Method of mounting work provided with bumpInfo
- Publication number
- JP2001168505A JP2001168505A JP34983899A JP34983899A JP2001168505A JP 2001168505 A JP2001168505 A JP 2001168505A JP 34983899 A JP34983899 A JP 34983899A JP 34983899 A JP34983899 A JP 34983899A JP 2001168505 A JP2001168505 A JP 2001168505A
- Authority
- JP
- Japan
- Prior art keywords
- work
- adhesive
- bumps
- mounting
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フリップチップな
どのバンプ付きワークをプリント基板などのワークに実
装するバンプ付きワークの実装方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a work with bumps on a work such as a printed circuit board.
【０００２】[0002]
【従来の技術】フリップチップなどのバンプ付きワーク
は、一般に、接着剤によりプリント基板などのワークに
ボンディングして実装される。接着剤としては、一般
に、例えばエポキシ樹脂などの熱硬化性の接着剤が用い
られている。図３は、従来の熱硬化性の接着剤の加熱温
度図であって、横軸は時間ｔ，縦軸は温度℃である。図
中、ＴＢ’は接着剤の加熱温度、Ｔｍは接着剤に含まれ
た硬化促進剤の硬化促進温度である。図示するように、
硬化促進温度Ｔｍよりやや高い加熱温度ＴＢ’（温度差
ΔＴ’＝ＴＢ’−Ｔｍ）で接着剤を加熱して硬化させる
ようになっている。従来、硬化に要する時間は一般に３
０秒程度である。2. Description of the Related Art In general, a work having a bump such as a flip chip is mounted on a work such as a printed board by bonding with an adhesive. As the adhesive, a thermosetting adhesive such as an epoxy resin is generally used. FIG. 3 is a heating temperature diagram of a conventional thermosetting adhesive, in which the horizontal axis represents time t and the vertical axis represents temperature ° C. In the figure, TB 'is the heating temperature of the adhesive, and Tm is the curing acceleration temperature of the curing accelerator contained in the adhesive. As shown
The adhesive is heated and cured at a heating temperature TB ′ (temperature difference ΔT ′ = TB′−Tm) slightly higher than the curing acceleration temperature Tm. Conventionally, the time required for curing is generally 3
It is about 0 seconds.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら従来の実
装方法では、接着剤の内部にボイド（気泡）が生じやす
い。このボイドはバンプ付きワークのボンディング不良
の原因となり、またバンプ付きワークの駆動にともなう
ヒートサイクルにより膨張収縮を繰り返し、その結果、
実装構造が破壊され、またバンプ付きワークにダメージ
を与える。However, in the conventional mounting method, voids (bubbles) are easily generated inside the adhesive. This void causes bonding failure of the work with bumps, and expands and contracts repeatedly due to the heat cycle accompanying the drive of the work with bumps. As a result,
The mounting structure is destroyed and damages the work with bumps.
【０００４】ボイドの発生原因は、第１には、バンプ付
きワークを接着剤が塗布されたワークに搭載する際にエ
アを巻き込むためである。また第２には、バンプ付きワ
ークの下面には空気中の湿気が付着しやすいものであ
り、この湿気が、接着剤を熱硬化させる際の加熱により
蒸発気化するためである。[0004] The first cause of the void is that air is involved when the work with bumps is mounted on the work to which the adhesive is applied. Second, moisture in the air tends to adhere to the lower surface of the work with bumps, and this moisture is evaporated and evaporated by heating when the adhesive is thermally cured.
【０００５】また従来方法では、接着剤の硬化にかなり
の時間（上述のように、一般に３０秒程度）を要するた
め、実装能率があがらず、生産性が低いものであった。Further, in the conventional method, a considerable amount of time is required for curing the adhesive (generally, about 30 seconds as described above), so that the mounting efficiency is not improved and the productivity is low.
【０００６】したがって本発明は、上記のような問題点
を解消できるバンプ付きワークの実装方法を提供するこ
とを目的とする。Accordingly, an object of the present invention is to provide a mounting method of a work with bumps which can solve the above-mentioned problems.
