JPS6179293A - Method of mounting electronic part - Google Patents
Method of mounting electronic partInfo
- Publication number
- JPS6179293A JPS6179293A JP59200805A JP20080584A JPS6179293A JP S6179293 A JPS6179293 A JP S6179293A JP 59200805 A JP59200805 A JP 59200805A JP 20080584 A JP20080584 A JP 20080584A JP S6179293 A JPS6179293 A JP S6179293A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- chip
- electronic components
- solder paste
- infrared rays
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Adjustable Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、回路基板への電子部品の取付は方法、特にチ
ップ状電子部品（以下チップ部品と記す。）をはんだ付
けする方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for attaching electronic components to a circuit board, and particularly to a method for soldering chip-shaped electronic components (hereinafter referred to as chip components).
従来例の構成とその問題点
従来回路基板にチップ部品をリフローにてはんだ付けす
る場合の１方法としてソルダーペースト□をスクリーン
印刷あるいはディスペンサーで回路基板の導体部に塗布
し、その上にチップ部品を装着し、その後加熱リフロー
してはんだ付けする方法を用いていた。この方法では、
回路基板上に塗布されたソルダーペーストの粘着性が乏
しいため、チップ部品を装着機で装着する工程において
、回路基板に十分密着保持することができず位置ずれを
生じたり、回路基板導体部に塗布されたソルダペースト
塗布量が均一でないと加熱リフロ一時に均一溶融せず冷
却による固体化にも差を生じ、その結果としてチップ部
品が一方向に引張られたりして位置ずれやチップ部品端
子の浮き上りを生じる。また両面にチップ部品が装着し
ている回路基板のはんだ付は方法では、回路基板の片面
にソルダーペーストを塗布した後、チップ部品を装着し
、その後加熱リフロー行ない、その後、この回路基板を
反転させ、ソルダーペーストを塗布し、チップ部品を装
着し、その後加熱リフローして両面のはんだ付けを行な
っていた。このような方法では片面のチップ部品はたえ
ず２回加熱されるためチップ部品に対する熱ダメージが
大きく、連続大量生産性も低い等の欠点があった。Conventional configuration and its problems Conventionally, one method of reflow soldering chip components to a circuit board is to apply solder paste □ to the conductor part of the circuit board by screen printing or using a dispenser, and then place the chip components on top of it. The method used was to attach it, then heat reflow and solder it. in this way,
Due to the poor adhesion of the solder paste applied to the circuit board, during the process of mounting chip components with a mounting machine, it cannot be held tightly to the circuit board and misalignment may occur, or the solder paste may not be applied to the circuit board conductors. If the applied amount of solder paste is not uniform, it will not melt uniformly during heating and reflowing, and solidification will also vary during cooling. As a result, the chip components may be pulled in one direction, resulting in misalignment or lifting of the chip component terminals. It causes an upslope. In addition, the method for soldering a circuit board with chip components mounted on both sides is to apply solder paste to one side of the circuit board, then mount the chip components, then perform heating reflow, and then turn the circuit board over. , solder paste was applied, chip components were mounted, and then heated and reflowed to solder both sides. In such a method, the chip components on one side are constantly heated twice, which has the drawbacks of large thermal damage to the chip components and low continuous mass productivity.
発明の目的
本発明は」−記従来の欠点を解消するもので、チップ部
品を高粘度の紫外線硬化樹脂または熱硬化樹脂の接着剤
（以下接着剤と記す）で回路基板の片面または両面に仮
止めし、チップ部品装着時および加熱リフロ一時に生じ
る位置づれ、加熱リフロ一時に生じるチップ部品端子の
浮き上りを防止するとともに、上下両面にチップ部品が
装着された回路基板も同時に加熱リフ口〜できるはんだ
付けを提供するものである。OBJECTS OF THE INVENTION The present invention solves the drawbacks of the conventional art.It is an object of the present invention to temporarily bond chip components to one or both sides of a circuit board using a high-viscosity ultraviolet curing resin or thermosetting resin adhesive (hereinafter referred to as adhesive). This prevents misalignment that occurs during chip component mounting and heating reflow, and lifting of chip component terminals that occurs during heating reflow, and allows circuit boards with chip components mounted on both the top and bottom sides to be heated at the same time. Provides soldering.
