JPS6246588B2 - - Google Patents

Info

Publication number
JPS6246588B2
JPS6246588B2 JP14508585A JP14508585A JPS6246588B2 JP S6246588 B2 JPS6246588 B2 JP S6246588B2 JP 14508585 A JP14508585 A JP 14508585A JP 14508585 A JP14508585 A JP 14508585A JP S6246588 B2 JPS6246588 B2 JP S6246588B2
Authority
JP
Japan
Prior art keywords
powder
metal
paste
conductive paste
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14508585A
Other languages
English (en)
Japanese (ja)
Other versions
JPS624760A (ja
Inventor
Hirozo Yokoyama
Takehiko Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14508585A priority Critical patent/JPS624760A/ja
Publication of JPS624760A publication Critical patent/JPS624760A/ja
Publication of JPS6246588B2 publication Critical patent/JPS6246588B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
JP14508585A 1985-07-02 1985-07-02 導電体ペ−スト Granted JPS624760A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14508585A JPS624760A (ja) 1985-07-02 1985-07-02 導電体ペ−スト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14508585A JPS624760A (ja) 1985-07-02 1985-07-02 導電体ペ−スト

Publications (2)

Publication Number Publication Date
JPS624760A JPS624760A (ja) 1987-01-10
JPS6246588B2 true JPS6246588B2 (enrdf_load_stackoverflow) 1987-10-02

Family

ID=15377033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14508585A Granted JPS624760A (ja) 1985-07-02 1985-07-02 導電体ペ−スト

Country Status (1)

Country Link
JP (1) JPS624760A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7910026B2 (en) 2006-12-20 2011-03-22 Kyle Brian K Electrical contact enhancing coating

Also Published As

Publication number Publication date
JPS624760A (ja) 1987-01-10

Similar Documents

Publication Publication Date Title
KR960001353B1 (ko) 다층 전자 회로의 제조방법
US5165986A (en) Copper conductive composition for use on aluminum nitride substrate
US6436316B2 (en) Conductive paste and printed wiring board using the same
JP2008181759A (ja) 銅導体ペースト、導体回路板及び電子部品
JPH01192781A (ja) 銅厚膜導体組成物
JPH0653594B2 (ja) 導体組成物
JP2008218022A (ja) 銅導体ペースト、導体回路板及び電子部品
JPS6246588B2 (enrdf_load_stackoverflow)
JPH0346705A (ja) 銅ペースト
JPH0737420A (ja) 導体ペースト組成物及びそれを用いた回路基板
JPH0797447B2 (ja) メタライズ組成物
JP3366479B2 (ja) メタライズ組成物及び配線基板の製造方法
JPS62140304A (ja) 導電性ペ−スト
JP3222296B2 (ja) 導電性インキ
JP2002084051A (ja) 銅メタライズ組成物、低温焼結セラミック配線基板、及びその製造方法
JP3152873B2 (ja) 低温焼成回路基板
JPS58130590A (ja) セラミツク配線基板および該セラミツク配線基板を用いた厚膜ハイブリツドｉｃ
JPS6318356B2 (enrdf_load_stackoverflow)
JP3792271B2 (ja) 低温焼成回路基板
JPS62237605A (ja) 厚膜ペ−スト
JPS62247589A (ja) 厚膜回路の製造方法
JPH0554718B2 (enrdf_load_stackoverflow)
JPS622405A (ja) 厚膜導体組成物
JP2614147B2 (ja) 有機金属導体組成物
JPH0253951B2 (enrdf_load_stackoverflow)