【０００７】[0007]
【課題を解決するための手段】本発明は、バンプ付きワ
ークのバンプを他方のワークのパッドに接合して実装す
るバンプ付きワークの実装方法であって、ワークの上面
に熱硬化性の接着剤を施す工程と、バンプ付きワークの
バンプをワークのパッドに位置合わせしてバンプ付きワ
ークをワークに搭載する工程と、加熱手段により接着剤
を低温度で加熱しながら、バンプ付きワークを押圧する
ことにより、接着剤の内部のエアを外部へ押し出す工程
と、前記低温度よりも高い高温度で接着剤を加熱するこ
とにより接着剤を硬化させる工程と、を含む。SUMMARY OF THE INVENTION The present invention relates to a method of mounting a work with bumps, wherein a bump of a work with bumps is joined to a pad of another work and mounted, and a thermosetting adhesive is provided on the upper surface of the work. Applying the bumped work to the work pad and positioning the bumped work on the work, and pressing the bumped work while heating the adhesive at a low temperature by a heating means. To extrude the air inside the adhesive to the outside, and to cure the adhesive by heating the adhesive at a high temperature higher than the low temperature.
【０００８】この構成によれば、加熱手段により接着剤
を低温度で加熱しながら、バンプ付きワークを加圧する
ことにより、接着剤の内部のエアを外部へ押し出すこと
ができる。According to this structure, the air inside the adhesive can be pushed out by pressing the work with bumps while heating the adhesive at a low temperature by the heating means.
【０００９】また本発明は、バンプ付きワークのバンプ
を他方のワークのパッドに接合して実装するバンプ付き
ワークの実装方法であって、ワークの上面に熱硬化性の
接着剤を施す工程と、バンプ付きワークを加熱すること
により、前記バンプ付きワークの表面に付着する湿気を
蒸発させて除去する工程と、バンプ付きワークのバンプ
をワークのパッドに位置合わせしてバンプ付きワークを
ワークに搭載する工程と、加熱手段により接着剤を加熱
することにより接着剤を硬化させる工程と、を含む。The present invention also relates to a method of mounting a work with bumps, wherein a bump of a work with bumps is bonded to a pad of the other work and mounted, wherein a step of applying a thermosetting adhesive to the upper surface of the work; Heating the work with bumps to evaporate and remove the moisture adhering to the surface of the work with bumps, and mounting the work with bumps by aligning the bumps of the work with bumps with the pads of the work; And a step of curing the adhesive by heating the adhesive by a heating means.
【００１０】この構成によれば、ボイドの発生原因とな
る湿気を予め蒸発させて除去できるので、ボイドの発生
を防止できる。[0010] According to this configuration, moisture, which causes voids, can be removed by evaporating in advance, so that voids can be prevented.
【００１１】[0011]
【発明の実施の形態】以下、本発明の実施の形態を図面
を参照しながら説明する。図１は本発明の一実施の形態
におけるバンプ付きワークの実装方法の説明図であっ
て、（ａ）、（ｂ）、（ｃ）は工程順に示している。ま
た図２は同熱硬化性の接着剤の加熱温度図である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view of a mounting method of a work with bumps according to an embodiment of the present invention, wherein (a), (b) and (c) are shown in the order of steps. FIG. 2 is a heating temperature diagram of the thermosetting adhesive.
【００１２】図１（ａ）において、プリント基板１の上
面には回路パターンのパッド２が形成されており、プリ
ント基板１上に熱硬化性の接着剤３を施す。本実施の形
態では、ボンド塗布器により接着剤３を塗布するもので
あるが、フィルム状の接着剤をプリント基板に貼着する
などの他の方法で接着剤を施してもよい。In FIG. 1A, pads 2 of a circuit pattern are formed on the upper surface of a printed board 1, and a thermosetting adhesive 3 is applied on the printed board 1. In the present embodiment, the adhesive 3 is applied by a bond applicator, but the adhesive may be applied by another method such as attaching a film-like adhesive to a printed circuit board.
【００１３】次に、図１（ｂ）に示すように、バンプ付
きワーク４をプリント基板１に搭載する。図１（ｂ）に
おいて、バンプ付きワーク４の下面にはバンプ５が複数
突設されている。１０は搭載ヘッドであって、ヒータな
どの加熱手段１１が内蔵されている。搭載ヘッド１０は
昇降手段１２に保持されており、昇降手段１２が駆動す
ることにより昇降する。また搭載ヘッド１０には押圧手
段１３が備えられている。加熱手段１１、昇降手段１
２、押圧手段１３などは制御部１４により制御される。
加熱手段１１は、制御部１４の指令に基づいてその発熱
温度が制御される。Next, as shown in FIG. 1B, the work 4 with bumps is mounted on the printed circuit board 1. In FIG. 1B, a plurality of bumps 5 are provided on the lower surface of the work 4 with bumps. Reference numeral 10 denotes a mounting head, in which a heating means 11 such as a heater is built. The mounting head 10 is held by elevating means 12, and is moved up and down by driving the elevating means 12. The mounting head 10 is provided with a pressing means 13. Heating means 11, lifting means 1
2. The control means 14 controls the pressing means 13 and the like.
Heating temperature of the heating unit 11 is controlled based on a command from the control unit 14.
