JPS6245698B2 - - Google Patents

Info

Publication number
JPS6245698B2
JPS6245698B2 JP58027201A JP2720183A JPS6245698B2 JP S6245698 B2 JPS6245698 B2 JP S6245698B2 JP 58027201 A JP58027201 A JP 58027201A JP 2720183 A JP2720183 A JP 2720183A JP S6245698 B2 JPS6245698 B2 JP S6245698B2
Authority
JP
Japan
Prior art keywords
dielectric layer
sample
electrode
electrostatic chuck
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58027201A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59152636A (ja
Inventor
Tsutomu Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP2720183A priority Critical patent/JPS59152636A/ja
Publication of JPS59152636A publication Critical patent/JPS59152636A/ja
Publication of JPS6245698B2 publication Critical patent/JPS6245698B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
JP2720183A 1983-02-21 1983-02-21 静電チャック装置の製造方法 Granted JPS59152636A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2720183A JPS59152636A (ja) 1983-02-21 1983-02-21 静電チャック装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2720183A JPS59152636A (ja) 1983-02-21 1983-02-21 静電チャック装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59152636A JPS59152636A (ja) 1984-08-31
JPS6245698B2 true JPS6245698B2 (enrdf_load_stackoverflow) 1987-09-28

Family

ID=12214475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2720183A Granted JPS59152636A (ja) 1983-02-21 1983-02-21 静電チャック装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59152636A (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62286248A (ja) * 1986-06-05 1987-12-12 Toto Ltd 静電チヤツク板及びその製造方法
JPH0727961B2 (ja) * 1986-06-05 1995-03-29 東陶機器株式会社 静電チャック板の製造方法
JP2521471B2 (ja) * 1987-05-14 1996-08-07 富士通株式会社 静電吸着装置
EP0339903B1 (en) * 1988-04-26 1993-10-06 Toto Ltd. Method of making dielectric ceramics for electrostatic chucks
JP2600558Y2 (ja) * 1991-10-02 1999-10-12 住友金属工業株式会社 静電チャック
KR100463782B1 (ko) * 1995-09-20 2005-04-28 가부시끼가이샤 히다치 세이사꾸쇼 정전흡착전극및그제작방법
JP4268450B2 (ja) * 2003-05-23 2009-05-27 キヤノン株式会社 ディスプレー用大型ガラス基板吸着装置
EP3846334B1 (en) * 2019-09-11 2025-02-19 Creative Technology Corporation Attachment/detachment device
CN114641724B (zh) 2019-12-13 2025-05-13 三井化学株式会社 防护膜组件的拆卸方法及防护膜组件的拆卸装置
JP7698590B2 (ja) * 2022-01-19 2025-06-25 日本特殊陶業株式会社 保持装置および保持装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57148356A (en) * 1981-03-09 1982-09-13 Hitachi Ltd Sample holding device

Also Published As

Publication number Publication date
JPS59152636A (ja) 1984-08-31

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