JP2003197806A - Manufacturing method for wiring base board and wiring base board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently manufacture a wiring base board, improved in adhesiveness between the base board and a semiconductor chip while capable of obtaining stabilized adhesive strength as well as electric connection. <P>SOLUTION: Wiring circuits 12a, 12b and connection electrodes 13a, 13b for connecting a veer are formed on an insulating resin film 11 containing a thermoplastic resin. Further, an inflated part 11e is formed on the surface of the mounting part of an IC bare chip 14 on the resin film 11. The IC bare chip 14 is adhered to the resin film 11 through hot pressing from this condition. Air will not be bitten between the IC bare chip 14 and the resin film 11 by forming the inflated part 11e whereby the adhesiveness between them is improved. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a wiring board in which a wiring circuit and a semiconductor chip are provided on an insulating resin base material, and the wiring board.

[0002]

2. Description of the Related Art When an IC chip is barely mounted on a substrate on which a wiring circuit is formed, conventionally, for example, a thermosetting resin substrate such as epoxy resin is used, and C is mounted on the resin substrate.
After forming the u wiring, it is a general method to fix the IC chip using a thermosetting adhesive or the like.

For example, a method of mounting an IC chip at a predetermined position on a resin substrate and then filling a space provided between the lower surface of the IC chip and the resin substrate with a liquid resin adhesive is disclosed in Japanese Patent Application Laid-Open No. Hei 10-19990 No. 11-345918. In addition to this, after supplying a thermosetting insulating resin adhesive to a predetermined position on the resin substrate, thermocompression bonding the IC chip to this position to cure and fix the resin adhesive, etc. It has been known.

[0004]

However, as described above, when an IC chip is mounted on a thermosetting resin substrate, an adhesive is used to fix the IC chip, which reduces the material cost. It is expensive, and the production efficiency is poor because the adhesive injection process is required.

If there is an inclusion such as a resin adhesive between the IC chip and the resin substrate, the reliability of the adhesive strength with respect to changes in the environmental temperature may be reduced. In particular, in the combination of an IC chip and a resin substrate made of a thermosetting resin, and a thermosetting adhesive between them, the thermal characteristics of each material are intricately entangled with each other, and the mechanical stress caused by the temperature change of the use environment causes adhesion. There is a high possibility that the reliability of strength will be reduced.

Further, in general, thermosetting resin adhesives are
For example, it has higher hygroscopicity and lower flexibility than thermoplastic resins. Therefore, in order to realize a multilayer substrate structure in which an IC chip is built in a resin substrate with the above material system,
For example, it is not possible to withstand a rapid temperature change such as when mounting a component due to solder reflow, and there is a possibility that the rate of occurrence of defective products due to blistering, cracking, etc. may increase. Therefore,
Recently, it has been considered to use a thermoplastic resin as an adhesive for fixing an IC chip.

On the other hand, in recent years, attention has been paid to using a thermoplastic resin as a material for a substrate. The thermoplastic resin facilitates molding of the wiring pattern and the like and has a re-fusion property due to heat. Therefore, the resin substrate, the IC chip, and the resin substrates are firmly fixed to each other without using an adhesive. It becomes possible.

However, when a thermoplastic resin is used as the substrate, when the IC chip is pressure-bonded at a high temperature, the resin substrate is apt to be deformed due to a decrease in elastic modulus, and air is blown below the IC chip. May bite. In this case, air pockets may occur between the IC chip and the resin substrate, the adhesive area between the resin substrate and the IC chip may be reduced, and the IC chip may be inclined and fixed. For example, when a connection electrode formed by solidifying a soft conductor material is provided on a resin substrate, the adhesion between the connection electrode and the stud bump of the IC chip may deteriorate. Thus, there has been a problem that the electrical and mechanical connection stability is lowered and the production yield is lowered.

The present invention has been made in view of the above problems, and it is possible to efficiently provide a wiring board in which the adhesion between the board and the semiconductor chip is improved and stable adhesive force and electrical connection are obtained. An object of the present invention is to provide a method for manufacturing a wiring board that can be manufactured.