【００１４】図１（ｂ）において、バンプ５とパッド２
は位置合わせされ、搭載ヘッド１０を下降させることに
より、バンプ５をパッド２に着地させ、バンプ付きワー
ク４をプリント基板１に搭載する。バンプ付きワーク４
は搭載ヘッド１０の下面に真空吸着して保持される。な
お、バンプ５とパッド２の位置合わせ方法などの周知手
段については説明を省略する。In FIG. 1B, the bump 5 and the pad 2
The bumps 5 are landed on the pads 2 by lowering the mounting head 10, and the work 4 with bumps is mounted on the printed circuit board 1. Work 4 with bump
Is held on the lower surface of the mounting head 10 by vacuum suction. Description of well-known means such as a method of aligning the bump 5 and the pad 2 will be omitted.
【００１５】次に、図１（ｃ）に示すように、接着剤３
を加熱手段１１により加熱しながら、押圧手段１３によ
りバンプ付きワーク４を押圧してプリント基板１に押し
付ける。図２は、接着剤３の加熱方法を示している。図
２において、横軸は時間ｔ、縦軸は温度℃である。また
ＴＡは接着剤の１次加熱温度、ＴＢは同２次加熱温度で
ある。またＴｍは接着剤３に含まれる硬化促進剤（硬化
剤）の硬化促進温度（硬化温度）である。本形態では、
ＴＢは約２００℃以上の高温度、ＴＡは７０〜１５０℃
程度の低温度、Ｔｍは１８０℃程度の中温度である。す
なわち、ＴＢ＞Ｔｍ＞ＴＡである。また１次加熱の時間
ｔ１は１〜３秒程度、２次加熱温度ＴＢへの移行時間ｔ
２は１〜２秒程度、２次加熱時間ｔ３は５〜７秒程度で
あって、接着剤３の加熱硬化に要する全時間（ｔ１＋ｔ
２＋ｔ３）は７〜１０秒程度である。Next, as shown in FIG. 1C, the adhesive 3
Is heated by the heating means 11, the work 4 with bumps is pressed by the pressing means 13 and pressed against the printed circuit board 1. FIG. 2 shows a method of heating the adhesive 3. In FIG. 2, the horizontal axis is time t, and the vertical axis is temperature ° C. TA is the primary heating temperature of the adhesive, and TB is the secondary heating temperature. Tm is a curing acceleration temperature (curing temperature) of the curing accelerator (curing agent) included in the adhesive 3. In this embodiment,
TB is high temperature of about 200 ° C or more, TA is 70-150 ° C
Tm is a medium temperature of about 180 ° C. That is, TB>Tm> TA. The primary heating time t1 is about 1 to 3 seconds and the transition time t to the secondary heating temperature TB.
2 is about 1 to 2 seconds, the secondary heating time t3 is about 5 to 7 seconds, and the total time (t1 + t
2 + t3) is about 7 to 10 seconds.
【００１６】さて、図１（ｃ）において、バンプ付きワ
ーク４を押圧しながら、接着剤３を１次加熱温度（低温
度）ＴＡで加熱する。この場合、１次加熱温度ＴＡは硬
化促進剤の硬化促進温度（中温度）Ｔｍよりも低いの
で、接着剤３の硬化は促進されず、したがって接着剤３
は柔らかく流動性を有している。したがって柔かい接着
剤３を押圧（加圧）することにより、これに含まれるエ
アは外部へ押し出される。In FIG. 1C, the adhesive 3 is heated at the primary heating temperature (low temperature) TA while pressing the work 4 with bumps. In this case, since the primary heating temperature TA is lower than the curing acceleration temperature (medium temperature) Tm of the curing accelerator, the curing of the adhesive 3 is not promoted, and therefore the adhesive 3
Is soft and fluid. Therefore, when the soft adhesive 3 is pressed (pressed), the air contained therein is pushed out.