発明の構成
本発明は、上記目的を達成するためソルダーペースト溶
融温度以下で乾燥、硬化する接着剤でチップ部品と回路
基板を仮止めして、接着剤層およびソルダーペースト層
を下方または上下両方向から紫外線を照射し、次に上下
両方向から遠赤外線を照射し、次に上下両方向から近赤
外線を照射し、その後強制空冷してはんだ付けするチッ
プ部品の取付は方法であって、はんだ付は電極部の大き
さが不均一で、加熱リフロ一時の熱容量が一定に保たれ
ない場合でもチップ部品の位置づれ、部品端子の浮き上
り、熱ダメージもなく、回路基板の下５ ′＼−・
面に装着しである部品落下もなく、かつ上下両面を同時
に加熱リフローすることができ、高精度で信頼性も高い
連続大量生産のはんだ付けが行えるものである。Structure of the Invention In order to achieve the above object, the present invention temporarily attaches a chip component and a circuit board with an adhesive that dries and hardens at a temperature below the melting temperature of the solder paste, and then attaches the adhesive layer and the solder paste layer from below or both from above and below. The method for attaching chip parts is to irradiate ultraviolet rays, then irradiate far infrared rays from both the top and bottom directions, then irradiate near infrared rays from both top and bottom directions, and then solder them by forced air cooling. Even if the size of the chip is uneven and the heat capacity during heating reflow cannot be kept constant, the chip can be mounted on the bottom 5'\-・ surface of the circuit board without shifting the position of the chip components, lifting the component terminals, or causing thermal damage. This eliminates the problem of falling parts and allows simultaneous heating and reflow of both the upper and lower surfaces, allowing for highly accurate and reliable continuous mass-produced soldering.
実施例の説明 以下に本発明の第１実施例について説明する。Description of examples A first embodiment of the present invention will be described below.
まず第１図に示すように回路基板１の表面に形成された
導体回路２．２′の間に高粘度の接着剤、チップ部品の
電極と回路基板１の導体とを電気的に接続する箇所にソ
ルダーペーストをディスペンサーまたはスクリーン印刷
法によって塗布し、接着剤層４、ソルダーペースト層３
を形成する。次に第２図に示すように接着剤層４とソル
ダーペースト層３上にチップ部品を装着する。次に第３
図に示すように接着剤層４およびソルダーペースト層に
紫外線を照射して、チップ部品５がらはみだしている接
着剤４の表面を硬化させ、次に遠赤外線を照射して接着
剤４を硬化、ソルダーペースト４を予備加熱してソルダ
ペースト４に含まれているフラツクスを乾燥させ、その
次に近赤外線あるいは可視光と近赤外線を照射して、ソ
ルダーペーストを溶融し、その後自然空冷あるいは強制
空冷し、第４図に示すように、回路基板１の導体回路２
．２′にチップ部品６をリフロー法によってはんだ接合
する。このようにしてチップ部品５を回路基板１にはん
だ接合するときにおいて、本発明の方法のもっとも特徴
とするところは、チップ部品５を回路基板１の所定の導
体回路２，２′間に装着する場合、導体回路２，２′間
に紫外線硬化の高粘度の接着剤層４を形成し、チップ部
品６を装着した時、第３図に示すように接着剤層４がチ
ップ部品からはみだすようにさせてから紫外線。First, as shown in FIG. 1, a high viscosity adhesive is applied between the conductor circuits 2 and 2' formed on the surface of the circuit board 1, and a place where the electrodes of the chip components and the conductors of the circuit board 1 are electrically connected. Apply solder paste using a dispenser or screen printing method to form adhesive layer 4 and solder paste layer 3.
form. Next, as shown in FIG. 2, chip components are mounted on the adhesive layer 4 and the solder paste layer 3. Then the third
As shown in the figure, the adhesive layer 4 and the solder paste layer are irradiated with ultraviolet rays to harden the surface of the adhesive 4 where the chip component 5 protrudes, and then far infrared rays are irradiated to harden the adhesive 4. The solder paste 4 is preheated to dry the flux contained in the solder paste 4, then near infrared rays or visible light and near infrared rays are irradiated to melt the solder paste, and then the solder paste is cooled naturally or forcedly. , as shown in FIG. 4, the conductor circuit 2 of the circuit board 1
．． A chip component 6 is soldered to 2' by a reflow method. When the chip component 5 is soldered to the circuit board 1 in this way, the most distinctive feature of the method of the present invention is that the chip component 5 is mounted between predetermined conductor circuits 2 and 2' of the circuit board 1. In this case, a highly viscous adhesive layer 4 cured by ultraviolet rays is formed between the conductor circuits 2 and 2', so that when the chip component 6 is attached, the adhesive layer 4 protrudes from the chip component as shown in FIG. Then UV rays.