[0010]

In order to solve the above-mentioned problems, the present invention provides a method of manufacturing a wiring board in which a wiring circuit and one or more semiconductor chips are provided on an insulating resin base material. The base material is made of a material containing a thermoplastic resin, the insulating resin base material is formed so that the surface of the mounting position of the semiconductor chip swells, and the semiconductor chip is thermocompression bonded to the mounting position. A method for manufacturing a wiring board is provided.

In such a wiring board manufacturing method, since the insulating resin base material containing the thermoplastic resin is used, the semiconductor chip is mounted on the insulating resin base material by thermocompression bonding. At this time, since the insulating resin base material is formed so that the surface of the mounting position of the semiconductor chip swells,
Air is not trapped between the semiconductor chip and the insulating resin base material, and the adhesion between them is enhanced.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing an embodiment example of a wiring board of the present invention.

The wiring board 1 shown in FIG. 1 is a resin film 1.
Wiring circuits 12a and 12b, connection electrodes 13a and 13b for bare connection, and an IC bare chip 14 are mounted on the substrate 1. Such a wiring board 1 is generally called a unit board.

The resin film 11 is an insulating base material formed of a material containing a thermoplastic resin into a film shape having a thickness of, for example, 50 to 200 μm. As this material, for example, a relatively high heat-resistant thermoplastic resin material such as PEEK (polyether ether ketone), PEK (polyether ketone), PEI (polyether imide), PPS (polyphenylene sulfide) is used alone. It Alternatively, a thermosetting resin such as a glass epoxy prepreg material such as FR4 or FR5 mixed with the above thermoplastic resin material may be used. Further, as described later, a material having a heat fusion temperature range in a temperature range not lower than the glass transition temperature and lower than the melting point is desirable.

The wiring circuits 12a and 12b have pattern grooves 11a and 11b formed on the resin film 11, respectively.
Are filled with a conductive paste. The connection electrodes 13a and 13b are formed by forming via holes 11c and 11d penetrating the resin film 11 and then filling the via holes 11c and 11d with a conductive paste. As the conductive paste, for example, a thermoplastic binder containing a highly conductive filler such as Ag particles or Cu particles is desirable.

The IC bare chip 14 has stud bumps 14a and 14b for wiring to the wiring circuits 12a and 12b on electrode pads (not shown) on the lower surface. The IC bare chip 14 is fixed on the resin film 11 by thermocompression bonding. Also, stud bump 1
4a and 14b are corresponding wiring circuits 12a
And 12b, and are electrically connected.

In this wiring board 1, the resin film 11 is formed of an insulating resin material containing a thermoplastic resin. Therefore, by utilizing the high cycle thermoformability of the thermoplastic resin, the pattern grooves 11a and 11b of the wiring circuits 12a and 12b and the via holes 11c and 11d can be easily formed. At the same time, the IC bare chip 14 can be fixed to the resin film 11 by thermocompression bonding. Furthermore, when this wiring board 1 is laminated with another wiring board made of a resin film of the same material, the resin films can be joined together by heat fusion.

As described above, in the wiring board 1, by utilizing the heat-sealing property of the thermoplastic resin, it is not necessary to use an adhesive when mounting the IC bare chip 14 or laminating the resin film 11, and the material can be used. The cost is suppressed and
Manufacturing efficiency increases. Further, as compared with the case of fixing with an adhesive, the reliability of the fixing portion with respect to the environmental temperature is improved.

By the way, an IC is applied to the resin film 11.
When the bare chip 14 is thermocompression bonded, the resin film 11 is likely to be deformed due to a decrease in elastic modulus, and air may be trapped between the resin film 11 and the IC bare chip 14. Therefore, in the present invention, the surface of the mounting position of the IC bare chip 14 on the resin film 11 is bulged in advance, and the IC bare chip 14 is pressure-bonded onto the surface.

Here, FIG. 2 is a cross-sectional view for explaining a method of fixing the IC bare chip 14 to the resin film 11. Before the mounting process of the IC bare chip 14, the wiring circuit 12 is formed on the resin film 11 as shown in FIG.
a and 12b and connection electrodes 13a and 13b are formed in advance. At this time, the bulging portion 11e is formed on the surface where the IC bare chip 14 is mounted.