【００１７】次に接着剤３の加熱温度を２次加熱温度
（高温度）ＴＢへ上昇させる。２次加熱温度ＴＢは硬化
促進温度Ｔｍよりも高いので、接着剤３は速かに硬化
し、バンプ付きワーク４はプリント基板１に完全にボン
ディングされる。以上により、バンプ付きワーク４の実
装は終了するが、接着剤３に巻き込まれたエアを加圧し
て押し出したことにより、接着剤３中にボイドは発生せ
ず、バンプ付きワーク４をプリント基板１にしっかり実
装できる。Next, the heating temperature of the adhesive 3 is increased to a secondary heating temperature (high temperature) TB. Since the secondary heating temperature TB is higher than the curing acceleration temperature Tm, the adhesive 3 is quickly cured, and the work 4 with bumps is completely bonded to the printed circuit board 1. As described above, the mounting of the work 4 with bumps is completed. However, since the air entrapped in the adhesive 3 is pressed and extruded, no voids are generated in the adhesive 3 and the work 4 with bumps is attached to the printed circuit board 1. Can be implemented firmly.
【００１８】ところで、図１（ｂ）において、バンプ付
きワーク４の下面などの表面には空気中の湿気が付着し
ており、この湿気がボイドの原因になることは上述した
とおりである。そこで、好ましくは、バンプ付きワーク
４をプリント基板１に搭載する前に、バンプ付きワーク
４を好ましくは１００℃以上に加熱して、この湿気を蒸
発させて除去する。加熱手段としては、例えば上記加熱
手段１１を用いることができる。このように、湿気を蒸
発除去させたうえで、バンプ付きワーク４をプリント基
板１に搭載すれば、ボイドの発生を抑制することができ
る。In FIG. 1B, moisture in the air adheres to the surface such as the lower surface of the work 4 with bumps, and this moisture causes voids as described above. Therefore, preferably, before mounting the work 4 with bumps on the printed circuit board 1, the work 4 with bumps is heated to preferably 100 ° C. or higher to evaporate and remove the moisture. As the heating means, for example, the heating means 11 can be used. As described above, if the work 4 with bumps is mounted on the printed circuit board 1 after removing the moisture by evaporation, the generation of voids can be suppressed.
【００１９】また図２において、本発明によれば、２次
加熱温度ＴＢと硬化促進温度Ｔｍとの温度差ΔＴ（ＴＢ
−Ｔｍ）を大きくすることができる。このことは、２次
加熱温度ＴＢを従来の加熱温度ＴＢ’（図３）よりも高
くして、接着剤３を従来よりも短時間で硬化させること
ができることを意味する。すなわち、従来は、加熱温度
を高くして短時間で接着剤を硬化させると、エアが残っ
てしまうため、比較的低温の加熱温度ＴＢ’でゆっくり
加熱していたものであり、このため接着剤を硬化させる
ために長時間（３０秒程度）を要しており、このため実
装能率があがらず、生産性が低かったものである。これ
に対し本方法は、硬化が促進されるぎりぎりの温度で接
着剤３を加熱するので、接着剤３が軟化し、エア抜きを
短時間で済ませることができる。そしてその後はボイド
の心配がないので、２次加熱温度ＴＢを従来の加熱温度
ＴＢ’よりも高温度にして（すなわちΔＴ＞ΔＴ’にし
て）速かに硬化させることができるので、硬化に要する
全時間を大巾に短縮し（上記したように、例えば７〜１
０秒程度）、実装能率をあげて生産性を向上させること
ができる。このように本方法は、エア抜き工程と硬化工
程に分けることによって、短時間での実装を可能とした
ものである。In FIG. 2, according to the present invention, the temperature difference ΔT (TB) between the secondary heating temperature TB and the curing acceleration temperature Tm is shown.
−Tm) can be increased. This means that the adhesive 3 can be cured in a shorter time than before by setting the secondary heating temperature TB higher than the conventional heating temperature TB '(FIG. 3). That is, conventionally, when the heating temperature is increased and the adhesive is cured in a short time, air remains, so that the heating is performed slowly at a relatively low heating temperature TB ′. It takes a long time (approximately 30 seconds) to cure the film, and thus the mounting efficiency is not improved and the productivity is low. On the other hand, in the present method, the adhesive 3 is heated at a temperature just before the curing is promoted, so that the adhesive 3 is softened and the air can be removed in a short time. Then, since there is no fear of voids, the secondary heating temperature TB can be set to a higher temperature than the conventional heating temperature TB '(that is, ΔT>ΔT'), and the curing can be rapidly performed. The total time is greatly reduced (for example, as described above,
(Approximately 0 seconds), it is possible to improve the mounting efficiency and improve the productivity. As described above, the present method enables the mounting in a short time by dividing into the air bleeding step and the curing step.