遠赤外線を照射して、接着剤層４を硬化させたのち、近
赤外線あるいは可視光線と近赤外線を照射して、チップ
部品６を回路基板１にはんだ接合することにある。以下
本発明の第二の実施例について、図面を参照しながら説
明する。After hardening the adhesive layer 4 by irradiating far infrared rays, the chip component 6 is soldered to the circuit board 1 by irradiating it with near infrared rays or visible light and near infrared rays. A second embodiment of the present invention will be described below with reference to the drawings.
第６図はチップ部品５が上下両面に装着された回路基板
の説明図、第６図は本発明の第二の実施例における加熱
装置７の構成、第７図ははんだ接合した回路基板の説明
図を示すものである。FIG. 6 is an explanatory diagram of a circuit board with chip components 5 mounted on both upper and lower surfaces, FIG. 6 is an illustration of the configuration of a heating device 7 in a second embodiment of the present invention, and FIG. 7 is an explanation of a soldered circuit board. The figure is shown below.
第６図において、１４は基板搬送方向、８は搬送コンベ
ア、９は紫外線ランプ、１０は遠赤外線ヒーター、１１
は近赤外線ランプ、１２は冷却ファンである。以上のよ
うに構成された加熱装置で第５図に示すような上下両面
にチップ部品６が装着された回路基板のはんだ接合につ
いて、以下の動作を説明する。In FIG. 6, 14 is the substrate transport direction, 8 is a transport conveyor, 9 is an ultraviolet lamp, 10 is a far-infrared heater, 11
1 is a near-infrared lamp, and 12 is a cooling fan. The following operation will be described regarding soldering of a circuit board with chip components 6 mounted on both upper and lower surfaces as shown in FIG. 5 using the heating device configured as described above.
まず回路基板５に塗布された接着剤層４とソルダーペー
スト３により仮止めされたチップ部品６を上下両面に装
着された回路基板１は矢印１４の方向に連続的に搬送さ
れる。搬送スピード０．４〜２．０ ｍ／ｍ ｉ ｎ
、このましくは０．６〜１゜２ｒｒｖｍｉｎがよい。搬
送された回路基板５は紫外線ランプ９（以下ＵＶランプ
と記す）このましくはオゾンレスのＵＶランプで、照射
する紫外線は単位長さ当りの電力が８０ Ｗ ／ ｃＩ
ｎ、ランプ電力１〜１ｏＫＷこのましくは１．５〜４．
ＯＫＷがよい。とのＵＶランプ９を搬送コンベア８から
４０〜２００ｃＩｎこのましくは６０〜１２０ｃｒｎの
位置から６〜３０ｓｅｃこのましくは８〜１２ ｓｅｃ
、回路基板１の下側からあるいは上下両方から照射し
、次に上下両方から遠赤外線ヒーター（以下パネルヒー
ターと記す）１ｏで回路基板１の基板表面温度を１ｏｏ
〜１７０℃このましくは１４０〜１６０℃、３０〜１２
０ｓｅｃこのましくは４０〜７０ｓｅｃ維持させるよう
に照射して、接着剤層４を乾燥、硬化させるとともに、
ソルダーペーストのフランクス分をも乾燥させる。この
時に用いるパネルヒーター１０出力１〜２０ＫＷこのま
しくは２〜ａＫＷがよい。First, the circuit board 1 with the chip components 6 temporarily fixed by the adhesive layer 4 applied to the circuit board 5 and the solder paste 3 mounted on both upper and lower surfaces thereof is continuously conveyed in the direction of the arrow 14. Conveying speed 0.4-2.0 m/min
, preferably 0.6 to 1°2rrvmin. The transported circuit board 5 is irradiated with an ultraviolet lamp 9 (hereinafter referred to as UV lamp), preferably an ozone-free UV lamp, and the power per unit length of the ultraviolet light to be irradiated is 80 W/cI.
n, lamp power 1~1oKW preferably 1.5~4.
OKW is good. The UV lamp 9 is moved from the conveyor 8 for 6 to 30 seconds, preferably 8 to 12 seconds from a position of 40 to 200 cIn, preferably 60 to 120 crn.
, irradiate the circuit board 1 from below or from both the top and bottom, and then use a far infrared heater (hereinafter referred to as panel heater) 1o from both the top and bottom to raise the board surface temperature of the circuit board 1 to 1oo.