In this state, the resin film 11 is placed at a high temperature above the glass transition temperature of the material of the resin film 11, for example, to lower the elastic modulus. Then, the IC bare chip 14 is directly pressure-bonded onto the bulging portion 11e. This thermocompression bonding is performed by, for example, the resin film 11 and the IC bare chip 1
4 is sandwiched by hot plates from above and below and pressed. As a result, the resin material of the bulging portion 11e gradually contacts the lower surface of the IC bare chip 14 while gradually spreading from the center portion to the periphery. Therefore, the IC bare chip 1
4 is efficiently discharged between the resin film 11 and the resin film 11, and the resin material contacts and adheres to the entire lower surface of the IC bare chip 14 without forming an air pocket. At the same time, the stud bumps 14a and 14b are pierced and connected to the wiring circuits 12a and 12b, respectively.

By the above method, the adhesion between the IC bare chip 14 and the resin film 11 is enhanced, and these are surely bonded. Also, the stud bumps 14a and 14b
Pierces the wiring circuits 12a and 12b at a correct position with reliability, so that the electrical connection stability between them is improved. Therefore, the high-quality wiring board 1 can be efficiently manufactured at low cost.

Next, with reference to FIGS. 3, 4, 5, and 6, an example of a specific manufacturing process of the wiring board of the present invention will be described. Here, a case where a plurality of semiconductor chips are mounted on one resin film will be described as an example.

FIG. 3 is a cross-sectional view showing a step of forming a wiring circuit and a connection electrode for via connection on a resin film.
Note that FIG. 3 shows only a part of the resin film.

First, an insulating resin material containing a thermoplastic resin is used to form a flat film-like resin film 21 having a thickness of 100 μm, for example. As the resin film 21, as described above, a single thermoplastic resin material having a relatively high heat resistance is used, or a thermosetting resin such as a glass epoxy prepreg material is mixed with the above thermoplastic resin material. Those that have been used are used. Further, a material having high heat resistance, high rigidity and isotropic property is preferable, and further, a material containing a reinforcing filler for suppressing resin shrinkage during heat molding is more preferable.

Next, on the resin film 21, pattern grooves 21a and 21 for forming a wiring circuit are formed.
b or via hole 21c for forming a connection electrode for via connection
And 21d are formed by thermoforming. For this purpose, for example, a transfer jig, which is made of heat-resistant glass or the like and in which the inverted shapes of the pattern grooves 21a and 21b and the via holes 21c and 21d are formed by chemical etching or the like, is used, and the glass transition temperature of the resin film 21 is exceeded. The resin film 21 is pressed by this transfer jig at a high temperature.

The via hole 2 for the resin film 21
1c and 21d are formed by pattern grooves 21a and 2d.
After thermal transfer of only 1b, it may be formed by using a laser or a drill which is a conventional drilling method.

In this embodiment, the pattern grooves 21a and 2a are formed.
The step of the convex portion in the transfer jig for forming 1b is 40
μm, and transfer pressure to the resin film 21 is 25 kg /
cm ²And As a result, the resin film 21 is plastically deformed.
Shape the pattern grooves 21a and 21b and the via holes.
The shapes of 21c and 21d are transferred. Also after this
For example, cool to below the glass transition temperature, and transfer jig
After removing, the via hole 21c and
21d was formed. State of resin film 21 at this time
Is shown in FIG.

As described above, since the material containing the thermoplastic resin is used as the resin film 21, the wiring circuits 22a and 22b and the connection electrode 2 are formed by thermal transfer.
Pattern grooves 21a and 21b for providing 3a and 23b, via holes 21c and 21d, etc. can be easily formed.

Next, as shown in FIG. 3B, the pattern grooves 21a and 21b and the via holes 21c and 21d transferred to the resin film 21 are filled with a conductive paste 25 using, for example, a squeegee 26. And, for example,
After being dried at a temperature of 80 degrees, it is solidified by heat treatment at 150 degrees. The conductive paste 25 is preferably a material containing a binder material containing a thermoplastic resin and a highly conductive filler such as Ag particles or Cu particles.