【００２０】[0020]
【発明の効果】以上説明したように本発明によれば、ボ
イドの発生を防止し、バンプ付きワークを他のワークに
しっかり接着することができる。また接着剤を高温度で
加熱して速かに硬化させることができるので、実装能率
が向上し、生産性をあげることができる。As described above, according to the present invention, generation of voids can be prevented, and a work with bumps can be firmly bonded to another work. Further, since the adhesive can be heated at a high temperature and quickly cured, the mounting efficiency is improved and the productivity can be improved.
【図１】本発明の一実施の形態におけるバンプ付きワー
クの実装方法の説明図FIG. 1 is an explanatory diagram of a mounting method of a work with bumps according to an embodiment of the present invention.
【図２】本発明の一実施の形態における熱硬化性の接着
剤の加熱温度図FIG. 2 is a heating temperature diagram of a thermosetting adhesive according to one embodiment of the present invention.
【図３】従来の熱硬化性の接着剤の加熱温度図FIG. 3 is a heating temperature diagram of a conventional thermosetting adhesive.
１ プリント基板 ２ パッド ３ 接着剤 ４ バンプ付きワーク ５ バンプ １０ 搭載ヘッド １１ 加熱手段 １２ 昇降手段 １３ 押圧手段 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Pad 3 Adhesive 4 Work with a bump 5 Bump 10 Mounting head 11 Heating means 12 Elevating means 13 Pressing means
フロントページの続き (72)発明者 吉永 誠一 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 5E319 AA03 AB05 BB20 CC61 CD04 GG15 GG20 5F044 LL01 LL05 RR19 5F061 AA01 BA03 CA10 CB02 DA16 DB01 Continuation of front page (72) Inventor Seiichi Yoshinaga 1006 Kadoma, Kazuma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.F-term (reference)
Claims (7)
のパッドに接合して実装するバンプ付きワークの実装方
法であって、 ワークの上面に熱硬化性の接着剤を施す工程と、バンプ
付きワークのバンプをワークのパッドに位置合わせして
バンプ付きワークをワークに搭載する工程と、加熱手段
により接着剤を低温度で加熱しながらバンプ付きワーク
を押圧することにより、接着剤の内部のエアを外部へ押
し出す工程と、前記低温度よりも高い高温度で接着剤を
加熱することにより接着剤を硬化させる工程と、を含む
ことを特徴とするバンプ付きワークの実装方法。1. A method of mounting a bumped work, wherein a bump of a bumped work is bonded to a pad of another work and mounted thereon, wherein a step of applying a thermosetting adhesive to an upper surface of the work; The process of aligning the bumps with the pads of the work and mounting the work with the bumps on the work, and pressing the work with the bumps while heating the adhesive at a low temperature by the heating means, removes the air inside the adhesive. A method for mounting a work with bumps, comprising: a step of extruding to the outside; and a step of curing the adhesive by heating the adhesive at a high temperature higher than the low temperature.
以上あることを特徴とする請求項１記載のバンプ付きワ
ークの実装方法。2. The temperature difference between the low temperature and the high temperature is 20 ° C.
2. The method for mounting a work with bumps according to claim 1, wherein:
前記低温度が硬化促進剤の硬化促進温度よりも低いこと
を特徴とする請求項１または２記載のバンプ付きワーク
の実装方法。3. The adhesive contains a curing accelerator,
3. The method according to claim 1, wherein the low temperature is lower than a curing acceleration temperature of a curing accelerator.
前記高温度が、硬化促進剤の硬化促進温度よりも高いこ
とを特徴とする請求項１または２記載のバンプ付きワー
クの実装方法。4. The adhesive contains a curing accelerator,
3. The method according to claim 1, wherein the high temperature is higher than a curing acceleration temperature of a curing accelerator.
前記低温度が硬化促進剤の硬化促進温度よりも低く、ま
た前記高温度が、硬化促進剤の硬化促進温度よりも高い
ことを特徴とする請求項１または２記載のバンプ付きワ
ークの実装方法。5. The method according to claim 1, wherein the adhesive contains a curing accelerator.
The method according to claim 1, wherein the low temperature is lower than a curing acceleration temperature of the curing accelerator, and the high temperature is higher than a curing acceleration temperature of the curing accelerator.
