JP2830408B2 - Electronic component bonding method - Google Patents
Electronic component bonding methodInfo
- Publication number
- JP2830408B2 JP2830408B2 JP2191383A JP19138390A JP2830408B2 JP 2830408 B2 JP2830408 B2 JP 2830408B2 JP 2191383 A JP2191383 A JP 2191383A JP 19138390 A JP19138390 A JP 19138390A JP 2830408 B2 JP2830408 B2 JP 2830408B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- solder
- substrate
- temperature
- bonds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、電子部品の電極を基板に半田付けする電子
部品のボンディング方法に関するものである。Description: TECHNICAL FIELD The present invention relates to a method for bonding an electronic component to an electrode of the electronic component by soldering the electrode to a substrate.
（従来の技術） QFPなどのリード（電極）を有する電子部品を基板に
ボンディングする手段として、メッキ手段や半田レベラ
ーにより基板に半田を形成し、この半田にモールド体か
ら延出するリードを着地させて、半田をリフロー手段に
より加熱溶融固化させることにより、リードを基板に固
着する方法が知られている。(Prior art) As a means for bonding an electronic component having a lead (electrode) such as a QFP to a substrate, a solder is formed on the substrate by plating means or a solder leveler, and a lead extending from a mold body is landed on the solder. Then, a method of fixing the lead to the substrate by heating and melting and solidifying the solder by reflow means is known.
このようなボンディング方法にあっては、半田が固化
してリードが基板にしっかり固着されるまでの間に、電
子部品が基板から浮き上って分離するのを防止するため
に、基板に予めボンディングを塗布し、このボンドにモ
ールド体を接着して、電子部品を仮止めしておくことが
行われる。In such a bonding method, before the solder is solidified and the lead is firmly fixed to the substrate, the electronic component is bonded to the substrate in advance to prevent the electronic component from floating and separating from the substrate. Is applied, and a mold body is bonded to this bond to temporarily fix the electronic component.
（発明が解決しようとする課題） リフロー手段においては、一般に、半田は室温から15
0℃程度まで徐々に加熱され、次いで半田の溶融温度
（一般に約183℃）以上の約230℃程度まで加熱される。(Problems to be Solved by the Invention) In reflow means, generally, solder is kept at room temperature for 15 minutes.
It is gradually heated to about 0 ° C. and then heated to about 230 ° C., which is higher than the melting temperature of solder (generally about 183 ° C.).
ところが、室温から230℃位までの広い温度範囲にお
いて、強い接着強度を発揮できるボンドは存在しないこ
とから、モールド体を基板にしっかり仮止めできず、リ
フロー中に、電子部品は基板から浮き上って分離しやす
い問題があった。このような問題は、電極としてリード
を備えたQFPなどの電子部品に限らず、電極として突出
電極（バンプ）を備えたフリップチップなどの電子部品
にも同様にみられるものであった。However, since there is no bond that can exhibit strong adhesive strength in a wide temperature range from room temperature to about 230 ° C, the molded body cannot be temporarily fixed firmly to the substrate, and the electronic component rises from the substrate during reflow. There was a problem that was easy to separate. Such a problem is not limited to an electronic component such as a QFP having a lead as an electrode, but similarly occurs to an electronic component such as a flip chip having a protruding electrode (bump) as an electrode.
したがって本発明は、電子部品の電極を基板にしっか
り半田付けできる電子部品のボンディング方法を提供す
ることを目的とする。Accordingly, an object of the present invention is to provide a bonding method of an electronic component that can securely solder electrodes of the electronic component to a substrate.
（課題を解決するための手段） 本発明は、電子部品の電極を基板に形成された半田に
着地させ、加熱手段によりこの半田を加熱溶融させた
後、固化させることにより、電極を基板に固着するよう
にした電子部品のボンディング方法において、上記基板
に硬化温度の異る複数種のボンドを塗布してこれらのボ
ンドに上記電子部品を接着した後、上記加熱手段により
複数種のボンドと上記半田を同時に室温から上記半田の
溶融温度以上まで加熱するにあたり、まず硬化温度の低
いボンドにより電子部品の仮止め力を確保した後、次い
で硬化温度の高いボンドにより電子部品の仮止め力を確
保し、これにより上記半田を室温からその溶融温度以上
まで加熱する間中、電子部品を上記複数種のボンドが順
に発揮する仮止め力により基板に仮止めしておくもので
ある。(Means for Solving the Problems) According to the present invention, an electrode of an electronic component is landed on a solder formed on a substrate, the solder is heated and melted by a heating unit, and then solidified, thereby fixing the electrode to the substrate. In the method for bonding electronic components, a plurality of types of bonds having different curing temperatures are applied to the substrate, and the electronic components are bonded to these bonds, and then the plurality of types of bonds and the solder are bonded by the heating unit. Simultaneously heating from room temperature to above the melting temperature of the solder, first secure the temporary fixing force of the electronic component by the bond of low curing temperature, then secure the temporary fixing force of the electronic component by the bond of high curing temperature, In this way, while the solder is heated from room temperature to its melting temperature or more, the electronic component is temporarily fixed to the substrate by the temporary fixing force that the plurality of types of bonds sequentially exert. It is a spider.