By this step, the wiring circuits 22a and 22b and the connection electrodes 23a and 23b are formed on the resin film 21.
Is formed. Note that, in FIG. 3B, for example, an intermediate portion of the connection electrodes 23a and 23b is the IC bare chip mounting position 24a.

However, in this state, the pattern groove 21a is formed.
And 21b and the via holes 21c and 21d, the excess conductive paste 25 is filled with the resin film 21.
Adheres to the surface of. Therefore, after the conductive paste 25 is solidified, it is necessary to polish the surface of the resin film 21 to remove the excess conductive paste 25 and flatten the surface of the resin film 21.

In the step of polishing the surface of the resin film 21, for example, an adsorption stage for adsorbing and fixing the resin film 21 has been conventionally used. In this embodiment, surface polishing is performed using this suction stage, and a bulge portion on the resin film 21 is formed at the same time to improve the adhesion with the resin film 21 when the IC bare chip is fixed.

FIG. 4 is a view showing the structure of a suction stage for polishing the surface of the resin film 21. Figure 4
(A) is a plan view of the suction stage, and (B) is a sectional view taken along line XX in (A). In addition,
In FIG. 4, the wiring circuit 2 formed on the resin film 21.
2a and 22b and connection electrodes 23a and 23b are omitted.

The suction stage 27 is made of metal, for example, and has a flat upper surface for mounting the resin film 21 via the auxiliary sheet 28 and a hollow interior as shown in FIG. There is. A plurality of through holes 27a for sucking the placed resin film 21 are provided on the upper surface of the suction stage 27, and, for example, a depressurizing hole 2 for depressurizing the inside of the suction stage 27 from the outside on the side surface, for example.
7b is provided.

The auxiliary sheet 28 is made of an elastic material such as rubber and is attached to the upper surface of the suction stage 27. Further, the auxiliary sheet 28 has a through hole 2 which is provided so as to match the position of the through hole 27 a of the suction stage 27.
8a and other through holes 28 provided irrespective of this
and b are provided respectively. When the resin film 21 is placed on the auxiliary sheet 28, the through holes 27 a and the through holes 28 of the auxiliary sheet 28 are introduced from the inside of the suction stage 27.
The resin film 21 is adsorbed and fixed to the auxiliary sheet 28 by being sucked through a.

By the way, as shown in FIG. 4A, a mounting position 24a on which a plurality of IC bare chips are to be mounted later is determined on the resin film 21. At this time, with the resin film 21 placed on the auxiliary sheet 28, the through hole 27a on the suction stage 27 is formed so as to be located at the center of any IC bare chip mounting position 24a. Similarly, the auxiliary sheet 28
The upper through hole 28a is also formed so as to be located at the center of any of the mounting positions 24a. In addition, auxiliary sheet 2
The other through hole 28b on 8 is formed so as to coincide with the center of another mounting position 24a on the resin film 21.

As a result, at all the mounting positions 24a of the IC bare chips on the resin film 21, any of the through holes 28a and 28b must be positioned immediately below. Therefore, the suction stage 27 and the auxiliary sheet 28 need to be formed according to the mounting position 24a of the IC bare chip on the resin film 21 to be fixed.

Next, FIG. 5 is a sectional view for explaining the surface polishing step of the resin film 21 on the suction stage 27. The resin film 21 is placed on the suction stage 27 via the auxiliary sheet 28, sucked from below and sucked and fixed, and then the surface of the resin film 21 is polished. For this surface polishing, as shown in FIG. 5, for example, a pressure is applied to the flexible polishing film 29a to the resin film 21 through the rotating roller 29b to rotate the rotating roller 29b.
It is desirable that the polishing film 29a is moved in parallel on the resin film 21 while rotating b. As the polishing film 29a, for example, # 400 to # 20
The one coated with No. 00 white alundum abrasive is desirable.