~170℃ preferably 140~160℃, 30~12
The adhesive layer 4 is dried and cured by irradiating it for 0 seconds, preferably 40 to 70 seconds, and
Also dry the Franks portion of the solder paste. The panel heater 10 used at this time has an output of 1 to 20 KW, preferably 2 to aKW.
その次に上下両方から近赤外線ランプ１１（以下ハロゲ
ンランプと記す）で回路基板１の基板表面温度を１８３
〜２７０℃このましくは１９０〜２４０’Ｃで、かつ基
板表面温度が１９０℃以上を３〜３０ｓｅｃこのましく
は６〜１０１ＨＩｃ維持させるように照射して、ソルダ
ーペーストを溶融させる、この時に用いるハロゲンラン
プ電力は０．６〜１０ＫＷこのましくは１〜４ＫＷがよ
い。その次に冷却ファン１２により回路基板１を強制空
冷して第７図に示すようにチップ部品６と回路基板の９
、−
導体２，２′とをはんだ接合することができる。Next, the board surface temperature of the circuit board 1 was measured at 183°C using a near-infrared lamp 11 (hereinafter referred to as a halogen lamp) from both the upper and lower sides.
The solder paste is melted by irradiating at ~270°C, preferably 190-240'C, and the substrate surface temperature is maintained at 190°C or higher for 3-30 seconds, preferably 6-101 HIc. The halogen lamp power is preferably 0.6 to 10 KW, preferably 1 to 4 KW. Next, the circuit board 1 is forcedly cooled by the cooling fan 12, and as shown in FIG.
, - conductors 2, 2' can be soldered together.
発明の効果
このように本発明では、チップ部品と回路基板と接着剤
で仮止めして、加熱リフローするため、被接合材料のは
んだ付は部分の熱容量を一定に保ち全体が均熱されない
場合で位置づれがなく礼かつ回路基板の上下両面に装着
された被接合材料を同時に加熱リフローすることができ
るため高精度で信頼性の高いハイブリッドＩＣのはんだ
接合を提供するものでありその実用的効果は大なるもの
がある。Effects of the Invention In this way, in the present invention, the chip components and the circuit board are temporarily bonded with adhesive and then heated and reflowed, so the soldering of the materials to be joined is done in the case where the heat capacity of the parts is kept constant and the entire body is not uniformly heated. This method provides high-precision and reliable soldering of hybrid ICs because it is possible to simultaneously heat and reflow the materials to be joined on both the top and bottom surfaces of the circuit board without misalignment, and its practical effects are as follows: There is something big.
第１図から第４図は、本発明にかかる電子部品の取付は
方法の一実施例を説明するだめの工程図、第６図〜第７
図は本発明の他の実施例の工程図である。
１・・・・・・回路基板、２，２′・・・・・・導体回
路、３・・・・・・ソルダーペースト層、４・・・・・
・接着剤層、５・・・・・・チップ状電子部品、６・・
・・・・はんだ、７・・・・・・加熱装置、８・・・・
・・搬送コンベア、９・・・・・・紫外線ランプ、１ｏ
・・・・・・遠赤外線ヒーター、１１・・・・・・近赤
外線ランプ、１２・・・・・・冷却ファン。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名区
区 区
−へ の
憾 絋 鰍
鰍 埋 ペ1 to 4 are process diagrams for explaining one embodiment of the method for mounting electronic components according to the present invention, and FIGS. 6 to 7
The figure is a process diagram of another embodiment of the present invention. 1... Circuit board, 2, 2'... Conductor circuit, 3... Solder paste layer, 4...
・Adhesive layer, 5... Chip-shaped electronic component, 6...
...Solder, 7...Heating device, 8...
...Conveyor, 9...Ultraviolet lamp, 1o
...Far infrared heater, 11...Near infrared lamp, 12...Cooling fan. Name of agent: Patent attorney Toshio Nakao and 1 other person
ward ward ward regret
Claims (2)
続する箇所にソルダーペーストを塗布し、かつチップ状
電子部品を取付ける箇所には紫外線硬化樹脂または熱硬
化樹脂を塗布し、その上にチップ状電子部品を装着させ
たのち、この回路基板を加熱リフローしてチップ状電子
部品の電極部と回路基板の導体部とをはんだ付けする方
法で、前記電子部品をソルダーペーストの溶融点以下の
温度で硬化する紫外線硬化樹脂または熱硬化樹脂でチッ
プ状電子部品がソルダーペースト溶融時に位置ズレしな
いよう仮止めしたのち、ソルダーペーストの溶融温度ま
で加熱リフローし、その後自然空冷あるいは強制空冷し
て、はんだ付けする電子部品の取付け方法。(1) Apply solder paste to the locations where the electrodes of the electronic components and the conductors of the circuit board are electrically connected, and apply ultraviolet curing resin or thermosetting resin to the locations where chip-shaped electronic components are to be installed, and then After attaching a chip-shaped electronic component to the circuit board, the circuit board is heated and reflowed to solder the electrode part of the chip-shaped electronic component and the conductor part of the circuit board. After temporarily fixing the chip-shaped electronic components with ultraviolet curing resin or thermosetting resin that hardens at a temperature of How to install electronic components to be soldered.