（作用） 上記構成において、電子部品は硬化温度の異る複数種
のボンドにより基板に接着されていることから、加熱手
段により半田が室温からその溶融温度以上まで加熱され
て溶融し、さらに固化するまでの広い温度範囲の間中、
電子部品は基板にしっかりと仮止めされ、電極を半田に
確実に固着させることができる。(Operation) In the above configuration, since the electronic component is bonded to the substrate by a plurality of types of bonds having different curing temperatures, the solder is heated from room temperature to a temperature equal to or higher than the melting temperature by the heating means, and is further solidified. Throughout the wide temperature range up to
The electronic components are temporarily temporarily fixed to the substrate, and the electrodes can be securely fixed to the solder.
（実施例） 次に、図面を参照しながら本発明の実施例を説明す
る。Example Next, an example of the present invention will be described with reference to the drawings.
第１図において、１は基板、２は電子部品である。こ
の電子部品２は、モールド体３からリード４が延出して
いる。基板１の上面には、銅箔により回路パターン５が
形成されており、この回路パターン５上には、メッキ手
段や半田レベラーにより、半田６が形成されている。上
記リード４は、この半田６上に着地している。7,8は基
板１の上面に塗布された仮止用のボンドであり、モール
ド体３はこのボンド7,8により基板１に接着されてい
る。In FIG. 1, 1 is a substrate, and 2 is an electronic component. In the electronic component 2, leads 4 extend from the molded body 3. A circuit pattern 5 is formed of copper foil on the upper surface of the substrate 1, and a solder 6 is formed on the circuit pattern 5 by a plating means or a solder leveler. The lead 4 lands on the solder 6. Numerals 7 and 8 denote temporary fixing bonds applied to the upper surface of the substrate 1, and the mold body 3 is bonded to the substrate 1 by the bonds 7 and 8.
一方のボンド７は瞬間接着剤であって、室温で重合反
応を生じ、室温から約150℃の温度範囲において強い接
着力を発揮する。このような硬化温度の比較的低いボン
ドとしては、例えばシアノアクリレート樹脂が知られて
いる。On the other hand, the bond 7 is an instant adhesive, which causes a polymerization reaction at room temperature and exerts a strong adhesive force in a temperature range from room temperature to about 150 ° C. As such a bond having a relatively low curing temperature, for example, a cyanoacrylate resin is known.
他方のボンド８は、上記ボンド７よりも硬化温度の高
い接着剤であって、約100℃〜150℃の温度範囲で重合反
応を生じ、約100℃〜230℃以上で強い接着力を発揮す
る。このような接着剤は、例えばアクリルエステル樹脂
に、熱重合開始剤である過酸化物を添加することにより
得られる。The other bond 8 is an adhesive having a higher curing temperature than the above-mentioned bond 7, and causes a polymerization reaction in a temperature range of about 100 ° C. to 150 ° C. and exhibits a strong adhesive force at about 100 ° C. to 230 ° C. or more. . Such an adhesive is obtained, for example, by adding a peroxide which is a thermal polymerization initiator to an acrylic ester resin.
第２図のａは、リフロー手段の一般的な温度プロファ
イルを示している。この温度プロファイルに示されるよ
うに、一般に、リフローにおいては、室温から150℃程
度まで半田を徐々に過熱し、次いでしばらくこの150℃
で均熱した後、半田の溶融温度（183℃）以上の230℃程
度まで一気に加熱することにより、半田を溶融させ、次
いで徐々に冷却することにより、半田を固化する。FIG. 2a shows a general temperature profile of the reflow means. As shown in this temperature profile, generally, in reflow, the solder is gradually heated from room temperature to about 150 ° C.
Then, the solder is melted by heating at a stretch to about 230 ° C. which is higher than the melting temperature (183 ° C.) of the solder, and then gradually cooled to solidify the solder.
図中、ｂは上記ボンド７の温度特性、ｃはボンド８の
温度特性である。一方のボンド７は、室温から約150℃
の温度範囲において、強い接着力を有している。また他
方のボンド８は、150℃以上の温度範囲において、強い
接着力を有している。したがって、半田６が150℃程度
まで加熱される間は、一方のボンド７の接着力により、
電子部品２は基板１に仮止めされる。また150℃の均熱
中には、両ボンド7,8の接着力により仮止めされ、その
後は、一方のボンド７の接着力は急激に低下することか
ら、他方のボンド８の接着力により仮止めされる。In the figure, b indicates the temperature characteristic of the bond 7 and c indicates the temperature characteristic of the bond 8. On the other hand, bond 7 is from room temperature to about 150 ° C.
It has a strong adhesive force in the temperature range described above. The other bond 8 has a strong adhesive force in a temperature range of 150 ° C. or higher. Therefore, while the solder 6 is heated to about 150 ° C., the adhesive force of one bond 7
The electronic component 2 is temporarily fixed to the substrate 1. During the soaking at 150 ° C., the bonding is temporarily stopped by the adhesive force of both bonds 7 and 8, and thereafter, the bonding force of one bond 7 is rapidly reduced. Is done.
