JPS6245115A - Treater - Google Patents

Abstract

PURPOSE:To capture the vapor of a treating liquid volatilized into a working space from a treating tank, and to lower the quantity of the treating liquid dissipated to the outside by positioning the treating tank in a space doubly sealed by an inner shell and an outer shell housing the inner shell. CONSTITUTION:A main body 1 is constituted of an outer shell 2 and an inner shell 3 housed into the outer shell 2, and a treating tank 4 is positioned in the inner shell 3. A photo-resist release liquid 5 (a treating liquid) consisting of a predetermined organic solvent, etc. is stored in the treating tank 4, and supplied properly through a pipe 7 from a tank 6 installed on the bottom of the main body 1. The vapor of the photo-resist release liquid 5 dissipated to the outside from the inside of the inner shell 3 is discharged by an exhaust duct 17 through a space between the inner shell 3 and the outer shell 2, thus preventing a dissipation to the outside of the main body 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to processing techniques, particularly to the use of photoresists applied to wafers in the manufacture of semiconductor devices. This invention relates to a technique that is effective when applied to a technique of peeling using 8 agents.

[Background Art] For example, in the manufacture of semiconductor devices, a predetermined method is used to remove photoresist coated on a wafer.
The wafer is immersed in a photoresist I release agent made of R solvent or the like, and the photoresist adhering to the wafer is dissolved and removed.

Such a device stores a solvent in a predetermined processing tank and performs the removal work by immersing the wafer in the photoresist stripping agent in the processing tank.
Was it vaporized in the work space? A structure may be considered in which the 8-component vapor is directly removed by an exhaust duct provided near the processing tank.

However, since this device has a structure in which the working space is directly exhausted by the exhaust duct, the amount of alkaline solvent that is volatilized from the processing tank into the working space and removed by the exhaust duct is increased, and the amount of the existing solvent is increased. The inventor has found that the disadvantage is that the amount used is increased.

In addition, documents explaining wafer processing technology in the manufacture of semiconductor devices include Kogyo Kenkyukai Co., Ltd.;
Published November 15, 1980, ``Electronic Materials 4 1984 Special Issue, P92-P96.

"Object of the Invention" An object of the present invention is to provide a processing technique that can reduce the loss of the processing liquid used.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

In other words, in a processing apparatus that performs a predetermined treatment by immersing a workpiece in a processing liquid stored in a processing tank, the processing tank is double-layered by at least an inner shell and an outer shell that accommodates the inner shell. By having a structure located in a sealed space, the vapor of the processing liquid volatilized from the processing tank into the work space is reliably captured, reducing the amount of processing liquid dissipated to the outside. This reduces the amount of processing liquid used.

[Example] FIG. 1 is a sectional view of a processing apparatus that is an example of the present invention.

The main body 1 is composed of an outer shell 2 and an inner shell 3 housed inside the outer shell 2, and a processing tank 4 is located inside the inner shell 3.

Furthermore, a photoresist stripping liquid 5 (processing liquid) made of a predetermined organic solvent or the like is stored inside the processing tank 4, and is replenished as needed through a pipe 7 from a tank provided at the bottom of the main body l. has been done.

An rR8 and a door 9 are provided on the side surfaces of the outer shell 2 and the inner shell 3, respectively, so that they can be opened and closed in a direction perpendicular to the plane of the paper.
The inside of the inner shell 3 is sealed and sealed from the outside, and the wafers 11 (to be processed) housed in a predetermined transport jig 10 are transported to the inside of the processing tank 4 located inside the inner shell 3. The device is configured to perform insertion and removal operations (objects).

A window portion 12 is provided on the upper wall surface of the inner shell 3, and a lighting lamp 13 is provided.
The inside of the inner shell 3 is illuminated by.

Further, a cooling vibe 14 through which a fluid at a predetermined temperature flows is wound around the outer periphery of the inner shell 3 so that the wall surface of the inner shell 3 is cooled to a predetermined temperature. The vapor of the photoresist stripping agent 5 dispersed from the processing tank 5 into the internal space is condensed on the cooled wall surface and collected in the trap section 15 provided at the bottom of the inner shell 3.

A collection bin 16 is located below the trap section 15, and the photoresist stripping agent 5 collected and accumulated in the trap section 15 is stored in the collection bin 16 as appropriate.

Furthermore, the outer shell 2 is provided with an exhaust duct 17, and the outer shell 2
The structure is such that the space between the inner shell 3 and the inner shell 3 is evacuated.

In addition, a tank 6 and a collection bin 1 are provided at the bottom of the main body 1.
An exhaust duct 18 is provided in the space where 6 is located.

The operation of this embodiment will be explained below.

First, a photoresist stripper 5 at a predetermined temperature is stored inside the processing tank 4, a fluid at a predetermined temperature is passed through the cooling vibe 14, and the exhaust duct 1
7 and 18 are started.

