JPS6244851B2 - - Google Patents

Info

Publication number
JPS6244851B2
JPS6244851B2 JP56149098A JP14909881A JPS6244851B2 JP S6244851 B2 JPS6244851 B2 JP S6244851B2 JP 56149098 A JP56149098 A JP 56149098A JP 14909881 A JP14909881 A JP 14909881A JP S6244851 B2 JPS6244851 B2 JP S6244851B2
Authority
JP
Japan
Prior art keywords
resin
lsi chip
substrate
bump
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56149098A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5848947A (ja
Inventor
Yoshio Okajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP56149098A priority Critical patent/JPS5848947A/ja
Publication of JPS5848947A publication Critical patent/JPS5848947A/ja
Publication of JPS6244851B2 publication Critical patent/JPS6244851B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP56149098A 1981-09-18 1981-09-18 半導体装置の製法 Granted JPS5848947A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56149098A JPS5848947A (ja) 1981-09-18 1981-09-18 半導体装置の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56149098A JPS5848947A (ja) 1981-09-18 1981-09-18 半導体装置の製法

Publications (2)

Publication Number Publication Date
JPS5848947A JPS5848947A (ja) 1983-03-23
JPS6244851B2 true JPS6244851B2 (es) 1987-09-22

Family

ID=15467647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56149098A Granted JPS5848947A (ja) 1981-09-18 1981-09-18 半導体装置の製法

Country Status (1)

Country Link
JP (1) JPS5848947A (es)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2618249B2 (ja) * 1987-12-18 1997-06-11 三菱樹脂株式会社 Ｓｍｃ材の皮剥裁断装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02189926A (ja) * 1989-01-18 1990-07-25 Nec Corp 半導体集積回路装置
US5139969A (en) * 1990-05-30 1992-08-18 Mitsubishi Denki Kabushiki Kaisha Method of making resin molded semiconductor device
JPH0547958A (ja) * 1991-08-12 1993-02-26 Mitsubishi Electric Corp 樹脂封止型半導体装置
US6168972B1 (en) 1998-12-22 2001-01-02 Fujitsu Limited Flip chip pre-assembly underfill process

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5361277A (en) * 1976-11-15 1978-06-01 Hitachi Ltd Semiconductor element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5361277A (en) * 1976-11-15 1978-06-01 Hitachi Ltd Semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2618249B2 (ja) * 1987-12-18 1997-06-11 三菱樹脂株式会社 Ｓｍｃ材の皮剥裁断装置

Also Published As

Publication number Publication date
JPS5848947A (ja) 1983-03-23

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