JPS6245716B2 - - Google Patents

Info

Publication number
JPS6245716B2
JPS6245716B2 JP60110952A JP11095285A JPS6245716B2 JP S6245716 B2 JPS6245716 B2 JP S6245716B2 JP 60110952 A JP60110952 A JP 60110952A JP 11095285 A JP11095285 A JP 11095285A JP S6245716 B2 JPS6245716 B2 JP S6245716B2
Authority
JP
Japan
Prior art keywords
light
substrate
light emitting
emitting diode
diode elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60110952A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6116581A (ja
Inventor
Tsutsumi Hayamizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP60110952A priority Critical patent/JPS6116581A/ja
Publication of JPS6116581A publication Critical patent/JPS6116581A/ja
Publication of JPS6245716B2 publication Critical patent/JPS6245716B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Facsimile Heads (AREA)
  • Led Device Packages (AREA)
JP60110952A 1985-05-23 1985-05-23 半導体発光装置 Granted JPS6116581A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60110952A JPS6116581A (ja) 1985-05-23 1985-05-23 半導体発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60110952A JPS6116581A (ja) 1985-05-23 1985-05-23 半導体発光装置

Publications (2)

Publication Number Publication Date
JPS6116581A JPS6116581A (ja) 1986-01-24
JPS6245716B2 true JPS6245716B2 (US06168776-20010102-C00041.png) 1987-09-28

Family

ID=14548697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60110952A Granted JPS6116581A (ja) 1985-05-23 1985-05-23 半導体発光装置

Country Status (1)

Country Link
JP (1) JPS6116581A (US06168776-20010102-C00041.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3025421B2 (ja) * 1995-06-14 2000-03-27 三菱電機株式会社 制御システムの異常検知装置
JP5294219B2 (ja) * 2010-02-24 2013-09-18 京セラドキュメントソリューションズ株式会社 画像読取装置及びこれを備えた画像形成装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4925893A (US06168776-20010102-C00041.png) * 1972-07-04 1974-03-07
JPS4969294A (US06168776-20010102-C00041.png) * 1972-11-09 1974-07-04
JPS4969293A (US06168776-20010102-C00041.png) * 1972-11-09 1974-07-04
JPS5127097A (ja) * 1974-08-30 1976-03-06 Toyota Motor Co Ltd Hyojisochi
JPS5127098A (ja) * 1974-08-30 1976-03-06 Toyota Motor Co Ltd Hyojisochi
JPS5134697A (ja) * 1974-09-19 1976-03-24 Toyota Motor Co Ltd Hyojisochi
DE2529128A1 (de) * 1975-02-28 1976-09-09 Bowmar Canada Ltd Leuchtdioden-anordnung
JPS51136293A (en) * 1975-05-21 1976-11-25 Oki Electric Ind Co Ltd Wave length converter

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4813936Y1 (US06168776-20010102-C00041.png) * 1969-09-19 1973-04-17
JPS5132379Y2 (US06168776-20010102-C00041.png) * 1972-12-21 1976-08-12
JPS5347948Y2 (US06168776-20010102-C00041.png) * 1973-02-02 1978-11-16
JPS5517512Y2 (US06168776-20010102-C00041.png) * 1973-07-13 1980-04-23
JPS5758653Y2 (US06168776-20010102-C00041.png) * 1974-05-27 1982-12-15

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4925893A (US06168776-20010102-C00041.png) * 1972-07-04 1974-03-07
JPS4969294A (US06168776-20010102-C00041.png) * 1972-11-09 1974-07-04
JPS4969293A (US06168776-20010102-C00041.png) * 1972-11-09 1974-07-04
JPS5127097A (ja) * 1974-08-30 1976-03-06 Toyota Motor Co Ltd Hyojisochi
JPS5127098A (ja) * 1974-08-30 1976-03-06 Toyota Motor Co Ltd Hyojisochi
JPS5134697A (ja) * 1974-09-19 1976-03-24 Toyota Motor Co Ltd Hyojisochi
DE2529128A1 (de) * 1975-02-28 1976-09-09 Bowmar Canada Ltd Leuchtdioden-anordnung
JPS51136293A (en) * 1975-05-21 1976-11-25 Oki Electric Ind Co Ltd Wave length converter

Also Published As

Publication number Publication date
JPS6116581A (ja) 1986-01-24

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