JPS6253326A - エポキシ樹脂組成物 - Google Patents
エポキシ樹脂組成物Info
- Publication number
- JPS6253326A JPS6253326A JP19161785A JP19161785A JPS6253326A JP S6253326 A JPS6253326 A JP S6253326A JP 19161785 A JP19161785 A JP 19161785A JP 19161785 A JP19161785 A JP 19161785A JP S6253326 A JPS6253326 A JP S6253326A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- ppm
- content
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19161785A JPS6253326A (ja) | 1985-08-30 | 1985-08-30 | エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19161785A JPS6253326A (ja) | 1985-08-30 | 1985-08-30 | エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6253326A true JPS6253326A (ja) | 1987-03-09 |
| JPS6325011B2 JPS6325011B2 (enrdf_load_stackoverflow) | 1988-05-24 |
Family
ID=16277613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19161785A Granted JPS6253326A (ja) | 1985-08-30 | 1985-08-30 | エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6253326A (enrdf_load_stackoverflow) |
-
1985
- 1985-08-30 JP JP19161785A patent/JPS6253326A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6325011B2 (enrdf_load_stackoverflow) | 1988-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2003213081A (ja) | エポキシ樹脂組成物および半導体装置 | |
| JPS6325012B2 (enrdf_load_stackoverflow) | ||
| JP3032528B1 (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JP2626377B2 (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JPH0977958A (ja) | エポキシ樹脂組成物および半導体装置 | |
| JPS6253326A (ja) | エポキシ樹脂組成物 | |
| JPH0733429B2 (ja) | エポキシ樹脂組成物 | |
| JPS5981328A (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JPH1171442A (ja) | 半導体封止用エポキシ樹脂組成物及び半導体装置 | |
| JP2593518B2 (ja) | 半導体封止用エポキシ樹脂成形材料 | |
| JPH11158354A (ja) | 封止用樹脂組成物および樹脂封止型半導体装置 | |
| JPH1171443A (ja) | 半導体封止用エポキシ樹脂組成物及び半導体装置 | |
| JP2576726B2 (ja) | エポキシ樹脂組成物 | |
| JPH03221518A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JP3317473B2 (ja) | エポキシ樹脂組成物 | |
| JPH03177451A (ja) | 封止用樹脂組成物および半導体装置 | |
| JPS6253325A (ja) | エポキシ樹脂組成物 | |
| JP2014156607A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JP2703057B2 (ja) | エポキシ樹脂組成物 | |
| JPH04248830A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JPS63280725A (ja) | 封止用樹脂組成物 | |
| JP3298084B2 (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JPS6259627A (ja) | エポキシ樹脂組成物 | |
| JPS62192423A (ja) | 封止用樹脂組成物 | |
| JP2002167425A (ja) | エポキシ樹脂組成物および半導体封止装置 |