Next, 738 of the outer shell 2 and the door 9 of the inner shell 3 are opened,
A wafer 11, which is housed in a transport jig 10 and has a photoresist attached to its surface, is transported from the outside of the main body 1 to the inside of the inner shell 3 by a predetermined transport mechanism (not shown).
The doors 8 and 9 are immersed in the photoresist stripping agent 5 stored inside the processing tank 4 housed inside.
is closed, and the inner shell 3 and outer shell 2 are brought into a sealed state.

Then, the photoresist attached to the surface of the wafer 11 immersed in the photoresist stripping agent 5 inside the processing bath 4 is dissolved and removed by the photoresist stripping agent 5.

In this case, the processing tank 4 is isolated from the outside space by a sealed inner shell 3 and an outer shell 2 that accommodates the inner shell 3, and the photoresist evaporated from the processing tank 4 into the inner space of the inner shell 3 is removed. The vapor of the agent 5 is reliably captured, condensed on the wall surface of the inner shell 3 which is cooled to a predetermined temperature by a cooling pipe provided on the outer periphery of the inner shell 3, and collected in the trap section 15. The space between the shell 3 and the outer shell 2 is configured to be exhausted by an exhaust duct 17, and the structure is such that the cloud surrounding air in the space where the processing tank 4 is located is not directly exhausted to the outside.

Therefore, the loss of the photoresist stripping agent 5 that is removed from the processing tank 4 is reduced, and the photoresist stripping agent 5 required for the process of stripping the photoresist attached to the wafer 11 is reduced.
usage will be reduced.

As a result, the productivity of peeling off the photoresist attached to the wafer 11 is improved.

Further, the vapor of the photoresist stripping agent 5 that is lost from the inside of the inner shell 3 to the outside by opening and closing the doors 8 and 9 provided on the outer shell 2 and the inner shell 3, respectively, is transferred to the inner shell 3 and the outer shell 2. is excluded by an exhaust duct 17 through a space between,
Since the vapor of the photoresist stripping agent 5 is prevented from being dissipated to the outside of the main body 1, a risk such as a fire occurring due to the vapor of the photoresist stripping agent 5 being dissipated to the outside of the main body 1 is prevented.

After a predetermined period of time has elapsed, the wafer 11 from which the attached photoresist etc. have been removed is transferred to the inner shell 3 at 5t along with the transport jig 10.
19 and the door 8 of the outer shell 2 to the outside of the main body 1.

By repeating the above series of operations, the photoresist stripping process for a large number of wafers 11 can be performed efficiently and safely.

〔effect〕

(1) A processing device that performs a predetermined treatment by immersing an object to be processed in a processing liquid stored in a processing tank.The processing tank is double sealed by an inner shell and an outer shell that accommodates the inner shell. Since the structure is located in the space where the processing liquid is vaporized from the processing tank into the working space, it is possible to reliably capture the vapor of the processing liquid that is evaporated into the working space, reducing the amount of processing liquid that is lost to the outside. The amount of processing liquid used can be reduced.

(2) As a result of (1) above, the danger of fire caused by the vapor of the processing liquid volatilized from the processing tank and lost to the outside is avoided, and the work can be carried out safely.

(3) A cooling pipe through which fluid at a predetermined temperature flows is wound around the outer circumference of the inner shell, and the wall surface of the inner shell is cooled to a predetermined temperature. The vapor of the processing liquid volatilized inside can be condensed and reliably recovered.

(4) As a result of the above (1) to (3), the productivity in processing is improved.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the treatment is not limited to photoresist stripping treatment on the wafer, but may also be drying treatment or the like.

[Field of Application] In the above explanation, the invention made by the present inventor was mainly applied to the field of application which is the background of the invention, which is the photoresist stripping process of wafers. It can be widely applied to technologies that use processing liquids.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a processing apparatus that is an embodiment of the present invention. l...Main body, 2...Outer shell, 3...Inner shell, 4...
Processing tank, 5... Photoresist stripping agent (processing?&),
6...tank, 7...pipe, 8.9...door, l
O...Transportation jig, 11...Wafer, 12...Window,
13...Lighting light, 14...Cooling pipe, 15...
Trap section, 16... Collection bin, 17.18... Exhaust duct.

Claims (1)

[Scope of Claims] 1. A processing device that performs a predetermined treatment by immersing an object to be processed in a processing liquid stored in a processing tank, the processing tank containing an inner shell and the inner shell. A processing device characterized in that it is located in a space that is doubly sealed by an outer shell. 2. The processing apparatus according to claim 1, wherein a cooling pipe through which a fluid at a predetermined temperature flows is wound around the outer circumference of the inner shell. 3. The processing apparatus according to claim 1, wherein the object to be processed is a wafer. 4. The processing apparatus according to claim 1, wherein the processing liquid is a photoresist stripping agent.