With such a mechanism, the resin film 21
The surface of the resin film 21 is polished while applying pressure to remove the excess conductive paste 25 adhering to the surface and to flatten the surface of the resin film 21 itself. At this time, on the resin film 21, the through hole 28a or 28 is formed immediately below.
Since the portion where b is located bends downward due to the polishing pressure, polishing does not proceed only in this portion. As a result, when the deflection is restored, only the portion above the through hole 28a or 28b on the resin film 21, that is, the IC
Only near the stop of the bare chip mounting position 24a, the surface of the resin film 21 has a raised shape.

For example, the auxiliary sheet 28 has a rubber hardness of 75.
It is made of an elastic body of a degree, and the suction stage 27
When the upper through hole 27a and the through holes 28a and 28b on the auxiliary sheet 28 are all formed in a circular shape having a diameter of 1 mm, the IC bare chip mounting position 24a on the resin film 21 has a diameter of 1.10 mm and a protrusion. A bulge having a height of 5 to 8 μm was formed.

The surface of the resin film 21 is polished without using the auxiliary sheet 28.
Alternatively, the resin film 21 may be directly fixed onto the surface 7.
However, when the resin film 21 is fixed via the elastic auxiliary sheet 28, the shape of the bulging portion can be controlled by adjusting the hardness of the auxiliary sheet 28. For example, when the hardness is increased, the bulge of the bulging portion becomes steep, and conversely, when the hardness is decreased, the bulge portion becomes gentle.

Next, FIG. 6 is a sectional view for explaining the mounting process of the IC bare chip on the resin film 21. Note that FIG. 6 shows only a part of the resin film 21.

As shown in FIG. 6A, the resin film 21 taken out of the suction stage 27 has wiring circuits 22a and 22b and connection electrodes 23a and 23b.
Further, a bulged portion 21e of the resin film 21 is formed at the IC bare chip mounting position 24a between the connection electrodes 23a and 23b. Therefore, thereafter, the IC bare chip 24 is mounted by being heated to a temperature higher than the glass transition temperature of the resin film 21, for example, as shown in FIG. 6 (B).

At this time, after the IC bare chip 24 is placed on the resin film 21, the IC bare chip 24 is thermocompression-bonded to the resin film 21 by being sandwiched from above and below by, for example, a heating plate. At the same time, the stud bumps 24b and 24c provided on the lower surface of the IC bare chip 24 pierce the corresponding wiring circuits 22a and 22b, and these are electrically connected.

Since the bulging portion 21e is formed at the mounting position 24a of the IC bare chip 24, the IC bare chip 2
In the thermocompression bonding of No. 4, as described above, the air between the IC bare chip 24 and the resin film 21 is efficiently discharged. As a result, the resin film 21 comes into contact with the entire lower surface of the IC bare chip 24 and is securely fixed. Further, since no air pocket is formed between the IC bare chip 24 and the resin film 21, the IC bare chip 24 is fixed at the designed position, and the stud bumps 24b and 2
4c is surely connected to the corresponding wiring circuits 22a and 22b.

After that, when wiring boards formed by the same method are laminated, it is possible to bond the respective wiring boards by heat-sealing the resin films 21 to each other. By the way, in order to enhance the adhesion between the IC bare chip 24 and the resin film 21 by the above method, the bulging portion 21
It is necessary that the resin material forming e be efficiently spread on the lower surface of the IC bare chip 24 and uniformly spread over the entire area. For this purpose, it is desirable to devise the shape of the bulged portion 21e to be formed according to the shape of the IC bare chip 24. The shape of the bulging portion 21e is the suction stage 2
The through holes 27a of No. 7 and the through holes 28a and 28b of the auxiliary sheet 28 are formed in accordance with each shape.

FIG. 7 is a diagram showing an example of the shape of these through holes. FIG. 7A shows an example in which an oval through hole 281 is provided at the center of the mounting position 24a of the IC bare chip 24. In this case, the resin material spreads along the rectangular shape of the IC bare chip 24, but the resin material does not reach the most corners, or when it reaches the resin material, the resin material may stick out of the frame of the mounting position 24a. is there.

