JPS6252476B2 - - Google Patents

Info

Publication number
JPS6252476B2
JPS6252476B2 JP53112786A JP11278678A JPS6252476B2 JP S6252476 B2 JPS6252476 B2 JP S6252476B2 JP 53112786 A JP53112786 A JP 53112786A JP 11278678 A JP11278678 A JP 11278678A JP S6252476 B2 JPS6252476 B2 JP S6252476B2
Authority
JP
Japan
Prior art keywords
main surface
hole
conductivity type
regions
junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53112786A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5539649A (en
Inventor
Toshiaki Goto
Makoto Namekata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP11278678A priority Critical patent/JPS5539649A/ja
Publication of JPS5539649A publication Critical patent/JPS5539649A/ja
Publication of JPS6252476B2 publication Critical patent/JPS6252476B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Integrated Circuits (AREA)
JP11278678A 1978-09-12 1978-09-12 Semiconductor rectifier element Granted JPS5539649A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11278678A JPS5539649A (en) 1978-09-12 1978-09-12 Semiconductor rectifier element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11278678A JPS5539649A (en) 1978-09-12 1978-09-12 Semiconductor rectifier element

Publications (2)

Publication Number Publication Date
JPS5539649A JPS5539649A (en) 1980-03-19
JPS6252476B2 true JPS6252476B2 (enrdf_load_stackoverflow) 1987-11-05

Family

ID=14595465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11278678A Granted JPS5539649A (en) 1978-09-12 1978-09-12 Semiconductor rectifier element

Country Status (1)

Country Link
JP (1) JPS5539649A (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4938317A (enrdf_load_stackoverflow) * 1972-08-21 1974-04-10

Also Published As

Publication number Publication date
JPS5539649A (en) 1980-03-19

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