JPS6157301A - Method of bonding powdered body - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a powder bonding method using a powder adhesive.

[Background technology]

In the manufacture of panels such as floor panels, powder adhesives (such as epoxy adhesives) are used to bond together boards such as plywood.

As shown in FIG. 3, the bonding method using such a powder adhesive first preheats the surface 1a of the plate material 1 to be bonded with a heater 2,
Next, powder adhesive 3 is sprinkled on the surface to be bonded. At this time, the powder adhesive 3 that has been spread is melted by the preheating of the surface to be bonded, and the powders are fused to each other and spread onto the surface to be bonded. One adhesive layer 7 is formed on the surface to be bonded via this adhesive layer 7 (other bonding member 5t) is overlapped and heated to harden the adhesive layer 7 and complete the bonding. do.

However, the conventional powder bonding method had the following drawbacks: (1) If the surface to be bonded 1afc is preheated to an extreme degree, the temperature will rise too much and the adhesive 3 will harden beyond the melting stage. Therefore, there is a limit to the preheating temperature of the surface 1a to be bonded, and for this reason, it was not possible to spread and melt a large amount of the adhesive 3. (2) The preheating temperature of the surface 1a to be bonded causes an upward air current
The powder adhesive 3 flew up during spraying, making it unevenly distributed. [Object of the Invention] The purpose of the present invention is to be able to spray a large amount of powder adhesive, and to accelerate hardening when melted. It is an object of the present invention to provide a powder bonding method that prevents the powder adhesive from scattering due to rising air currents.

[Disclosure of the invention]

The powder bonding method of the present invention includes a step of preheating a surface to be bonded, a step of dispersing a powder adhesive onto the preheated surface to be bonded,
A step of preheating the sprinkled powder adhesive to form an adhesive layer in which at least the powder adhesive on the upper and lower surfaces is melted, and superimposing the joining member on the surface to be bonded via the adhesive layer to form an adhesive layer. (2) also includes the step of heating and converting it into fecal matter.

An embodiment of this invention f! : will be explained based on FIG. FIG. 1 shows a method of adhering a plate material 1 such as plywood in panel manufacturing. First, the surface 1a of the plate material 1 to be adhered to is heated to a predetermined temperature using a heater 2. The temperature in this case is such that the powder adhesive 3 to be sprayed in the next step does not harden when melted, and is usually about 180°C for epoxy adhesives.

After preheating, a large amount of powder adhesive 3 is sprinkled on the surface la to be adhered, and then the sprinkled adhesive 3 is again preheated by the heater 2'. The purpose of the preheating in this case is to melt at least the surface of the sprayed adhesive 3 and fuse the powder on the surface. The preheating temperature Vi is 200'C, i degree. In this way, an adhesive layer 4 in which the powders are fused together is formed on the plate l.

Since this adhesive layer 4 is preheated twice at a temperature that does not reach curing, it is in an uncured state where it has not been completely cured.

In this O state, another plate material 5 is placed on top of the plate material 1, and the adhesive layer 4 is heated and cured to bond both the plate materials 1 and 5 together.

In this case, the adhesive layer 4 does not need to be completely melted to the inside, and as shown in FIG. 6 may be present. In particular, when a large amount of adhesive 3 is sprayed, there is a difference between the first preheating of the surface of the plate material 1 and the second preheating of the surface of the sprayed powder adhesive 3, and the adhesive layer 4 is heated as shown in FIG. As shown in FIG. 2, unmelted portions 6 tend to be present.

Even with such an adhesive layer 4, the unmelted portion 6 is melted and hardened by heating during bonding, so there is no effect on adhesion at all, and the advantage is that there is no waste of heat due to excessive preheating. be.

〔Effect of the invention〕

This invention makes it possible to preheat at an appropriate temperature,
Furthermore, it is possible to form a molten adhesive layer without excessive preheating by dispersing a large amount of powder adhesive onto the surface to be bonded, which suppresses the curing reaction during melting and prevents the adhesive from scattering due to rising air currents. This has the advantage that it can also be prevented.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of an embodiment of the present invention, FIG. 2 is an enlarged sectional view of an adhesive layer, and FIG. 3 is an explanatory diagram of a conventional powder bonding method. DESCRIPTION OF SYMBOLS 1... Board material, 1a... Adhesive surface, 2, 2... Heater, 3... Powder adhesive, 4... Adhesive layer, 5...
・Plate material (joint member), 6...Unfused part Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] A step of preheating a surface to be bonded, a step of spraying a powder adhesive on the preheated surface to be bonded, and a step of preheating the spread adhesive powder to form an adhesive layer in which at least the powder adhesive on the upper and lower surfaces is melted. A powder adhesion method comprising the steps of: forming a bonding member on a surface to be bonded via the adhesive layer, and heating and curing the adhesive layer.