Therefore, in the example of FIG. 7 (B), a relatively thin strip-shaped through hole 282 is formed facing the front, rear, left and right directions and the diagonal directions. In this case, compared with the example of FIG. 7A, the resin material can be more efficiently spread over the entire lower surface of the IC bare chip 24.

The shapes of these through holes 281 or 282 are the same as the through holes 27a of the suction stage 27 and the auxiliary sheet 2.
8 is preferably applied to both the through holes 28a and 28b, but even when applied to only the through holes 28a and 28b on the auxiliary sheet 28 side, some effects can be obtained. In this case, when the resin film 21 is polished, only the auxiliary sheet 28 is replaced according to the shape of the IC bare chip 24, so that the bulged portion 21e formed.
The shape can be changed, and the manufacturing cost can be further suppressed.

In the above wiring board manufacturing method, the wiring circuits 22a and 2a are formed due to the thermoformability of the thermoplastic resin.
Pattern grooves 21a and 21b for forming 2b
Alternatively, the via holes 21c and 21d for forming the connection electrodes 23a and 23b for via connection can be easily formed by thermal transfer. In addition, due to the heat-sealing property of the thermoplastic resin, it is not necessary to use an adhesive when adhering the IC bare chip 24 to the resin film 21 or laminating the resin films 21 together, so that the material cost is suppressed, and the manufacturing Efficiency is improved.

Thus, while the manufacturing efficiency is improved,
Further, the resin film 21 using the suction stage 27
In the polishing step of
By forming e simultaneously, the bulging portion 21e can be formed at low cost without requiring a special process. Therefore, the IC bare chip 24 and the resin film 2
It is possible to efficiently manufacture the wiring board in which the IC chip 1 and the IC bare chip 24 are reliably bonded and the electrical connection stability between the IC bare chip 24 and the wiring circuits 22a and 22b is improved at low cost.

In the manufacturing process of the wiring board described above, heating is performed twice, at the time of thermoforming the pattern grooves 21a and 21b and the via holes 21c and 21d in the resin film 21, and at the time of thermocompression bonding of the IC bare chip 24. Is done. Also,
When this wiring board is laminated, the resin film 21 may be further heat-sealed thereafter. Therefore, in order to prevent the fusion property of the resin film 21 from decreasing due to heat history, the elastic force of the resin film 21 starts to decrease during thermoforming or thermocompression bonding of the IC bare chip 24. It is desirable to carry out at a temperature slightly above, and to carry out at a temperature closer to the melting point in the subsequent final step such as heat fusion.

However, the laminated resin film 2
It is desirable that the adhesive strength of 1 has high heat resistance.
For this purpose, a material that is amorphous in the state of a flat resin film before thermoforming, such as the pattern grooves 21a and 21b, and that crystallizes at a temperature below the melting point is used as the resin film 21. Is more desirable. When such a material is used, the steps of thermoforming and thermocompression bonding are performed at a temperature not lower than the glass transition temperature and lower than the crystallization temperature, and the final lamination step is performed at a temperature not lower than the crystallization temperature and lower than the melting point. . As a result, the resin film 21 is laminated.
Since the crystallization progresses when these are integrated, the heat resistance of the completed multilayer wiring board is further enhanced.

[0055]

As described above, in the method of manufacturing a wiring board according to the present invention, the use of the insulating resin base material containing the thermoplastic resin allows the semiconductor chip to be fixed by thermocompression bonding without using an adhesive. It becomes possible. In addition, before fixing the semiconductor chip, the insulating resin base material is formed in advance so that the surface of the mounting position of the semiconductor chip swells, so that the air gap between the semiconductor chip and the insulating resin base material during pressure bonding. The adhesiveness of these is increased without biting. Therefore, the semiconductor chip and the insulating resin base material are securely bonded,
Moreover, a wiring board having improved electrical connection stability between the semiconductor chip and the wiring circuit can be efficiently manufactured at low cost.

[Brief description of drawings]

FIG. 1 is a sectional view showing an example of an embodiment of a wiring board of the present invention.