法において、従来のものより高粘度の紫外線樹脂または
熱硬化樹脂を使用し、回路基板を連続的に搬送して加熱
室を通過させながら、初め被加熱物の下側または上下両
方から紫外線を照射し、次に上下両方から遠赤外線を照
射し、次に上下両方から近赤外線あるいは可視光線と近
赤外線を照射してソルダーペーストを溶融し、その後自
然空冷あるいは強制空冷して、はんだ付することを特徴
とする電子部品の取付け方法。(2) In the method for attaching electronic components as set forth in claim 1, an ultraviolet resin or a thermosetting resin having a higher viscosity than conventional ones is used, and the circuit board is continuously conveyed and passed through a heating chamber. First, ultraviolet rays are irradiated from the bottom or both the top and bottom of the object to be heated, then far-infrared rays are irradiated from both the top and bottom, and then near-infrared rays or visible light and near-infrared rays are irradiated from both the top and bottom to melt the solder paste. A method for attaching electronic components, which is characterized by cooling the electronic components with natural air or forced air, and then soldering them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59200805A JPS6179293A (en) | 1984-09-26 | 1984-09-26 | Method of mounting electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59200805A JPS6179293A (en) | 1984-09-26 | 1984-09-26 | Method of mounting electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6179293A true JPS6179293A (en) | 1986-04-22 |
Family
ID=16430480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59200805A Pending JPS6179293A (en) | 1984-09-26 | 1984-09-26 | Method of mounting electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6179293A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5607609A (en) * | 1993-10-25 | 1997-03-04 | Fujitsu Ltd. | Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering |
| JP2009260256A (en) * | 2008-01-29 | 2009-11-05 | Kyocera Corp | Thermoelectric module, and method of manufacturing the same |
| JP2016530723A (en) * | 2013-09-03 | 2016-09-29 | チザラ リヒトシステーメ ゲーエムベーハーＺｉｚａｌａ Ｌｉｃｈｔｓｙｓｔｅｍｅ ＧｍｂＨ | Position-stable soldering method |
| US10627568B2 (en) | 2016-12-13 | 2020-04-21 | Minebea Mitsumi Inc. | Planar illumination device and method of manufacturing planar illumination device |
| WO2022113186A1 (en) * | 2020-11-25 | 2022-06-02 | 株式会社Fuji | Electric circuit forming method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59125692A (en) * | 1983-01-06 | 1984-07-20 | 日本電池株式会社 | Bonding and soldering device for electronic part |
-
1984
- 1984-09-26 JP JP59200805A patent/JPS6179293A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59125692A (en) * | 1983-01-06 | 1984-07-20 | 日本電池株式会社 | Bonding and soldering device for electronic part |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5607609A (en) * | 1993-10-25 | 1997-03-04 | Fujitsu Ltd. | Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering |
| US5770835A (en) * | 1993-10-25 | 1998-06-23 | Fujitsu Limited | Process and apparatus and panel heater for soldering electronic components to printed circuit board |
| JP2009260256A (en) * | 2008-01-29 | 2009-11-05 | Kyocera Corp | Thermoelectric module, and method of manufacturing the same |
| JP2016530723A (en) * | 2013-09-03 | 2016-09-29 | チザラ リヒトシステーメ ゲーエムベーハーＺｉｚａｌａ Ｌｉｃｈｔｓｙｓｔｅｍｅ ＧｍｂＨ | Position-stable soldering method |
| JP2019071427A (en) * | 2013-09-03 | 2019-05-09 | ツェットカーヴェー グループ ゲーエムベーハー | Position stable soldering method |
| US10627568B2 (en) | 2016-12-13 | 2020-04-21 | Minebea Mitsumi Inc. | Planar illumination device and method of manufacturing planar illumination device |
| WO2022113186A1 (en) * | 2020-11-25 | 2022-06-02 | 株式会社Fuji | Electric circuit forming method |
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