JPS6249203U - - Google Patents
Info
- Publication number
- JPS6249203U JPS6249203U JP14063685U JP14063685U JPS6249203U JP S6249203 U JPS6249203 U JP S6249203U JP 14063685 U JP14063685 U JP 14063685U JP 14063685 U JP14063685 U JP 14063685U JP S6249203 U JPS6249203 U JP S6249203U
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- lead wire
- fixed resistor
- film fixed
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000007772 electroless plating Methods 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229910052573 porcelain Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
図は、本考案の一実施例の断面図である。
１……電気絶縁性基体、２……ニツケル・銅・
燐の金属皮膜、３……端子、４……耐熱絶縁性筐
体、５……充填材、６……リード線。
燐の金属皮膜、３……端子、４……耐熱絶縁性筐
体、５……充填材、６……リード線。
Claims (1)
- 磁器、ガラス等の電気絶縁性基体の表面に、５
〜３０重量％の銅を含むニツケル・燐からなる金
属皮膜を無電解メツキ法により形成し、前記基体
の両端にリード線付端子を装着した抵抗素子を、
前記リード線を引出した状態で耐熱絶縁性筐体中
に入れ、充填材により封入してなることを特徴と
する金属皮膜固定抵抗器。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14063685U JPS6249203U (ja) | 1985-09-17 | 1985-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14063685U JPS6249203U (ja) | 1985-09-17 | 1985-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6249203U true JPS6249203U (ja) | 1987-03-26 |
Family
ID=31047667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14063685U Pending JPS6249203U (ja) | 1985-09-17 | 1985-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6249203U (ja) |
-
1985
- 1985-09-17 JP JP14063685U patent/JPS6249203U/ja active Pending
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