FIG. 2 is a cross-sectional view for explaining a method of fixing an IC bare chip to a resin film.

FIG. 3 is a cross-sectional view showing a step of forming a wiring circuit and a connection electrode for via connection on a resin film.

FIG. 4 is a diagram showing the structure of an adsorption stage for polishing the surface of a resin film.

FIG. 5 is a cross-sectional view for explaining a surface polishing process of a resin film on a suction stage.

FIG. 6 is a cross-sectional view illustrating a step of mounting an IC bare chip on a resin film.

FIG. 7 is a diagram showing a shape example of a through hole formed on a suction stage and an auxiliary sheet.

[Explanation of symbols]

1 ... Wiring board, 11 ... Resin film, 11a, 11
b ... pattern groove, 11c, 11d ... via hole, 11e
... Swelling parts, 12a, 12b ... Wiring circuit, 13a, 1
3b ... connection electrode, 14 ... IC bare chip, 14a,
14b ... Stud bump

Claims (9)

[Claims] 1. A method of manufacturing a wiring board in which a wiring circuit and one or more semiconductor chips are provided on an insulating resin base material, wherein the insulating resin base material is made of a material containing a thermoplastic resin, A method of manufacturing a wiring board, comprising: forming the insulating resin base material so that a surface of a mounting position of the semiconductor chip bulges, and thermocompression-bonding the semiconductor chip to the mounting position. 2. A pattern groove corresponding to the pattern of the wiring circuit is formed on the insulating resin base material formed in a flat film shape, and the pattern groove is filled with a conductive paste for adsorption. On the stage having a through hole, the surface of the pattern groove is faced up, the insulating resin base material is placed so that the mounting position of the semiconductor chip is located on the through hole, and suction is performed from the through hole. Then, the insulating resin base material is adsorbed and fixed, and the surface of the insulating resin base material on which the pattern groove is formed is polished while being pressed to remove the conductive paste adhering to an extra portion other than the pattern groove. After that, the semiconductor chip is thermocompression-bonded to the mounting position, and the method of manufacturing a wiring board according to claim 1. 3. The method for manufacturing a wiring board according to claim 2, wherein the conductive paste fills the pattern groove with a squeegee. 4. The method of manufacturing a wiring board according to claim 2, wherein the shape of the through hole is determined according to the shape of a bulged portion to be formed at the mounting position in the insulating resin substrate. . 5. When a plurality of the semiconductor chips are mounted, on the insulating resin base material formed in a flat film shape,
A pattern groove corresponding to the pattern of the wiring circuit is formed, the pattern groove is filled with a conductive paste, and a plurality of second through holes are provided on a stage having a first through hole for adsorption. Then, an auxiliary sheet provided so that a part of the second through holes is located above the formation position of the first through hole is arranged, and the pattern is formed on the auxiliary sheet. The insulating resin base material is placed such that the surface on which the groove is formed faces upward and the mounting position of each semiconductor chip is located above any of the second through holes.
The insulating resin base material is sucked and fixed by suction through the through hole, and the surface of the insulating resin base material on which the pattern groove is formed is polished while being pressed, and the conductive material adhered to an extra portion other than the pattern groove. The method for manufacturing a wiring board according to claim 1, wherein the semiconductor chip is thermocompression bonded to the mounting position after the conductive paste is removed. 6. The method for manufacturing a wiring board according to claim 5, wherein the conductive paste fills the pattern groove with a squeegee. 7. The wiring board according to claim 5, wherein the shape of the second through hole is determined according to the shape of a bulge portion to be formed at the mounting position in the insulating resin board. Manufacturing method. 8. The method of manufacturing a wiring board according to claim 5, wherein the auxiliary sheet has elasticity. 9. A wiring board having a wiring circuit and a semiconductor chip mounted on an insulating resin base material, wherein the insulating resin base material is made of a material containing a thermoplastic resin, and the insulating resin base material is the semiconductor chip. The wiring board is formed so that the surface of the mounting position is bulged, and the semiconductor chip is thermocompression bonded to the mounting position.