JPH0176004U - - Google Patents
Info
- Publication number
- JPH0176004U JPH0176004U JP1987171262U JP17126287U JPH0176004U JP H0176004 U JPH0176004 U JP H0176004U JP 1987171262 U JP1987171262 U JP 1987171262U JP 17126287 U JP17126287 U JP 17126287U JP H0176004 U JPH0176004 U JP H0176004U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- resistor
- groove
- micromachining
- bridged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- 238000005459 micromachining Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Description
第１図ないし第４図は本考案の一実施例で、第
１図は一例の斜視図、第２図ａは第１図から製造
工程を更に進めたものの斜視図、第２図ｂは等価
回路図、第３図ａ，ｂは他の例、第４図ａ，ｂは
その他の例をそれぞれ示す斜視図、第５図ａは従
来例の平面図、第５図ｂは断面図である。
図中、１は絶縁体基板、２は導体、３は抵抗体
、４は電極、６は溝である。
Figures 1 to 4 show an embodiment of the present invention. Figure 1 is a perspective view of an example, Figure 2a is a perspective view of a product obtained by further advancing the manufacturing process from Figure 1, and Figure 2b is an equivalent view. The circuit diagram, FIGS. 3A and 3B are other examples, FIGS. 4A and 4B are perspective views showing other examples, FIG. 5A is a plan view of the conventional example, and FIG. 5B is a sectional view. . In the figure, 1 is an insulating substrate, 2 is a conductor, 3 is a resistor, 4 is an electrode, and 6 is a groove.
Claims (1)
体を形成し、この導体間に抵抗体を橋架して被着
形成し、この抵抗体及び導体を微細加工により分
割する溝を形成ししかもこの抵抗体及び導体双方
を絶縁保護被膜でコーテイングした複合形チツプ
抵抗器。 A conductor is formed on the opposite end of an insulating substrate in a single chip, a resistor is bridged and adhered between the conductors, and a groove is formed to divide the resistor and conductor by micromachining. A composite chip resistor in which both the conductor and conductor are coated with an insulating protective film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171262U JPH0176004U (en) | 1987-11-11 | 1987-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171262U JPH0176004U (en) | 1987-11-11 | 1987-11-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0176004U true JPH0176004U (en) | 1989-05-23 |
Family
ID=31462939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987171262U Pending JPH0176004U (en) | 1987-11-11 | 1987-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0176004U (en) |
-
1987
- 1987-11-11 JP JP1987171262U patent/JPH0176004U/ja active Pending
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