JPS6245820U - - Google Patents
Info
- Publication number
- JPS6245820U JPS6245820U JP13851285U JP13851285U JPS6245820U JP S6245820 U JPS6245820 U JP S6245820U JP 13851285 U JP13851285 U JP 13851285U JP 13851285 U JP13851285 U JP 13851285U JP S6245820 U JPS6245820 U JP S6245820U
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- end surface
- pair
- metallicon
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims 2
- 239000010408 film Substances 0.000 claims 1
- 239000011104 metalized film Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Description
第１図は本考案の一実施例に係わる積層形チツ
プフイルムコンデンサを示す正断面図、第２図〜
第５図は第１図に示すコンデンサの製造過程の一
例を示すもので第２図は母素子を示す斜視図、第
３図は第２図Ａ―Ａ断面図、第４図は一方のメタ
リコン電極面をスライスした後の母素子を示す斜
視図、第５図は第４図Ｂ―Ｂ断面図、第６図は第
１図に示すコンデンサのリードフレームとメタリ
コン分離電極の接続部を示す平面図、第７図は本
考案の他の実施例に係わる母素子を示す断面図、
第８図〜第１１図は従来の参考例に係わる第８図
は母素子を示す斜視図、第９図は第８図Ｃ―Ｃ断
面図、第１０図は積層形チツプフイルムコンデン
サを示す正断面図、第１１図は第１０図に示すコ
ンデンサのリードフレームの接続状態を示す説明
図である。
１，３……容量層、２……絶縁層、４，５……
メタリコン電極、６……母素子、７，８……メタ
リコン分離電極、９……コンデンサ素子、１０…
…リードフレーム、１１……モールド樹脂外装、
１２……折曲げ先端部分、１３……メタリコン共
通電極。
FIG. 1 is a front sectional view showing a multilayer chip film capacitor according to an embodiment of the present invention, and FIGS.
Fig. 5 shows an example of the manufacturing process of the capacitor shown in Fig. 1, Fig. 2 is a perspective view showing the mother element, Fig. 3 is a sectional view taken along A-A in Fig. 2, and Fig. 4 is one of the metal capacitors. A perspective view showing the mother element after slicing the electrode surface, FIG. 5 is a sectional view taken along line BB in FIG. 4, and FIG. 6 is a plane showing the connection between the lead frame of the capacitor shown in FIG. FIG. 7 is a sectional view showing a mother element according to another embodiment of the present invention,
8 to 11 are related to a conventional reference example. FIG. 8 is a perspective view showing a mother element, FIG. 9 is a sectional view taken along line CC in FIG. 8, and FIG. The cross-sectional view, FIG. 11, is an explanatory diagram showing the connection state of the lead frame of the capacitor shown in FIG. 10. 1, 3... Capacitive layer, 2... Insulating layer, 4, 5...
Metallicon electrode, 6... Mother element, 7, 8... Metallicon separation electrode, 9... Capacitor element, 10...
... Lead frame, 11 ... Molded resin exterior,
12...Bended tip portion, 13...Metallicon common electrode.
Claims (1)
形成した母素子を半径方向に切断してなるコンデ
ンサ素子と、該素子を構成する容量層の中間に該
容量層の一端面または両端面より突出した絶縁層
と、前記素子の一端面に形成したメタリコン共通
電極と、前記素子の他端面に形成した前記絶縁層
の突出部によつて分離したメタリコン分離電極と
、該分離電極に接続した一対のリードフレームと
、前記コンデンサ素子を被覆したモールド樹脂外
装とを具備し、前記一対のリードフレームの折曲
先端部分を前記モールド樹脂外装の同一平面に位
置させたことを特徴とする積層形チツプフイルム
コンデンサ。 A capacitor element is formed by cutting a base element formed by winding a pair of metallized films around a large-diameter winding core in the radial direction, and a capacitor layer that constitutes the element is inserted between one end surface or both end surfaces of the capacitor layer. A protruding insulating layer, a metallicon common electrode formed on one end surface of the element, a metallicon separation electrode separated by a protrusion of the insulating layer formed on the other end surface of the element, and a pair connected to the separation electrode. A laminated chip film comprising: a lead frame; and a molded resin exterior covering the capacitor element, wherein the bent end portions of the pair of lead frames are located on the same plane of the molded resin exterior. capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13851285U JPS6245820U (en) | 1985-09-09 | 1985-09-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13851285U JPS6245820U (en) | 1985-09-09 | 1985-09-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6245820U true JPS6245820U (en) | 1987-03-19 |
Family
ID=31043562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13851285U Pending JPS6245820U (en) | 1985-09-09 | 1985-09-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6245820U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4912356A (en) * | 1972-05-15 | 1974-02-02 | ||
| JPS566420A (en) * | 1979-06-25 | 1981-01-23 | American Radionic | Double capacitor and method of manufacturing same |
| JPS5931018A (en) * | 1982-08-16 | 1984-02-18 | ニツセイ電機株式会社 | Method of producing metallized plastic film condenser |
| JPS59127830A (en) * | 1983-01-12 | 1984-07-23 | 松下電器産業株式会社 | Chip film capacitor |
-
1985
- 1985-09-09 JP JP13851285U patent/JPS6245820U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4912356A (en) * | 1972-05-15 | 1974-02-02 | ||
| JPS566420A (en) * | 1979-06-25 | 1981-01-23 | American Radionic | Double capacitor and method of manufacturing same |
| JPS5931018A (en) * | 1982-08-16 | 1984-02-18 | ニツセイ電機株式会社 | Method of producing metallized plastic film condenser |
| JPS59127830A (en) * | 1983-01-12 | 1984-07-23 | 松下電器産業株式会社 | Chip film capacitor |
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