このように、電子部品２の基板１に対する仮止め力
は、リフローの進行にともなって、両ボンド7,8により
分担されることから、リード４が半田６に搭載されてか
ら、リフローにより半田６が加熱溶融固化するまでの間
中、電子部品２が基板１から浮き上って分離しないよう
に、しっかり仮止めしておくことができる。As described above, since the temporary fixing force of the electronic component 2 to the substrate 1 is shared by the two bonds 7 and 8 as the reflow proceeds, after the lead 4 is mounted on the solder 6, the solder 6 is reflowed. Until the electronic component 2 is heated, melted and solidified, it can be temporarily fixed firmly so that the electronic component 2 does not float and separate from the substrate 1.
この実施例では、２種類のボンド7,8により、電子部
品２を仮止めしているが、３種類以上のボンドにより仮
止めしてもよいものであり、要はリフローの間中、電子
部品２を基板１に強く接着できればよい。In this embodiment, the electronic component 2 is temporarily fixed by two types of bonds 7 and 8. However, the electronic component 2 may be temporarily fixed by three or more types of bonds. It is sufficient that the substrate 2 can be strongly bonded to the substrate 1.
（発明の効果） 本発明によれば、加熱手段で半田を加熱して溶融させ
る間中、電子部品を基板にしっかり仮止めして、リード
やバンプなどの電極を半田に確実に固着することができ
る。(Effects of the Invention) According to the present invention, while the solder is heated and melted by the heating unit, the electronic component is firmly temporarily fixed to the substrate, and electrodes such as leads and bumps are securely fixed to the solder. it can.
図は本発明の実施例を示すものであって、第１図は基板
に搭載された電子部品の正面図、第２図は温度特性図で
ある。 １……基板 ２……電子部品 ３……モールド体 ４……リード ６……半田 7,8……ボンド1 shows an embodiment of the present invention. FIG. 1 is a front view of an electronic component mounted on a substrate, and FIG. 2 is a temperature characteristic diagram. DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Electronic component 3 ... Mold body 4 ... Lead 6 ... Solder 7,8 ... Bond
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 3/34 H01L 21/52──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H05K 3/34 H01L 21/52
Claims (1)
着地させ、加熱手段によりこの半田を加熱溶融させた
後、固化させることにより、電極を基板に固着するよう
にした電子部品のボンディング方法において、 上記基板に硬化温度の異る複数種のボンドを塗布してこ
れらのボンドに上記電子部品を接着した後、上記加熱手
段により複数種のボンドと上記半田を同時に室温から上
記半田の溶融温度以上まで加熱するにあたり、まず硬化
温度の低いボンドにより電子部品の仮止め力を確保した
後、次いで硬化温度の高いボンドにより電子部品の仮止
め力を確保し、これにより上記半田を室温からその溶融
温度以上まで加熱する間中、電子部品を上記複数種のボ
ンドが順に発揮する仮止め力により基板に仮止めしてお
くことを特徴とする電子部品のボンディング方法。An electronic component bonding method in which an electrode of an electronic component is landed on a solder formed on a substrate, and the solder is heated and melted by a heating means and then solidified to fix the electrode to the substrate. In the method, after applying a plurality of types of bonds having different curing temperatures to the substrate and bonding the electronic component to these bonds, the plurality of types of bonds and the solder are simultaneously melted from room temperature by the heating means from room temperature. When heating to a temperature higher than or equal to the temperature, first secure the temporary fixing force of the electronic component with a bond having a low curing temperature, and then secure the temporary fixing force of the electronic component with a bond with a high curing temperature, and thereby, the solder is removed from room temperature. An electronic component, wherein the electronic component is temporarily fixed to a substrate by a temporary fixing force that the plurality of types of bonds sequentially exert during heating to a temperature equal to or higher than a melting temperature. Bonding method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2191383A JP2830408B2 (en) | 1990-07-19 | 1990-07-19 | Electronic component bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2191383A JP2830408B2 (en) | 1990-07-19 | 1990-07-19 | Electronic component bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0476990A JPH0476990A (en) | 1992-03-11 |
| JP2830408B2 true JP2830408B2 (en) | 1998-12-02 |
Family
ID=16273685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2191383A Expired - Fee Related JP2830408B2 (en) | 1990-07-19 | 1990-07-19 | Electronic component bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2830408B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2682366B2 (en) * | 1992-11-24 | 1997-11-26 | 松下電器産業株式会社 | Bond for temporary fixing of electronic parts |
| JP2008153502A (en) * | 2006-12-19 | 2008-07-03 | Sony Corp | Light emitting device, method of manufacturing light emitting device and image output device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54108273A (en) * | 1978-02-14 | 1979-08-24 | Matsushita Electric Ind Co Ltd | Method of mounting components on circuit board |
| JP2573829B2 (en) * | 1986-08-12 | 1997-01-22 | 恵次 飯村 | Mounting method of surface mount type electronic element and electronic device mounting surface mount type electronic element |
-
1990
- 1990-07-19 JP JP2191383A patent/JP2830408B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0476990A (en) | 1992-03-11 |
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