する前に、前記バンプ付きワークを加熱することによ
り、前記バンプ付きワークの表面に付着する湿気を蒸発
させて除去することを特徴とする請求項１〜５のいずれ
かに記載のバンプ付きワークの実装方法。6. The method according to claim 1, wherein, before mounting the work with bumps, the work with bumps is heated to evaporate and remove moisture adhering to the surface of the work with bumps. Item 6. The method for mounting a work with bumps according to any one of Items 1 to 5.
のパッドに接合して実装するバンプ付きワークの実装方
法であって、 ワークの上面に熱硬化性の接着剤を施す工程と、バンプ
付きワークを加熱することにより、前記バンプ付きワー
クの表面に付着する湿気を蒸発させて除去する工程と、
バンプ付きワークのバンプをワークのパッドに位置合わ
せしてバンプ付きワークをワークに搭載する工程と、加
熱手段により接着剤を加熱することにより接着剤を硬化
させる工程と、を含むことを特徴とするバンプ付きワー
クの実装方法。7. A method for mounting a bumped work, wherein a bump of the bumped work is bonded to a pad of another work and mounted thereon, wherein a step of applying a thermosetting adhesive to an upper surface of the work; By heating, the step of evaporating and removing the moisture attached to the surface of the work with bumps,
And a step of mounting the bumped work on the work by aligning the bumps of the bumped work with the work pads, and curing the adhesive by heating the adhesive by a heating unit. How to mount a work with bumps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34983899A JP2001168505A (en) | 1999-12-09 | 1999-12-09 | Method of mounting work provided with bump |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34983899A JP2001168505A (en) | 1999-12-09 | 1999-12-09 | Method of mounting work provided with bump |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001168505A true JP2001168505A (en) | 2001-06-22 |
Family
ID=18406464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34983899A Pending JP2001168505A (en) | 1999-12-09 | 1999-12-09 | Method of mounting work provided with bump |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001168505A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007227708A (en) * | 2006-02-24 | 2007-09-06 | Elpida Memory Inc | Semiconductor device and its manufacturing method |
| CN100341128C (en) * | 2004-02-06 | 2007-10-03 | 精工爱普生株式会社 | Manufacturing method and manufacturing apparatus for semiconductor device |
| CN115064454A (en) * | 2022-06-06 | 2022-09-16 | 重庆平创半导体研究院有限责任公司 | Interconnection method of power chips |
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| JPH02137393A (en) * | 1988-11-18 | 1990-05-25 | Nec Corp | Mounting of semiconductor device |
| JPH09219579A (en) * | 1996-02-13 | 1997-08-19 | Oki Electric Ind Co Ltd | Connecting method and device of electronic part |
| JPH104124A (en) * | 1996-06-17 | 1998-01-06 | Matsushita Electric Ind Co Ltd | Bonding of work with bump |
| JPH1017649A (en) * | 1996-07-03 | 1998-01-20 | Otsuka Chem Co Ltd | Curing accelerator for epoxy resin, and epoxy resin composition containing the same |
| JPH10223686A (en) * | 1997-02-05 | 1998-08-21 | Nec Corp | Semiconductor mounting method |
| JPH1131716A (en) * | 1997-07-11 | 1999-02-02 | Hitachi Ltd | Manufacture of semiconductor device and semiconductor chip |
| JPH1167836A (en) * | 1997-08-21 | 1999-03-09 | Fujitsu Ltd | Method for mounting semiconductor chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02137393A (en) * | 1988-11-18 | 1990-05-25 | Nec Corp | Mounting of semiconductor device |
| JPH09219579A (en) * | 1996-02-13 | 1997-08-19 | Oki Electric Ind Co Ltd | Connecting method and device of electronic part |
| JPH104124A (en) * | 1996-06-17 | 1998-01-06 | Matsushita Electric Ind Co Ltd | Bonding of work with bump |
| JPH1017649A (en) * | 1996-07-03 | 1998-01-20 | Otsuka Chem Co Ltd | Curing accelerator for epoxy resin, and epoxy resin composition containing the same |
| JPH10223686A (en) * | 1997-02-05 | 1998-08-21 | Nec Corp | Semiconductor mounting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100341128C (en) * | 2004-02-06 | 2007-10-03 | 精工爱普生株式会社 | Manufacturing method and manufacturing apparatus for semiconductor device |
| JP2007227708A (en) * | 2006-02-24 | 2007-09-06 | Elpida Memory Inc | Semiconductor device and its manufacturing method |
| CN115064454A (en) * | 2022-06-06 | 2022-09-16 | 重庆平创半导体研究院有限责任公司 | Interconnection method of power chips |
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