JPS6244536Y2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to the improvement of a ceramic package for mounting semiconductor devices, particularly devices such as LSI and VLSI, which have a large number of conductor wiring lines. The conductor wiring is placed inside the groove, and the conductor wiring is placed at the same position opposite to the insulating wall covering the groove, and the two are aligned.The cross-sectional area of the conductive wiring is increased to increase the conductive resistance value. The present invention relates to a ceramic package for mounting a semiconductor element, which has a structure that prevents short circuits between wiring lines.

Semiconductor elements have changed from IC to LSI due to demands for smaller size, lighter weight, higher speed, higher density, and higher reliability in electronic equipment.
This has led to the development of ultra-LSI and ultra-VLSI, and as a result, ceramic packages for mounting elements have become multi-layered and densely interconnected, creating various problems in terms of manufacturing and performance.

Figure 1 shows a conventional ceramic package for mounting semiconductor elements, where Figure A is a plan view and Figure B is a line F-
It is an enlarged half-sectional view taken from F′.

There is a recess 2 in the center of the ceramic package 1 (hereinafter abbreviated as "package") in which a semiconductor element is mounted and housed, and a large number of conductor wiring lines 3 extend radially from the edge of the recess 2 toward the outer end. An insulating wall 5 is formed on the upper surface of the insulating wall 5, leaving only a small portion of the conductor wiring at the edge of the recess, and the lead 4 is welded to the outer end side surface of the conductor wiring. The above-mentioned method of forming multiple radial conductor wirings involves printing a paste of metal powder on the surface of a raw ceramic sheet and mounding it up in a convex shape, which becomes the insulating wall 5. When raw sheets are crimped, the line width expands, albeit slightly. In addition, when forming and sintering high-density wiring, the distance between each wiring becomes close, increasing the probability of short circuits.
There was a risk that each wire would come into contact with the adjacent wire at the locations where the wires were pressed together with the insulating wall. In addition, because the cross-sectional area of the wiring is small, electrical loss occurs due to the generation of Joule heat, which ultimately leads to a fatal disconnection.

The present invention has been developed to solve the above-mentioned drawbacks, and its gist is to provide multi-strip radial conductor wiring with grooves of depth a in at least a portion of the multi-strip radial conductor wiring on the ceramic surface. Inside the concave groove is a
A conductor wiring 13a with a smaller thickness b is placed, and a conductor wiring 13b with a thickness equal to or slightly larger than the thickness a-b is placed at the same position facing the insulating wall 15a covering the conductor wiring 13a, so that the two match and are insulated. It is characterized by being made of interlayered conductor wires 13a and the opposing conductor wires 13b are press-fitted into the gap between the conductor wires 13a inside the groove and are integrally constructed.

In the present invention, since the conductor wiring is formed in the recess as described above, the thickness of the wiring can be formed thicker, lowering the conductive resistance value, and eliminating the risk of each wiring coming into contact with the adjacent wire. , and the occurrence of short circuits could be eliminated.

Hereinafter, the package plan view shown in FIG. 2A, which is an embodiment of the present invention, FIG.
This will be explained using figures.

In the center of the package 11 in the figure, there is a recess 12 in which a semiconductor element is mounted, and a large number of conductor wiring lines are formed radially from the edge of the recess 12 toward the outer end. Each of these conductor wirings is made by pressing a raw ceramic sheet with a mold with multiple radial convex parts to form a groove, and then applying a paste of metal W powder inside the groove, using a printing method. The groove was formed by printing, and the depth of the groove was 70 μm, and the printed wiring was formed on the bottom of the recess with a thickness of 50 μm. In addition, a wiring with a thickness of 25 μm was printed on the lower surface of the sheet covering the sheet at the same position facing the recess, and the two were matched and pressed together. After cutting, the resin was removed and sintered. This is shown in Figure C, where 15b is a layer in which wiring is formed on the inner bottom surface of the recess, and 15a is a layer in which wiring is formed on the lower surface of the layer and is in a state of matching coverage.

As mentioned above, in this embodiment, the shape of the cross section of the groove is rectangular, but the present invention is not limited to this, and the bottom may be made into an arc, U-shape, V-shape, etc., and conductor wiring can also be printed. Instead of printing wiring using the silk screen method, a press-fitting method may be used. Furthermore, the wiring pattern is not limited to a radial pattern, and includes all wiring patterns directed outward from the center.

This invention allows conductor wiring to be formed in thick dimensions, does not protrude from the inside of the groove to the outside, and almost eliminates short circuits and disconnections, making it suitable for high-density wiring packages and other laminated substrates. be.

[Brief explanation of the drawing]

Figure 1 shows a conventional ceramic package.
Figure A is a plan view, Figure B is an enlarged half-sectional view taken from line F-F', Figure 2 is an embodiment of the present invention, Figure A is a plan view, and Figure B is an enlarged view taken from line K-K'. Half section view, C
The figure is a partially enlarged cross-sectional view taken along line GG'. 1, 11...Ceramic package, 2, 12
...Element mounting recess, 3, 13a, 13b... Conductor wiring, 4, 14... Lead, 5, 15a... Insulating wall.

Claims (1)

[Scope of utility model registration request] In a ceramic package in which conductor wiring is arranged in multiple radial lines from the edge of an element mounting recess toward the outer end of a package for mounting a semiconductor element, at least a portion of the multiple radial conductor wiring is arranged in a multiple radial manner on the surface of the ceramic. A groove with a depth a of 1. A ceramic package for mounting a semiconductor element, characterized in that the two conductors are wired and matched with each other with an insulating layer interposed therebetween.